Abstract: An electronic device and an antenna feeding device are provided. The electronic device includes a metal housing, a radiation element, a substrate, a grounding element and an electrostatic protection element. The antenna feeding device includes a substrate, a grounding element, and an electrostatic protection element. The radiation element is arranged along the edge of the electronic device, and the radiation element and the metal housing are separated from each other. The substrate is arranged on the metal housing. The substrate includes a feeding portion and a grounding portion, and the feeding portion is coupled to the radiating element. The grounding portion is coupled to the metal housing. The grounding element is electrically connected to the metal housing, and the grounding element is coupled to the grounding portion. The electrostatic protection element is electrically connected between the feeding portion and the grounding portion.

Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

Abstract: One or more computing devices, systems, and/or methods for cross-domain action prediction are provided. Action sequence embeddings are generated based upon a textual embedding and a graph embedding utilizing past user action sequences corresponding to sequences of past actions performed by users across a plurality of domains. An autoencoder is trained to utilize the action sequence embeddings to project the action sequence embeddings to obtain intent space vectors. A service switch classifier is trained using the intent space vectors. In response to the service switch classifier predicting that a current user will switch from a current domain to a next domain, the current user is provided with a recommendation of an action corresponding to the next domain.

Abstract: One or more computing devices, systems, and/or methods for generating a list of suggested queries associated with one or more keywords are provided. For example, one or more keywords may be received via a search interface. A plurality of queries associated with the one or more keywords may be determined based upon the one or more keywords and a historical query database. A plurality of relationship scores associated with the plurality of queries may be generated based upon a plurality of search sessions associated with the historical query database. The historical query database may be analyzed to determine a plurality of click rates associated with the plurality of queries. A list of suggested queries may be generated based upon the plurality of relationship scores and the plurality of click rates.

Abstract: A flash memory controller for controlling a flash memory module includes a communication interface for receiving a first data and a second data; and a processing circuit for dynamically controlling a data writing mode of the flash memory module according to an amount of stored data in the flash memory module. If the amount of stored data in the flash memory module is less than a first threshold when the communication interface receives the first data, the processing circuit controls the flash memory module so that the first data is written into the first data block under an one-bit-per-cell mode. If the amount of stored data in the flash memory module is greater than the first threshold when the communication interface receives the second data, the processing circuit controls the flash memory module so that the second data is written into the second data block under a two-bit-per-cell mode.

Abstract: A matte film for hot pressing and a manufacturing method thereof are provided. The manufacturing method includes steps of forming at least one polyester composition into an unstretched polyester thick film and stretching the unstretched polyester thick film in a machine direction (MD) and a transverse direction (TD). The polyester composition includes 81% to 97.9497% by weight of a polyester resin, 0.02% to 2% by weight of an antioxidative ingredient, 0.0003% to 1% by weight of a nucleating agent, 0.01% to 2% by weight of a flow aid, 0.01% to 2% by weight of a polyester modifier, 0.01% to 2% by weight of an inorganic filler, and 2% to 10% by weight of silica particles. The polyester resin has an intrinsic viscosity between 0.60 dl/g and 0.80 dl/g.

Abstract: A controller applied to a power converter is installed in a primary side of the power converter. The controller includes a capacitor, an adjustment signal generation circuit, and a discharge circuit. The capacitor is used for generating a tracking voltage. The adjustment signal generation circuit is used for generating an adjustment signal according to a feedback voltage and the tracking voltage. The discharge circuit is used for discharging the capacitor according to the feedback voltage and the adjustment signal. The tracking voltage is used for tracking a state of a magnetizing current of a magnetizing inductor of the primary side of the power converter, and when the tracking voltage consists with the state of the magnetizing current, the tracking voltage is applied to at least one of zero-voltage switching (ZVS) control and quasi-resonant (QR) control of the power converter.

Abstract: A semiconductor may include an active region, an epitaxial source/drain formed in and extending above the active region, and a first dielectric layer formed over a portion of the active region. The semiconductor may include a first metal gate and a second metal gate formed in the first dielectric layer, a second dielectric layer formed over the first dielectric layer and the second metal gate, and a titanium layer, without an intervening fluorine residual layer, formed on the metal gate and the epitaxial source/drain. The semiconductor may include a first metal layer formed on top of the titanium on the first metal gate, a second metal layer formed on top of the titanium layer on the epitaxial source/drain, and a third dielectric layer formed on the second dielectric layer. The semiconductor may include first and second vias formed in the third dielectric layer.

Abstract: A fan frame body structure includes a first frame body. The first frame body has a first upper end, a first lower end, a first frame wall and a first main flow way. The first main flow way passes through the first frame body and is formed with a first main inlet and a first main outlet respectively at the first upper end and the first lower end. A first subsidiary flow way is disposed in the first frame wall. The first subsidiary flow way is in parallel the first main flow way. The first subsidiary outlet is positioned at the first upper end of the first frame body in flush with and in adjacency to the first main inlet.

Abstract: A device includes a first III-V compound layer, a second III-V compound layer, a dielectric layer, a contact, a metal-containing layer, and a metal contact. The second III-V compound layer is over the first III-V compound layer. The dielectric layer is over the second III-V compound layer. The contact extends through the dielectric layer to the second III-V compound layer. The contact is in contact with a top surface of the dielectric layer and an inner sidewall of the dielectric layer. The metal-containing layer is over and in contact with the contact, and a portion of the metal-containing layer is directly above the dielectric layer. The metal contact is over and in contact with the metal-containing layer.

Abstract: An electronic package is provided, in which an electronic element is arranged on a carrier structure having a plurality of wire-bonding pads arranged on a surface of the carrier structure, and a plurality of bonding wires are connected to a plurality of electrode pads of the electronic element and the plurality of wire-bonding pads. Further, among any three adjacent ones of the plurality of wire-bonding pads, a long-distanced first wire-bonding pad, a middle-distanced second wire-bonding pad and a short-distanced third wire-bonding pad are defined according to their distances from the electronic element. Therefore, even if the bonding wires on the first to third wire-bonding pads are impacted by an adhesive where a wire sweep phenomenon occurred when the flowing adhesive of a packaging layer covers the electronic element and the bonding wires, the bonding wires still would not contact each other, thereby avoiding short circuit problems.

Abstract: A noise monitoring apparatus includes a row selection circuit, a direct current (DC) cancellation circuit and an amplifier circuit. The row selection circuit selects a row of a DUT array to be a selected row during a readout period, wherein the selected row comprises a plurality of selected DUTs. The DC cancellation circuit is coupled to unselected DUTs of the DUT array during the readout period, generates a DC current signal based on bias current signals from a group of unselected DUTs and subtract the DC current signal from a first noise signal of the selected DUT to generate a second noise signal. The amplifier circuit is coupled to the plurality of selected DUTs of the selected row during the readout period, and amplifies the second noise signal from each of the selected DUTs to generate an output signal.

Abstract: The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.

Abstract: A positioning device is provided, including: a base seat, including a plurality through holes and a slide groove; a clamping assembly, disposed within the slide groove, including a first clamping body and a second clamping body; an adjustment assembly, including a first driving rod, a second driving rod and at least one rotation rod, the first driving rod including a first thread section and a first bevel gear, the second driving rod including a second thread section and a second bevel gear, the first clamping body and the second clamping body are respectively screwed on the first thread section and the second thread section, each rotation rod including a third bevel gear, the third bevel gear respectively meshed with the first bevel gear and the second bevel gear.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The semiconductor die together with the frame and the package substrate form a cavity between the semiconductor die and the package substrate. At least a portion of the semiconductor die and the package substrate are encapsulated with an encapsulant. The frame is configured to prevent the encapsulant from entering the cavity.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC). The IC includes a first inter-metal dielectric (IMD) structure disposed over a semiconductor substrate. A metal-insulator-metal (MIM) device is disposed over the first IMD structure. The MIM device includes at least three metal plates that are spaced from one another. The MIM device further includes a plurality of capacitor insulator structures. Each of the plurality of capacitor insulator structures are disposed between and electrically isolate neighboring metal plates of the at least three metal plates.

Abstract: A controller of a power conversion circuit generates PWM signals to control output stage circuits to provide an output voltage and a load current to an output terminal. The controller includes a sensing circuit, a comparison circuit, a PWM generation circuit and a control loop. The sensing circuit generates a current sensing signal related to load current. The comparison circuit compares the current sensing signal and a default value representing a current threshold to generate a comparison result. The control loop, coupled to the output terminal, the PWM generation circuit and the comparison circuit, generates a trigger signal according to a reference voltage and the output voltage to control the PWM generation circuit to generate PWM signals. When the comparison result indicates that the load current exceeds current threshold, the control loop temporarily stops providing trigger signal to PWM generation circuit to delay the generation of PWM signals.

Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Abstract: An image-capturing device includes a camera and a rotating mechanism for orienting the camera in multiple directions. The rotating mechanism includes a motor; a driving gear; a first transmission module including a first input gear, which is selectively engaged with and transmitted to rotate by the driving gear at a first position, and transmitting the camera to rotate in a first direction with rotation of the first input gear; a second transmission module including a second input gear, which is selectively engaged with and transmitted to rotate by the driving gear at a second position, and transmitting the camera to rotate in a second direction with rotation of the second input gear; and a clutch mechanism including a clutch device for driving the driving gear to switch between the first position and the second position. The clutch device includes a solenoid.

Abstract: An antenna structure and an electronic device are provided. The electronic device includes a housing and the antenna structure disposed therein. The antenna structure includes a grounding element, a feeding radiation element, a feeding element and a first grounding radiation element. The feeding radiation element includes a first radiating portion, a second radiating portion and a third radiating portion. The first radiating portion and the second radiating portion jointly surround the first grounding radiation element. The first radiating portion is spaced apart from and coupled with the first grounding radiation element to generate a first operating frequency band. The second radiating portion is spaced apart from and coupled with the first grounding radiation element to generate a second operating frequency band. The first operating frequency band is lower than the second operating frequency band.