Abstract: An electric signal reconstruction system includes a signal generator and a computing element. The signal generator has a time constant and is configured to generate a plurality of signal value corresponding to a plurality of time points within a time period, wherein the signal values include a designated value, the time points include a designated time point, and the designated value corresponds to the designated time point. The computing element is electrically connected to the signal generator and is configured to perform operations including: performing a differential calculation or an integral calculation according to the time points and the signal values to generate a fundamental value; calculating a correction constant associated with the time constant; calculating a product of the correction constant and the fundamental value as a correction value; calculating a sum of the correction value and the designated value as a reconstruction value; and outputting the reconstruction value.

Abstract: A switch device includes a first node, a switch unit, an adjustment switch, an impedance element, a second node and a detection unit. A first terminal of the switch unit is coupled to the first node. A first terminal and a second terminal of the adjustment switch are respectively coupled to a second terminal of the switch unit and a reference voltage terminal. A first terminal and a second terminal of the impedance element are respectively coupled to the first terminal and the second terminal of the adjustment switch. The detection unit is coupled to the second node, and a control terminal of the switch unit and a control terminal of the adjustment switch. The detection unit detects a node signal at the second node to accordingly control the switch unit and the adjustment switch.

Abstract: A switch device includes a first node, a switch unit, an adjustment switch, an impedance element, a second node and a detection unit. A first terminal of the switch unit is coupled to the first node. A first terminal and a second terminal of the adjustment switch are respectively coupled to a second terminal of the switch unit and a reference voltage terminal. A first terminal and a second terminal of the impedance element are respectively coupled to the first terminal and the second terminal of the adjustment switch. The detection unit is coupled to the second node, and a control terminal of the switch unit and a control terminal of the adjustment switch. The detection unit detects a node signal at the second node to accordingly control the switch unit and the adjustment switch.

Abstract: An autonomous water quality sensing apparatus, a system and a method for operating the apparatus are provided. In the autonomous water quality sensing system, the autonomous water quality sensing apparatus is configured to move on a track. In the method, a driving mechanism is used to drive the autonomous water quality sensing apparatus to operate over an elevated track surrounding one or more pools. The autonomous water quality sensing apparatus includes a sensing device. The sensor is put into the pool at a planned stop by a sensor deploying mechanism of the autonomous water quality sensing apparatus, so as to obtain water quality data of each of the pools according to a routing plan and a length setting.

Abstract: The disclosure relates to a force measurement device including central portion, fixing portion, first and second sensing portions, and first and second electromechanical elements. The first sensing portion has first natural frequency. The first sensing portion is connected to the central portion. The second sensing portion has a second natural frequency. The second sensing portion is connected to the first sensing portion and the fixing portion. The first electromechanical element is disposed on the first sensing portion to measure a first vibration amplitude. The second electromechanical element is disposed on the second sensing portion to measure a second vibration amplitude. When the central portion is subjected to a first force, the first vibration amplitude is larger than the second vibration amplitude. When the central portion is subjected to a second force, the first vibration amplitude is smaller than the second vibration amplitude.

Abstract: The present disclosure describes a lithography apparatus comprising a photoresist coating unit configured to perform one or more coating processes on a substrate. The lithography apparatus further comprises a detection unit configured to determine a contamination level of a contaminant from the one or more coating processes adheres on a sidewall of the lithography apparatus. The lithography apparatus further comprises a controller unit configured to adjust one or more operations of the lithography apparatus based on a comparison between the contamination level and a baseline cleanliness requirement of the lithography apparatus.

Abstract: The present disclosure describes a lithography apparatus comprising a photoresist coating unit configured to perform one or more coating processes on a substrate. The lithography apparatus further comprises a detection unit configured to determine a contamination level of a contaminant from the one or more coating processes adheres on a sidewall of the lithography apparatus. The lithography apparatus further comprises a controller unit configured to adjust one or more operations of the lithography apparatus based on a comparison between the contamination level and a baseline cleanliness requirement of the lithography apparatus.

Abstract: A method includes transferring a wafer into a first processing chamber by using a robot arm mechanism, and applying a photoresist on the wafer in a first processing chamber. The wafer is transferred from the first processing chamber into a second processing chamber by using the robot arm mechanism, and the photoresist is exposed to a pattern of light in the second processing chamber. The method includes transferring the wafer from the second processing chamber into a third processing chamber by using the robot arm mechanism, and developing the exposed wafer in the third processing chamber. The method includes cleaning the robot arm mechanism in a dummy chamber.

Abstract: A timing control method and system applied on the network simulator platform are disclosed. When at least one subprocess calls a system call to enter a blocking I/O, a marking operation is performed, the kernel issues a first notification event to a network simulator, to request the network simulator to pause until the subprocess leaves from the blocking I/O. when the kernel detects that the subprocess leaves from the blocking I/O already, the kernel issues a second notification event to the network simulator, so that the network simulator continues to simulate. The present invention can control the subprocess to not continuously occupy resource, and first and second notification events can prevent a simulator timer from continuously running during the subprocess execution period, to cause an abnormal timing of a simulation result.

Abstract: A method of WDM-aware optical routing for on-chip devices is proposed, which is executed by a computer, the method comprising using the computer to perform the following steps of: performing a path separation to identify signal net candidates; performing a path clustering to find path clusters of the signal net candidates; performing an endpoint placement to find legal locations for WDM endpoints; and performing a pin-to-waveguide routing all nets to corresponding WDM waveguides.

Abstract: The present disclosure describes a lithography apparatus comprising a photoresist coating unit configured to perform one or more coating processes on a substrate. The lithography apparatus further comprises a detection unit configured to determine a contamination level of a contaminant from the one or more coating processes adheres on a sidewall of the lithography apparatus. The lithography apparatus further comprises a controller unit configured to adjust one or more operations of the lithography apparatus based on a comparison between the contamination level and a baseline cleanliness requirement of the lithography apparatus.

Abstract: The disclosure relates to a force measurement device including central portion, fixing portion, first and second sensing portions, and first and second electromechanical elements. The first sensing portion has first natural frequency. The first sensing portion is connected to the central portion. The second sensing portion has a second natural frequency. The second sensing portion is connected to the first sensing portion and the fixing portion. The first electromechanical element is disposed on the first sensing portion to measure a first vibration amplitude. The second electromechanical element is disposed on the second sensing portion to measure a second vibration amplitude. When the central portion is subjected to a first force, the first vibration amplitude is larger than the second vibration amplitude. When the central portion is subjected to a second force, the first vibration amplitude is smaller than the second vibration amplitude.

Abstract: A multi-axis force sensor including a central portion, an outer ring portion, and at least one sensing portion disposed along an axial direction of an axis is provided. The sensing portion includes a first and a second elements connected with each other, and at least one first and at least one second strain gauges. A first end surface of the first element is connected to the central portion, and a second end surface of the second element is connected to the outer ring portion. A normal vector of the first end surface is parallel to the axis and the axis passes through a centroid of the first end surface. When the first end surface is subjected to an axial force, a first strain of a first sensing region of the first element in the axial direction is smaller than a second strain of a second sensing region of the second element in the axial direction.

Abstract: The present disclosure describes a semiconductor apparatus and a method for handling contamination from a semiconductor manufacturing process. The semiconductor apparatus can include a chuck configured to hold a substrate, a drain cup configured to surround the chuck and to capture a chemical sprayed from the substrate, and a detection module disposed in a space between the drain cup and the chuck and configured to monitor sidewalls of the drain cup.

Abstract: A timing control method and system applied on the network simulator platform are disclosed. When at least one subprocess calls a system call to enter a blocking I/O, a marking operation is performed, the kernel issues a first notification event to a network simulator, to request the network simulator to pause until the subprocess leaves from the blocking I/O. when the kernel detects that the subprocess leaves from the blocking I/O already, the kernel issues a second notification event to the network simulator, so that the network simulator continues to simulate. The present invention can control the subprocess to not continuously occupy resource, and first and second notification events can prevent a simulator timer from continuously running during the subprocess execution period, to cause an abnormal timing of a simulation result.

Abstract: A method includes transferring a wafer into a first processing chamber by using a robot arm mechanism, and applying a photoresist on the wafer in a first processing chamber. The wafer is transferred from the first processing chamber into a second processing chamber by using the robot arm mechanism, and the photoresist is exposed to a pattern of light in the second processing chamber. The method includes transferring the wafer from the second processing chamber into a third processing chamber by using the robot arm mechanism, and developing the exposed wafer in the third processing chamber. The method includes cleaning the robot arm mechanism in a dummy chamber.

Abstract: A ball screw with tilt detector includes a screw rod, two screw nuts, a channel, a plurality of balls, and a tilt detector. The screw rod is extended along a direction of an axis. The two screw nuts are installed on the screw rod and capable of moving along the axis. The tilt detector is disposed between the two screw nuts to detect a tilt angle and a preload of the two screw nuts. The tilt detector includes a force receiving element, at least one first strain sensor, and at least one second strain sensor. The force receiving element includes a point symmetric ring-type structure, and the ring-type structure has two planes which are parallel to each other and respectively contact the two screw nuts.

Abstract: A multi-axis force sensor including a central portion, an outer ring portion, and at least one sensing portion disposed along an axial direction of an axis is provided. The sensing portion includes a first and a second elements connected with each other, and at least one first and at least one second strain gauges. A first end surface of the first element is connected to the central portion, and a second end surface of the second element is connected to the outer ring portion. A normal vector of the first end surface is parallel to the axis and the axis passes through a centroid of the first end surface. When the first end surface is subjected to an axial force, a first strain of a first sensing region of the first element in the axial direction is smaller than a second strain of a second sensing region of the second element in the axial direction.

Abstract: The disclosure is related to a bandwidth management method performed in a network switch and a network system. In the method, a total bandwidth usage is firstly metered, and it is determined if the total bandwidth usage reaches a threshold for triggering a flow-limit process. This threshold acts as a bandwidth-usage threshold obtained by multiplying a total bandwidth by a meter-triggering threshold. The flow-limit process is triggered if the total bandwidth usage reaches the threshold; otherwise, the system will not intervene with the usage of bandwidth if the total bandwidth usage does not reach the threshold. In the flow-limit process, the class of a user is identified. Guaranteed bandwidth is provided for a prioritized user. A normal user will be restricted to using the bandwidth aside from the guaranteed bandwidth. The bandwidth provided for the normal user may exceed the available bandwidth based on an adjustable system parameter.

Abstract: The present disclosure describes a semiconductor apparatus and a method for handling contamination from a semiconductor manufacturing process. The semiconductor apparatus can include a chuck configured to hold a substrate, a drain cup configured to surround the chuck and to capture a chemical sprayed from the substrate, and a detection module disposed in a space between the drain cup and the chuck and configured to monitor sidewalls of the drain cup.