Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.

Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

Abstract: A pickup apparatus for separating a semiconductor package from an adhesive film includes a platform, a roller, a moving mechanism, and a collector element. The platform has a surface disposed with the adhesive film, where the adhesive film is disposed between the platform and the semiconductor package. The roller is disposed inside the platform and under the adhesive film, where the roller includes a body and a plurality of protrusions distributed over the body. The moving mechanism is connected to the roller to control a movement of the roller. The collector element is disposed over the platform and the adhesive film, where the collector element is configured to remove the semiconductor package from the adhesive film.

Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Abstract: A system of generating data from diffusion-weighted images for pre-processing and a method thereof are disclosed. In the system, a processing parameter set including diffusion information is acquired; after a raw diffusion-weighted image including data images and image information is acquired, the image information is interpreted to set image processing data of the raw diffusion-weighted image, and non-deformation correction and deformation correction are performed on the raw diffusion-weighted image to generate a pre-processed diffusion-weighted image based on the processing parameter set and the image processing data. Therefore, the image processing data can be automatically set based on the raw diffusion-weighted image, to achieve the effect of lowering difficulty for analyzing DWI and saving setup time of image processing data.

Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes: providing an interposer having a front surface and a back surface, the interposer comprising a substrate, at least one routing region, and at least one non-routing region; forming at least one warpage-reducing trench in the at least one non-routing region, wherein the at least one warpage-reducing trench extends from the front surface of the interposer to a first depth, the first depth smaller than a thickness between the front surface and the back surface of the interposer; depositing a warpage-relief material in the at least one warpage-reducing trench; and bonding the group of IC dies to the front surface of the interposer.

Abstract: A semiconductor device includes a fin extending from a substrate and including a first fin end, a separation structure separating the first fin end from an adjacent fin end of another fin, a dummy gate spacer along sidewalls of the separation structure and the fin, a first epitaxial source/drain region in the fin and adjacent the separation structure, and a residue of a dummy gate material in a corner region between the dummy gate spacer and the first fin end. The first fin end protrudes from the dummy gate spacer into the separation structure. The residue of the dummy gate material separates the first epitaxial source/drain region from the separation structure and is triangle shaped.

Abstract: A tricalcium silicate kit includes a first reagent containing tricalcium silicate, and a second reagent containing a salt material and water. The salt material is selected from the group consisting of sodium carbonate, calcium chloride, and a combination thereof. A method for preparing a Portland cement-based dental material using the tricalcium silicate kit is also provided.

Abstract: A neutron beam source generation system, a neutron beam source stabilization control system, and a neutron beam source generation method are provided. The neutron beam source generation system includes an accelerator, a target, and a calibration module. The accelerator is configured to generate a proton beam. A neutron beam source is generated by irradiating the target with the proton beam. The calibration module includes a pair of electromagnet components, a profile-measuring component, a current-measuring component, and a Faraday cup component. The calibration module uses the pair of electromagnet components to control the distribution of the proton beam according to the profile distribution of the proton beam as measured by the profile-measuring component. The calibration module adjusts the current of the proton beam according to the first current value as measured by the current-measuring component, the second current value as measured by the Faraday cup component, or both.

Abstract: An ultrasound analysis method and a system performing the same are provided. A plurality of ultrasound emission-receiving elements of the system alternately emits a focused ultrasound and a planar ultrasound to a target object. The energy and the focus position of the focused ultrasound are controlled during the emission of the focused ultrasound. The energy level and the direction of travel of the planar ultrasound are controlled during the emission of the planar ultrasound. The system receives scattered echo signals of the planar ultrasound to generate echo mapping signals, thereby reconstructing the echo mapping signals into an ultrasound image to map neurological functional change.

Abstract: An ultrasonic device is provided for use on a biological tissue, and includes a base assembly on which a vibrator is mounted, and an ultrasonic probe. The base assembly includes an annular base having at least two pairs of abutment protrusions for abutting against the biological tissue, and an installation base coaxially disposed on and rotatable relative to the annular base between two test positions. The installation base has a through hold in which the ultrasonic probe is inserted.

Abstract: A method includes: providing a first design layout including a plurality of cells; updating a first cell of the plurality of cells using optical proximity correction to provide a first updated cell and a data set; and updating a second cell from remaining cells in the first design layout based on the data set and a model without involvement of optical proximity correction to provide a second updated cell, wherein the model includes hidden layers including nodes and is trained to obtaining converged values of the nodes of the hidden layers through providing a mapping of edge segments before lithography enhancement and edge segments after lithography enhancement using optical proximity correction, and wherein at least one of the providing, and updating is executed by one or more processors.

Abstract: A method includes providing a first design layout including cells; updating a first cell in the plurality of cells using optical proximity correction to provide a first updated cell and a data set; training a model based on a layout-dependent parameter of a second design layout; and updating a second cell based on the data set and the model to provide a second updated cell. The model includes an input layer, a hidden layer and an output layer. Training the model includes obtaining converged values of nodes of the hidden layer. Obtaining converged values of nodes of the hidden layer includes providing information on edge segments before and after lithography enhancement to the input layer and the output layer, respectively, until values of nodes of the hidden layer attains convergence in terms of a cost function.

Abstract: An ultrasonic device is provided for use on a biological tissue, and includes a base assembly on which a vibrator is mounted, and an ultrasonic probe. The base assembly includes an annular base having at least two pairs of abutment protrusions for abutting against the biological tissue, and an installation base coaxially disposed on and rotatable relative to the annular base between two test positions. The installation base has a through hold in which the ultrasonic probe is inserted.

Abstract: The present disclosure provides a method and a system for generating photomask patterns. The system obtains a design layout image, and generates a hotspot image corresponding to the design layout image based on a hotspot detection model. The system generates two photomask patterns based on the hotspot image. The at least two photomask patterns are transferred onto a semiconductor substrate.

Abstract: A measuring system for measuring elasticity of biological tissue includes a mobile device and a measuring apparatus including a conducting seat and a measuring device. The conducting seat is for detachable mounting of the mobile device therein, and is adapted to abut against the biological tissue for conducting vibrations produced by the mobile device to the biological tissue to cause the biological tissue to vibrate. The measuring device includes an ultrasonic transducer to emit an ultrasound signal to the biological tissue and an elasticity analyzer to analyze an ultrasound echo signal that results from reflection of the ultrasound signal by the biological tissue which is vibrating to obtain an elasticity data of the biological tissue.

Abstract: A method includes providing a first design layout including cells; updating a first cell in the plurality of cells using optical proximity correction to provide a first updated cell and a data set; training a model based on a layout-dependent parameter of a second design layout; and updating a second cell based on the data set and the model to provide a second updated cell. The model includes an input layer, a hidden layer and an output layer. Training the model includes obtaining converged values of nodes of the hidden layer. Obtaining converged values of nodes of the hidden layer includes providing information on edge segments before and after lithography enhancement to the input layer and the output layer, respectively, until values of nodes of the hidden layer attains convergence in terms of a cost function.