Abstract: An optoelectronic device includes a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second semiconductor layer; a first insulating layer on the second semiconductor layer and including a plurality of first openings exposing the first semiconductor layer, wherein the first openings include a first group and a second group; a third electrode on the first insulating layer and including a first extended portion and a second extended portion, wherein the first extended portion and the second extended portion are respectively electrically connected to the first semiconductor layer through the first group of the first openings and the second group of the first openings, and wherein the number of the first group of the first openings is different from the number of the second group of the first openings; and a plurality of fourth electrodes on the second insulating layer and electrically connected to the second semiconductor layer, wherein in a

Abstract: An information handling system camera captures visual images of light directed by a lens towards an image sensor. The camera has an active illumination privacy shutter that disables the image sensor from capturing visual images by introducing illumination between the lens and image sensor, such as with a red light emitting diode that is seen as a red dot at the lens when viewed from in front of the camera. In one embodiment, the illumination is directed towards a light diffuser, such as a sheet of acrylic, that extends between the lens and image sensor when the camera is commanded to a privacy mode.

Abstract: An information handling system camera detects ambient light and applies ambient light brightness to determine whether to color correct a captured image with ambient color temperature or a color temperature associated with a display. For example, a first RGB ambient light sensor detects ambient light from the camera field of view. When the ambient light is below a predetermined brightness, the camera image sensor processor (ISP) applies color temperature of a second RGB ambient light sensor directed at a display to perform color correction. For instance, with camera that mounts on a display top side, the second RGB ambient light sensor is disposed at the bottom of the camera and directed at the display.

Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. An nth reset scan signal of the plurality of reset scan signals is started behind an nth readout scan signal of the plurality of readout scan signals in time domain.

Abstract: An imaging device includes an image sensor, a lens assembly, a temperature sensor, and a processor. The lens assembly includes a lens whose distance from the image sensor is adjustable from a minimum stroke distance to a maximum stroke distance. The temperature sensor determines a temperature of the imaging device. The processor instantiates auto focus tables that are each correlated to a temperature, receives at temperature from the temperature sensor, selects an auto focus table associated with the temperature, and provides an auto focus for the object based upon the auto focus table. Each auto focus table provides a temperature compensated correlation of a first stroke distance associated with the object at the maximum distance from the imaging device, and a second stroke distance associated with the object at the minimum distance from the imaging device.

Abstract: A light-emitting device comprises a substrate comprising a top surface and a sidewall; a semiconductor stack formed on the top surface of the substrate comprising a first semiconductor layer, an active layer and a second semiconductor layer; a dicing street surrounding the semiconductor stack and exposing the top surface of the substrate; a protective layer covering the semiconductor stack and the dicing street; a reflective layer comprising a Distributed Bragg Reflector structure and covering the protective layer; and a cap layer covering the reflective layer, wherein the reflective layer comprises an uneven portion adjacent to the sidewall of the substrate, and the uneven portion comprises an uneven thickness.

Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: An electronic device may have a display with an array of inorganic light-emitting diodes. The array of inorganic light-emitting diodes may be overlapped by a polarizer layer such as a circular polarizer. Alternatively, the display may be a polarizer-free display without any polarizer layer over the array of inorganic light-emitting diodes. Each inorganic light-emitting diode may be surrounded by a diffuser that redirects edge-emissions towards a viewer. A top diffuser, a color filter layer, a microlens, and/or a microlens with color filtering and/or diffusive properties may also optionally overlap each inorganic light-emitting diode. The inorganic light-emitting diodes may have reflective sidewalls to mitigate edge-emissions. In this type of arrangement, the array of inorganic light-emitting diodes may be coplanar with one or more opaque masking layers. To mitigate reflections, the display may include two opaque masking layers having differing properties or a single phase separated opaque masking layer.

Abstract: An electronic device may have a display with an array of inorganic light-emitting diodes. The array of inorganic light-emitting diodes may be overlapped by a polarizer layer such as a circular polarizer. Alternatively, the display may be a polarizer-free display without any polarizer layer over the array of inorganic light-emitting diodes. Each inorganic light-emitting diode may be surrounded by a diffuser that redirects edge-emissions towards a viewer. A top diffuser, a color filter layer, a microlens, and/or a microlens with color filtering and/or diffusive properties may also optionally overlap each inorganic light-emitting diode. The inorganic light-emitting diodes may have reflective sidewalls to mitigate edge-emissions. In this type of arrangement, the array of inorganic light-emitting diodes may be coplanar with one or more opaque masking layers. To mitigate reflections, the display may include two opaque masking layers having differing properties or a single phase separated opaque masking layer.

Abstract: A distributed computing system uses dynamically calculates a subset size for each of a plurality of load balancers. Each of a plurality of load balancers logs requests from client devices for connections to back-end servers and periodically sends a request report to a traffic aggregator, which aggregates the report requests from the load balancers in the corresponding zone. Each traffic aggregator sends the aggregated request data to a traffic controller, which aggregates the request data to determine a total number of requests received at the system. The total request data is transmitted through each traffic aggregator to each load balancer instance, which calculates a percentage of the total number of requests produced by the load balancer and determines a subset size based on the calculated percentage.

Abstract: A light-emitting device comprises a substrate comprising a top surface and a sidewall; a semiconductor stack formed on the top surface of the substrate comprising a first semiconductor layer, an active layer and a second semiconductor layer; a dicing street surrounding the semiconductor stack and exposing the top surface of the substrate; a protective layer covering the semiconductor stack and the dicing street; a reflective layer comprising a Distributed Bragg Reflector structure and covering the protective layer; and a cap layer covering the reflective layer, wherein the reflective layer comprises an uneven portion adjacent to the sidewall of the substrate, and the uneven portion comprises an uneven thickness.

Abstract: A process diagnosis system includes a digital twin calculation unit, a process diagnosis calculation unit, and a remote calculation analysis unit. The digital twin calculation unit obtains a vibration-related parameter and a cutting-related parameter of a processing device, and performs a simulation calculation for the vibration-related parameter, the cutting-related parameter and a three-dimensional model corresponding to the processing device to generate a three-dimensional calculation result. The process diagnosis calculation unit receives a three-dimensional calculation result and displays the three-dimensional calculation result. The remote calculation analysis unit receives the three-dimensional calculation result, and performs a simulation analysis for the three-dimensional calculation result to generate an analysis result.

Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: An electronic device includes a substrate, a plurality of first pads, a plurality of sensing units and a plurality of test pads. The first pads are disposed on the substrate, the sensing units are disposed on the substrate and electrically connected to the first pads, and the test pads are disposed on the substrate and electrically connected to the sensing units.

Abstract: A distributed computing system uses dynamically calculates a subset size for each of a plurality of load balancers. Each of a plurality of load balancers logs requests from client devices for connections to back-end servers and periodically sends a request report to a traffic aggregator, which aggregates the report requests from the load balancers in the corresponding zone. Each traffic aggregator sends the aggregated request data to a traffic controller, which aggregates the request data to determine a total number of requests received at the system. The total request data is transmitted through each traffic aggregator to each load balancer instance, which calculates a percentage of the total number of requests produced by the load balancer and determines a subset size based on the calculated percentage.

Abstract: A dodge method of machining path and a machining system is provided. By inserting a flag into an original machining path, an interference between the flag and a suction cup of a support unit is determined. A coding instruction is inserted at the interference to edit the original machining path, thereby generating an edited machining path. Therefore, when a machining equipment executes the edited machining path, the support unit may smoothly dodge a knife of the machining equipment.

Abstract: Provided is a medical image analyzing system and a method thereof, which includes: acquiring a processed image having a segmentation label corresponding to a cancerous part of an organ (if present), generating a plurality of image patches therefrom, performing feature analysis on the image patches and model training to obtain prediction values, drawing a receiver operating characteristic curve using the prediction values, and determining a threshold with which determines whether the image patches are cancerous, so as to effectively improve the detection rate of, for example, pancreatic cancer.

Abstract: A system for acceleration adjustment of machine tool at rapid traverse includes a signal measurement module, a signal judgment module and an acceleration optimization module. The machine tool has a servo motor and a working platform. The signal measurement module measures signals while the servo motor drives the working platform from a first specific position to a second specific position, or from the second specific position back to the first specific position. The signal judgment module judges whether the actual maximum current value of the motor is equal to the manufacturer's specification according to the signals; and if negative, the acceleration optimization module calculates and optimizes an axial acceleration till an optimal value is achieved. Then, a curve smoothing time of the optimal acceleration is calculated and optimized by the acceleration optimization module. In addition, a method for acceleration adjustment of machine tool at rapid traverse is provided.

Abstract: A process diagnosis system includes a digital twin calculation unit, a process diagnosis calculation unit, and a remote calculation analysis unit. The digital twin calculation unit obtains a vibration-related parameter and a cutting-related parameter of a processing device, and performs a simulation calculation for the vibration-related parameter, the cutting-related parameter and a three-dimensional model corresponding to the processing device to generate a three-dimensional calculation result. The process diagnosis calculation unit receives a three-dimensional calculation result and displays the three-dimensional calculation result. The remote calculation analysis unit receives the three-dimensional calculation result, and performs a simulation analysis for the three-dimensional calculation result to generate an analysis result.

Abstract: A method for analyzing an overcutting defect of a machining process comprises steps as following. A machining code is executed to generate a cutting face, wherein the cutting face comprises a plurality of machining paths. A specified machining path is defined from the plurality of machining paths and a specified node is set on the specified machining path. A sectional plane passing through the specified node is calculated. A plurality of intersection points between the sectional plane and the other machining paths which are different from the specified machining path are obtained. A first adjacent intersection point a second adjacent intersection point are specified from the intersection points. A connection line located between the first adjacent intersection point and the second adjacent intersection point is obtained. A distance between the specified node and connection line is calculate and the distance is defined as an overcutting amount of the specified node.