Patents by Inventor Chih-Chin Chang
Chih-Chin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070262325Abstract: A wavelength converting material including a wavelength converting activator and a scatter is provided. The wavelength converting activator is suitable for being activated by a light with a wavelength ?1, so as to emit a light with a wavelength ?2. The scatter is disposed on the wavelength converting activator. The scatter is suitable for scattering a first light and a second light irradiated to a surface thereof. As a result of that the scatters on the wavelength converting activators increases the gap of two wavelength converting activators adjacent to each other, the wavelength converting activators could be sufficiently activated for emitting a light with wavelength ?2 while the wavelength converting materials are irradiated by the light with ?1. Therefore, the brightness of a light emitting diode with the wavelength converting material is enhanced.Type: ApplicationFiled: May 29, 2006Publication date: November 15, 2007Applicant: LIGHTHOUSE TECHNOLOGY CO., LTDInventors: Wen-Jeng Hwang, Chih-Chin Chang, Hsiang-Cheng Hsieh, Hsin-Hua Ho
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Publication number: 20070252456Abstract: A stator lead retainer assembly includes a stator lead retainer body and a stator lead retainer clip. The stator lead retainer body includes at least one through-hole extending longitudinally therethrough, each through-hole configured to receive a stator lead. The stator lead retainer clip is attached to the retainer body, and includes an aperture for receiving a stator lead.Type: ApplicationFiled: April 17, 2007Publication date: November 1, 2007Applicant: Victory Industrial CorporationInventors: Chih-Chin Chang, Ronald Hsiung
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Publication number: 20070252455Abstract: A stator lead retainer includes a stator lead retainer body having a plurality of through-holes extending longitudinally therethrough, each through-hole configured for receiving a stator lead. The stator lead body is constructed from an elastic material and is operable to accommodate stator leads of different cross-sectional shapes and diameters.Type: ApplicationFiled: April 17, 2007Publication date: November 1, 2007Applicant: Victory Industrial CorporationInventors: Chih-Chin Chang, Ronald Hsiung
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Patent number: 7288798Abstract: Disclosed herein is a light module comprising a substrate, at least one light-emitting element on the substrate, a sealing cap on the substrate and covering the light-emitting elements, and a fluid in the space formed among the sealing cap, the light-emitting elements, and the substrate, such that heat dissipation is fast and yellowing of the encapsulating material is retarded.Type: GrantFiled: June 2, 2005Date of Patent: October 30, 2007Assignee: Lighthouse Technology Co., LtdInventors: Chih-Chin Chang, Teng-Huei Huang, Chien-Lung Lee
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Patent number: 7270446Abstract: A light module comprises a light unit, a heat transferring plate or a plurality of heat transferring pipes, and a plurality of heat dissipating fins. The heat transferring plate or heat transferring pipes are positioned on the bottom surface of the light unit to transfer heat generated by the light unit. When the heat transferring plate is used, the heat dissipating fins are arranged under the heat transferring plate and perpendicular to the bottom surface of the heat transferring plate. The heat dissipating fins have a recess for the accommodation of the heat transferring plate and the light unit. When the heat transferring pipes are used, the heat dissipating fins each contact the heat transferring pipes. Uniform heat dissipation is thus attained.Type: GrantFiled: May 9, 2005Date of Patent: September 18, 2007Assignee: Lighthouse Technology Co., LtdInventors: Chih-Chin Chang, Teng-Huei Huang, Chien-Lung Lee
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Publication number: 20070117290Abstract: A method of manufacturing a low temperature polysilicon film is provided. A first metal layer is formed on a substrate; and openings have been formed in the first metal layer. A second metal layer is formed on the first metal layer: and a hole corresponding to each of the openings is formed in the second metal layer. A silicon layer is formed on the second metal layer; a silicon seed is formed on the substrate inside each of the holes. After removing the first and the second metal layers, an amorphous silicon layer is formed on the substrate by using the silicon seed. Then a laser crystallization step is performed to form a polysilicon layer from the amorphous layer. Since the position of the silicon seed can be controlled, the size and distribution of the silicon grain and the number of the silicon crystal interface can also be controlled.Type: ApplicationFiled: January 23, 2007Publication date: May 24, 2007Applicant: AU OPTRONICS CORPORATIONInventors: Chien-Shen Wung, Mao-Yi Chang, Chih-Chin Chang
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Patent number: 7195798Abstract: A method of manufacturing a low temperature polysilicon film is provided. A first metal layer is formed on a substrate; and openings have been formed in the first metal layer. A second metal layer is formed on the first metal layer: and a hole corresponding to each of the openings is formed in the second metal layer. A silicon layer is formed on the second metal layer; a silicon seed is formed on the substrate inside each of the holes. After removing the first and the second metal layers, an amorphous silicon layer is formed on the substrate by using the silicon seed. Then a laser crystallization step is performed to form a polysilicon layer from the amorphous layer. Since the position of the silicon seed can be controlled, the size and distribution of the silicon grain and the number of the silicon crystal interface can also be controlled.Type: GrantFiled: August 25, 2003Date of Patent: March 27, 2007Assignee: Au Optronics CorporationInventors: Chien-Shen Wung, Mao-Yi Chang, Chih-Chin Chang
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Publication number: 20060274524Abstract: Disclosed herein is a light module comprising a substrate, at least one light-emitting element on the substrate, a sealing cap on the substrate and covering the light-emitting elements, and a fluid in the space formed among the sealing cap, the light-emitting elements, and the substrate, such that heat dissipation is fast and yellowing of the encapsulating material is retarded.Type: ApplicationFiled: June 2, 2005Publication date: December 7, 2006Inventors: Chih-Chin Chang, Teng-Huei Huang, Chien-Lung Lee
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Publication number: 20060250800Abstract: A light module comprises a light unit, a heat transferring plate or a plurality of heat transferring pipes, and a plurality of heat dissipating fins. The heat transferring plate or heat transferring pipes are positioned on the bottom surface of the light unit to transfer heat generated by the light unit. When the heat transferring plate is used, the heat dissipating fins are arranged under the heat transferring plate and perpendicular to the bottom surface of the heat transferring plate. The heat dissipating fins have a recess for the accommodation of the heat transferring plate and the light unit. When the heat transferring pipes are used, the heat dissipating fins each contact the heat transferring pipes. Uniform heat dissipation is thus attained.Type: ApplicationFiled: May 9, 2005Publication date: November 9, 2006Inventors: Chih-Chin Chang, Teng-Huei Huang, Chien-Lung Lee
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Patent number: 7115911Abstract: An LED module and method of packing the same are provided. The LED module includes a substrate with at least one cavity therein, at least one LED unit positioned on portions of the substrate in the cavity, a circuit positioned above the LED unit and electrically connected to the LED unit, and a first capsulation material filling within the cavity.Type: GrantFiled: February 24, 2005Date of Patent: October 3, 2006Assignee: Lighthouse Technology Co., LTDInventors: Chih-Chin Chang, Teng-Huei Huang, Chien-Lung Lee
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Publication number: 20060214562Abstract: An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n: Ce3+, Tb3+, wherein 0<t<5 and 0<m, n, u, v<15.Type: ApplicationFiled: June 17, 2005Publication date: September 28, 2006Inventors: Chih-Chin Chang, Hsiang-Cheng Hsieh, Teng-Huei Huang
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Patent number: 7112820Abstract: A capacitor structure includes a first conductive layer, a first insulating layer disposed on a substrate in sequence, a second conductive layer disposed on portions of the first insulating layer, a second insulating layer disposed on the second conductive layer and the first insulating layer, a third conductive layer disposed on portions of the second insulating layer, a third insulating layer disposed on the third conductive layer and the second insulating layer, and a fourth conductive layer disposed on the third insulating layer. The third conductive layer and the fourth conductive layer are electrically connected to the first conductive layer and the second conductive layer through at least one first contact hole adjacent to the second conductive layer and at least one second contact hole, respectively.Type: GrantFiled: September 1, 2003Date of Patent: September 26, 2006Assignee: AU Optronics Corp.Inventors: Chih-Chin Chang, Kuang-Chao Yeh
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Publication number: 20060152139Abstract: A wavelength converting substance comprises a wavelength converting material particle and a transparent layer on the wavelength converting material particle. The wavelength converting substance is a material possessing both wavelength converting and light scattering properties. Thus, when the wavelength converting substance is used in a light emitting device, the brightness is improved and the light mixing is more uniform than that of a traditional package. A light emitting device and an encapsulating material comprising the wavelength converting substance are also disclosed.Type: ApplicationFiled: May 2, 2005Publication date: July 13, 2006Inventors: Hsiang-Cheng Hsieh, Chih-Chin Chang, Teng-Huei Huang, Tse-Min Mao
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Patent number: 7064021Abstract: A method for forming a self-aligned low temperature polysilicon thin film transistor (LTPS TFT). First, active layers of a N type LTPS TFT (NLTPS TFT) and a P type LTPS TFT (PLTPS TFT) are formed on a substrate, and a gate insulating (GI) layer is formed on the substrate. Then, a source electrode, a drain electrode, and lightly doped drains (LDD) of the NLTPS TFT are formed. Further, gate electrodes of the NLTPS TFT and the PLTPS TFT are formed on the gate insulating layer. Finally, the gate electrode of the PLTPS TFT is utilized to form a source electrode and a drain electrode in the active layer of the PLTPS TFT.Type: GrantFiled: November 15, 2004Date of Patent: June 20, 2006Assignee: AU Optronics Corp.Inventor: Chih-Chin Chang
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Patent number: 7053421Abstract: A light-emitting diode (LED) mainly includes a surface mounted package. The surface mounted package includes a substrate, two composite metal layers positioned on the substrate and being insulated from each other, an LED chip electrically connected to the composite metal layers, and a sealing member covering the LED chip. Each of the composite metal layers has a silver layer for preventing solder paste from penetrating into space between the sealing member and the composite metal layers and for reflecting light beams generated by the LED chip.Type: GrantFiled: December 15, 2003Date of Patent: May 30, 2006Assignee: Lighthouse Technology Co., LTDInventor: Chih-Chin Chang
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Publication number: 20060091403Abstract: An LED module and method of packing the same are provided. The LED module includes a substrate with at least one cavity therein, at least one LED unit positioned on portions of the substrate in the cavity, a circuit positioned above the LED unit and electrically connected to the LED unit, and a first capsulation material filling within the cavity.Type: ApplicationFiled: February 24, 2005Publication date: May 4, 2006Inventors: Chih-Chin Chang, Teng-Huei Huang, Chien-Lung Lee
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Publication number: 20050263710Abstract: A detector and method for detecting intensity of ultraviolet (UV) rays are disclosed. The detector has a plurality of UV photo-diodes for detecting intensities of UV rays within different wave bands, an A/D converter for converting analog output signals of the UV photo-diodes into corresponding digital signals, and a micro-controller for controlling operations of the detector. Each of the wave bands overlaps at least one of the other wave bands. The micro-controller calculates the intensity of each overlapped wave band according to the digital signals.Type: ApplicationFiled: November 22, 2004Publication date: December 1, 2005Inventors: Shang-Chih Tsou, Chih-Chin Chang
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Patent number: 6936862Abstract: A light emitting diode package includes a light emitting diode device disposed in the light emitting diode package, and a molding material covering the light emitting diode device. The molding material includes a plurality of scatter supported wavelength converters. Portions of light beams emitted from the light emitting diode device incident to each of the scatter supported wavelength converters are scattered by each of the scatter supported wavelength converters and absorbed to excite each of the scatter supported wavelength converters to emit light in another wavelength.Type: GrantFiled: August 13, 2004Date of Patent: August 30, 2005Assignee: Lighthouse Technology Co., LTDInventors: Chih-Chin Chang, Hsiang-Cheng Hsieh, Teng-Huei Huang
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Publication number: 20050127387Abstract: A light-emitting diode (LED) mainly includes a surface mounted package. The surface mounted package includes a substrate, two composite metal layers positioned on the substrate and being insulated from each other, an LED chip electrically connected to the composite metal layers, and a sealing member covering the LED chip. Each of the composite metal layers has a silver layer for preventing solder paste from penetrating into space between the sealing member and the composite metal layers and for reflecting light beams generated by the LED chip.Type: ApplicationFiled: December 15, 2003Publication date: June 16, 2005Inventor: Chih-Chin Chang
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Patent number: 6902961Abstract: A method of forming a CMOS thin film transistor device. A dry etching procedure is performed to remove part of a photoresist layer and part of a metal layer and thus forms a gate with a symmetrical cone shape and a remaining photoresist layer. The dielectric layer is thus exposed in the lightly doped area. Specially, the bottom width of the first gate is narrower than that of the first metal layer and the symmetrical cone shape is gradually thinner from bottom to top. Using the gate as a mask, an n?-ion implantation is performed to form a self-aligned and symmetrical LDD region in a semiconductor layer without additional photolithography steps.Type: GrantFiled: July 29, 2003Date of Patent: June 7, 2005Assignee: Au Optronics Corp.Inventors: Chih-Chin Chang, Chih-Hung Wu