Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.

Abstract: Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.

Abstract: Disclosed is a spilled adhesive guide structure of a flexible circuit board. At least one contact pad is formed in a conductive circuit trace arranged on a substrate of the flexible circuit board. The substrate includes an insulation coverlay adhesively bonded thereon by an adhesive layer. The conductive circuit trace includes at least one spilled adhesive guide structure formed therein adjacent to the contact pad so that when the insulation coverlay is adhesively bonded by the adhesive layer to the conductive circuit trace, a spilled adhesive partially spilled out from the adhesive layer is guided into the spilled adhesive guide structure to prevent the spilled adhesive of the adhesive layer from covering a surface of the contact pad.

Abstract: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly.

Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.

Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.

Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.

Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.

Abstract: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly.

Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.

Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.

Abstract: An attenuation reduction grounding pattern structure for connection pads of a flexible circuit board includes a plurality of high frequency connection pads formed on a component surface of a substrate and a plurality of differential mode signal lines arranged on the substrate and connected to the high frequency connection pads. The substrate has a grounding surface forming a grounding layer. The grounding layer includes an attenuation reduction grounding pattern structure formed at a location corresponding to the transition zone and including a hollowed area and a protruded portion. The protruded portion extends a predetermined length in a direction from the grounding layer toward the high frequency connection pads and along the adjacent high frequency connection pads to reach the transition zone. The protruded portion and the high frequency connection pads form a polarization-direction-varying electric field in the transition zone.

Abstract: A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.

Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.

Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.

Abstract: Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.

Abstract: A bundled flexible circuit cable with water resistant structure is provided, in which a flexible substrate forms a cluster section having a lap section. In the lap section, a plurality of flat cable components that collectively form the cluster section is arranged to stack by substantially paralleling each other and corresponding up and down and is bonded and positioned by being applied with an adhesive material. The flat cable components are enclosed by a water resistant component at the lap section, whereby water, liquids, and contaminants are prevented from moving through gaps present in the bundled flexible substrate to get into the enclosure of an electronic device so as to realize protection against water, humidity, and dust. A tubular member or a wrapping member is further provided to fit over a section of the cluster section other than the lap section in order to facilitate extension through a holed mechanism device, such as a hinge, and to improve resistance against flexing and bending.