Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.

Abstract: Systems and methods described herein include receiving, from a first network function, a request to receive a notification when a second network function becomes available after a failure. A status update may be received from the second network function indicating that the second network function is available. It may be determined that the second network function is in a stable state. A notification may be sent, to the first network function, that the second network function is available along with an indication of a time period in which to switch from accessing a third network function to accessing the second network function.

Abstract: An embodiment method includes: forming fins extending from a semiconductor substrate; depositing an inter-layer dielectric (ILD) layer on the fins; forming masking layers on the ILD layer; forming a cut mask on the masking layers, the cut mask including a first dielectric material, the cut mask having first openings exposing the masking layers, each of the first openings surrounded on all sides by the first dielectric material; forming a line mask on the cut mask and in the first openings, the line mask having slot openings, the slot openings exposing portions of the cut mask and portions of the masking layers, the slot openings being strips extending perpendicular to the fins; patterning the masking layers by etching the portions of the masking layers exposed by the first openings and the slot openings; and etching contact openings in the ILD layer using the patterned masking layers as an etching mask.

Abstract: A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip, a ring-shaped wall, and a light-permeable layer. The substrate has a first surface and a second surface that is opposite to the first surface. The first surface of the substrate has a chip-bonding region and a connection region that surrounds the chip-bonding region, and the substrate has a plurality of protrusions arranged in the connection region. The sensor chip is disposed on the chip-bonding region of the substrate and is electrically coupled to the substrate. The ring-shaped wall is formed on the connection region of the substrate, and the protrusions of the substrate are embedded in and gaplessly connected to the ring-shaped wall. The light-permeable layer is disposed on the ring-shaped wall, and the light-permeable layer, the ring-shaped wall, and the substrate jointly define an enclosed space therein.

Abstract: A firearm launcher for holding a projectile includes a launcher body attached to a firearm barrel; and a tension member cooperated with the launcher body. In one embodiment, the tension member is connected with the projectile.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer being ring-shaped and disposed on an inner surface of the light-permeable layer, and a package body that is formed on the substrate. A projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds a sensing region of the sensor chip. A portion of the shielding layer in contact with the light-curing layer defines a ring-shaped arrangement region that has at last one light-permeable slot. The sensor chip, the light-curing layer, the light-permeable layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer.

Abstract: A method includes forming a first dielectric layer on a first wafer, and forming a first bond pad penetrating through the first dielectric layer. The first wafer includes a first semiconductor substrate, and the first bond pad is in contact with a first surface of the first semiconductor substrate. The method further includes forming a second dielectric layer on a second wafer and forming a second bond pad extending into the second dielectric layer. The second wafer includes a second semiconductor substrate. The first wafer is sawed into a plurality of dies, with the first bond pad being in a first die in the plurality of dies. The first bond pad is bonded to the second bond pad.

Abstract: A method of operating an anti-lock braking system (ABS) of a bicycle comprising steps of: judging whether a power of a battery meets a set value; judging a moved angular position of a brake lever; outputting electric currents to operate the ABS; and judging whether a running speed of the bicycle is zero. When the power meets the set value, the ABS is turned on, and when the power of the battery is low, the ABS is not turned on. After the brake lever is pressed, the control unit judges whether the moved angular position of the brake lever reaches a set position. When the moved angular position does not reach the set position, the ABS is not turned on. When the moved angular angle reaches the set position, the ABS is turned on. The control unit outputs the electric currents to turn on the ABS, thus braking the bicycle.

Abstract: A semiconductor structure includes a first die, second dies coupled to and on the first die, a dielectric layer on the first die and covering each second die, and through dielectric vias (TDVs) coupled to and on the first die. The first die includes a bonding dielectric layer and bonding features embedded in and leveled with the bonding dielectric layer. An array of second dies is arranged in a first region of the first die. Each second die includes a bonding dielectric layer and a bonding feature embedded in and leveled with the bonding dielectric layer. The bonding dielectric layer and the bonding feature of each second die are respectively bonded to those of the first die. The TDVs are laterally covered by the dielectric layer in a second region of the first die which is connected to the first region and arranged along a periphery of the first die.

Abstract: A system described herein may provide a technique for a selection of an Interworking Function (“IWF”) that facilitates an interworking between a licensed wireless network and another wireless network, such as an unlicensed wireless network, based on a geographical location of a User Equipment (“UE”) that is connected to the licensed wireless network and the other wireless network. The IWF may be selected from a set of candidate IWFs based on respective locations of the candidate IWFs and the UE and/or a wireless access point associated with the other wireless network. The IWF may communicate with the UE, via the other wireless network, using one or more tunnels. The IWF may identify control plane and user plane traffic received via the tunnel(s), and may forward such communications to appropriate network devices of the licensed wireless network.

Abstract: A method of forming a semiconductor device structure is provided. The method includes forming an insulating layer over a semiconductor substrate including a conductive feature, forming an insulating layer with a trench over the semiconductor substrate to expose the conductive feature, and forming a sacrificial liner layer over two opposite sidewalls and a bottom of the trench. Ions are implanted into the conductive feature covered by the sacrificial liner layer, so that a doping region is formed in the conductive feature and has two opposite side edges respectively separated from the two opposite sidewalls of the trench. The sacrificial liner layer is removed after forming the doping region, and a conductive connecting structure is formed in the trench. The two opposite sidewalls of the conductive connecting structure are respectively separated from the two corresponding opposite sidewalls of the trench by an air spacer.

Abstract: A firearm muzzle attachment mechanism includes a muzzle device; a tapering adapter having an outer tapering end configured to connect with the muzzle device; a hollow adapter having an internally threaded portion and configured to receive the muzzle device; a muzzle attachment having an inner tapering end configured to connect with the outer tapering end of the tapering adapter; and a means for providing tension being received in a receiving slot formed on the muzzle attachment.

Abstract: A height-adjustable optics mount includes a lower base attachable to the firearm including an angled platform having a plurality of male guiding teeth and located on the lower base; and an upper base which is operable between a slidable position where the upper base is sliding along the plurality of the male guiding teeth and a static position where the upper base is affixed on at least one of the plurality of male guiding teeth.

Abstract: An image processing device includes a three-dimensional noise reduction (3D NR) circuit, an artificial intelligence noise reduction (AI NR) circuit, a weight determination circuit and an image blending circuit. The 3D NR circuit performs a 3D NR operation on input image data to generate first image data. The AI NR circuit performs an AI NR operation on the input image data to generate second image data. The weight determination circuit outputs a blending weight according to a motion index. The image blending circuit blends the first image data and the second image data according to the blending weight to generate output image data.

Abstract: A method of operating an anti-lock braking system (ABS) of a bicycle comprising steps of: judging whether a power of a battery meets a set value; judging a moved angular position of a brake lever; outputting electric currents to operate the ABS; and judging whether a running speed of the bicycle is zero. When the power meets the set value, the ABS is turned on, and when the power of the battery is low, the ABS is not turned on. After the brake lever is pressed, the control unit judges whether the moved angular position of the brake lever reaches a set position. When the moved angular position does not reach the set position, the ABS is not turned on. When the moved angular angle reaches the set position, the ABS is turned on. The control unit outputs the electric currents to turn on the ABS, thus braking the bicycle.

Abstract: A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.

Abstract: A hub structure having an anti-lock braking system contains: a hub assembly and an anti-locking assembly. The hub assembly is located on a center of a wheel and includes a holder and a connection shaft. The anti-locking assembly is received in the holder and is fitted on the connection shaft, and the anti-locking assembly includes an anti-lock seat received in the holder and fitted on the connection shaft to rotate with the holder simultaneously, multiple eddy current elements arranged on two sides of the anti-lock seat and two ends of the connection shaft. A predetermined distance is defined between any two adjacent eddy current elements, and a respective eddy current element has at least one electromagnetic induction portion, when two corresponding electromagnetic induction portions are electrically conducted, a current magnetic field produces so that the anti-lock seat produces reverse currents to stop rotation.

Abstract: A brake handle structure for a bicycle contains: at least one body, at least one rotatory arm, at least one brake lever, at least one angle signal sensor, and at least one power failure sensor. The at least one body includes a connection portion, an extension, and an engagement portion. The at least one rotatory arm includes a pulling segment, a coupling orifice, and a receiving orifice. The at least one brake lever includes a fixing segment connected with at least one electromagnetic clutch which includes a bolt attracted electromagnetically by the at least one electromagnetic clutch after conducting a power, and a defining orifice is defined adjacent to the at least one electromagnetic clutch. The at least one angle signal sensor is configured to sense and send a rotating angle of the rotatable column. The at least one power failure sensor has a movable sensing head.