Abstract: A semiconductor structure includes: a substrate; a first fin and a second fin disposed on the substrate and spaced apart from each other; a dielectric wall disposed on the substrate and having first and second wall surfaces; a third fin disposed on the substrate to be in direct contact with at least one of the first and second fins; a first device disposed on the first fin and including first channel features extending away from the first wall surface; a second device disposed on the second fin and including second channel features extending away from the second wall surface; at least one third device disposed on the third fin and including third channel features; and an isolation feature disposed on the substrate to permit the third device to be electrically isolated from the first and second devices. A method for manufacturing the semiconductor structure is also disclosed.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: The present disclosure provides a method of forming a semiconductor device including an nFET structure and a pFET structure where each of the nFET and pFET structures include a semiconductor substrate and a gate trench. The method includes depositing an interfacial layer in each gate trench, depositing a first ferroelectric layer over the interfacial layer, removing the first ferroelectric layer from the nFET structure, depositing a metal oxide layer in each gate trench, depositing a second ferroelectric layer over the metal oxide layer, removing the second ferroelectric layer from the pFET structure, and depositing a gate electrode in each gate trench.

Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.

Abstract: An electronic device includes a plurality of micro-optoelectronic components and a circuit board. Each of micro-optoelectronic components includes a semiconductor layer, and metal electrodes electrically coupled to the semiconductor layer and exposed on a surface of the semiconductor layer. The circuit board includes a metal circuit layer and a plurality of solder joints. The solder joints are formed on said metal circuit layer, and connected to said metal electrodes. A portion of each of metal electrodes and each of solder joints are welded to form a metal crystalline structure. The metal crystalline structure includes the composition of the metal electrode and/or the composition of the metal circuit layer.

Abstract: A laser stabilizing system configured to stabilize a laser beam emitted from a laser source includes a beam steering device, a first beam splitter, a first light detector, a second beam splitter, and a second light detector. The beam steering device is configured to steer a direction and a position of the laser beam in four or more degrees of freedom. The first beam splitter is configured to split the laser beam from the beam steering device into a first partial beam and a second partial beam. The first light detector is disposed on a transmission path of the first partial beam. The second beam splitter is configured to split the second partial beam into a third partial beam and a fourth partial beam. The second light detector is disposed on a transmission path of the third partial beam. A laser source module is also provided.

Abstract: A water filtration system includes at least one filter cartridge, a seat body and a flow guide adapter. The seat body has a connecting portion defining two passages respectively connected downward to water inlet and outlet of the filter cartridge. The seat body further has a main passageway that has two apertures in communication with the passages of the connecting portion. The flow guide adapter is inserted in an entrance of the main passageway of the seat body, and has a tube fitting portion, a flow guiding portion integrally extending from the tube fitting portion, and an interior tunnel extending through the tube fitting portion to the flow guiding portion for receiving water flow from a conduit. In particular, the flow guiding portion guides water flow from the interior tunnel to the filter cartridge and then back to the main passageway of the seat body.

Abstract: A water filtration system includes at least one filter cartridge, a seat body and a flow guide adapter. The seat body has a connecting portion defining two passages respectively connected downward to water inlet and outlet of the filter cartridge. The seat body further has a main passageway that has two apertures in communication with the passages of the connecting portion. The flow guide adapter is inserted in an entrance of the main passageway of the seat body, and has a tube fitting portion, a flow guiding portion integrally extending from the tube fitting portion, and an interior tunnel extending through the tube fitting portion to the flow guiding portion for receiving water flow from a conduit. In particular, the flow guiding portion guides water flow from the interior tunnel to the filter cartridge and then back to the main passageway of the seat body.

Abstract: A fabricating method of an electron-emitting device includes at least the following steps. A substrate having a first side and a second side is provided. The first side is opposite to the second side. A first electrode pattern layer is formed on the first side of the substrate. A conductive pattern layer is formed on the substrate and the first electrode pattern layer, and the conductive pattern layer partially covers the first electrode pattern layer. An electron-emitting region is formed in the conductive pattern layer. A second electrode pattern layer is formed on the second side of the substrate. The second electrode pattern layer partially covers the conductive pattern layer. The fabricating method has a simple fabricating process and a low fabricating cost.

Abstract: The present invention relates to a light guide plate and back light module having the same. The light guide plate includes a light guide plate body and a plurality of microreliefs. The light guide plate body has a light-emitting surface and a reflecting surface. The microreliefs are disposed on the reflecting surface. Each of the microreliefs has an outer surface and a base area. The outer surface is a curved surface, and the base area contacts the reflecting surface. A ratio of the totally height of each of the microreliefs to the diameter of the base area of each of the microreliefs is between 1/7 and ¼. As a result, the light guide plate has higher light extraction efficiency.

Abstract: A fabricating method of an electron-emitting device is provided. The fabricating method of the electron-emitting device includes at least following procedures. Firstly, a substrate is provided. Next, a first electrode and a second electrode are formed on the substrate. Afterward, a conductive layer covering the first electrode and the second electrode is formed on the substrate. Then, a first conductive layer, a second conductive layer and a gap are formed by patterning the conductive layer. The gap is disposed between the first conductive layer and the second conductive layer. After that, a plasma process is performed at the first conductive layer and second conductive layer.

Abstract: A fabricating method of an electron-emitting device includes at least the following steps. A substrate having a first side and a second side is provided. The first side is opposite to the second side. A first electrode pattern layer is formed on the first side of the substrate. A conductive pattern layer is formed on the substrate and the first electrode pattern layer, and the conductive pattern layer partially covers the first electrode pattern layer. An electron-emitting region is formed in the conductive pattern layer. A second electrode pattern layer is formed on the second side of the substrate. The second electrode pattern layer partially covers the conductive pattern layer. The fabricating method has a simple fabricating process and a low fabricating cost.

Abstract: The present invention relates to a light guide plate and back light module having the same. The light guide plate includes a light guide plate body and a plurality of microreliefs. The light guide plate body has a light-emitting surface and a reflecting surface. The microreliefs are disposed on the reflecting surface. Each of the microreliefs has an outer surface and a base area. The outer surface is a curved surface, and the base area contacts the reflecting surface. A ratio of the totally height of each of the microreliefs to the diameter of the base area of each of the microreliefs is between 1/7 and ¼. As a result, the light guide plate has higher light extraction efficiency.

Abstract: A water treatment apparatus includes a frame and a plurality of connecting accessories, manifolds and filter cartridges. Each of the connecting accessories includes a seat ring fixed on the frame and a communicating pipe coaxially received in the seat ring. The seat rings together with the communicating pipes are spaced at a distance from one another. Each of the manifolds is suspended between adjacent two of the connecting accessories and has inlet and outlet ports at opposite ends. The inlet and outlet ports of each of the manifolds are rotatably and coaxially received in adjacent the seat rings respectively with their exterior walls in contact with inner walls of adjacent the seat rings and their interior walls in contact with outer walls of adjacent the communicating pipes. Additionally, the filter cartridges are detachably joined to the manifolds respectively.

Abstract: An electron-emitting device and a fabricating method thereof are provided. First, a substrate, having a first side and a second side which is opposite to the first side, is provided. Afterwards, a first electrode pattern layer is formed on the first side of the substrate. Next, a conductive pattern layer is formed on the substrate and the first electrode pattern layer. After that, an electron-emitting region is formed in the conductive pattern layer. Then, a second electrode pattern layer is formed on the second side of the substrate and partially covers the conductive pattern layer. The fabricating method has a simple fabricating process and a low fabricating cost.

Abstract: A water treatment apparatus includes a frame and a plurality of connecting accessories, manifolds and filter cartridges. Each of the connecting accessories includes a seat ring fixed on the frame and a communicating pipe coaxially received in the seat ring. The seat rings together with the communicating pipes are spaced at a distance from one another. Each of the manifolds is suspended between adjacent two of the connecting accessories and has inlet and outlet ports at opposite ends. The inlet and outlet ports of each of the manifolds are rotatably and coaxially received in adjacent the seat rings respectively with their exterior walls in contact with inner walls of adjacent the seat rings and their interior walls in contact with outer walls of adjacent the communicating pipes. Additionally, the filter cartridges are detachably joined to the manifolds respectively.

Abstract: A fabricating method of an electron-emitting device is provided. The fabricating method of the electron-emitting device includes at least following procedures. Firstly, a substrate is provided. Next, a first electrode and a second electrode are formed on the substrate. Afterward, a conductive layer covering the first electrode and the second electrode is formed on the substrate. Then, a first conductive layer, a second conductive layer and a gap are formed by patterning the conductive layer. The gap is disposed between the first conductive layer and the second conductive layer. After that, a plasma process is performed at the first conductive layer and second conductive layer.

Abstract: A water treatment apparatus includes a frame and a plurality of connecting accessories, manifolds and filter cartridges. Each of the connecting accessories includes a seat ring fixed on the frame and a communicating pipe coaxially received in the seat ring. The seat rings together with the communicating pipes are spaced at a distance from one another. Each of the manifolds is suspended between adjacent two of the connecting accessories and has inlet and outlet ports at opposite ends. The inlet and outlet ports of each of the manifolds are rotatably and coaxially received in adjacent the seat rings respectively with their exterior walls in contact with inner walls of adjacent the seat rings and their interior walls in contact with outer walls of adjacent the communicating pipes. Additionally, the filter cartridges are detachably joined to the manifolds respectively.

Abstract: A water treatment apparatus includes a frame and a plurality of connecting accessories, manifolds and filter cartridges. Each of the connecting accessories includes a seat ring fixed on the frame and a communicating pipe coaxially received in the seat ring. The seat rings together with the communicating pipes are spaced at a distance from one another. Each of the manifolds is suspended between adjacent two of the connecting accessories and has inlet and outlet ports at opposite ends. The inlet and outlet ports of each of the manifolds are rotatably and coaxially received in adjacent the seat rings respectively with their exterior walls in contact with inner walls of adjacent the seat rings and their interior walls in contact with outer walls of adjacent the communicating pipes. Additionally, the filter cartridges are detachably joined to the manifolds respectively.