Patents by Inventor Chih-Hsien Chou

Chih-Hsien Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040040730
    Abstract: A cable includes a plurality of twisted pairs of conductors in a dense matrix form defining columns and rows thereof in a rectangular coordinate system wherein the twisted pairs in the same row have the same twist direction while have opposite twist directions with those in the two neighboring rows aside, and wherein for each row there is a ninety degrees phase shift between every adjacent two pairs and for each column there is a ninety degrees phase shift between every adjacent two pairs.
    Type: Application
    Filed: August 27, 2002
    Publication date: March 4, 2004
    Inventor: Chih-Hsien Chou
  • Publication number: 20040035597
    Abstract: A cable includes a plurality of twisted pairs of conductors in a dense hexagonal matrix-like form defining thereof horizontal rows and oblique columns with each other in a rectangular coordinate system wherein the twisted pairs in the same row have the same twist direction while have opposite twist directions with those in the two neighboring rows aside, and wherein for each row there is a ninety degrees phase shift between every adjacent two pairs and for each column there is a non-ninety degrees phase shift between every adjacent two pairs.
    Type: Application
    Filed: August 26, 2003
    Publication date: February 26, 2004
    Inventor: Chih-Hsien Chou
  • Publication number: 20030122717
    Abstract: A dual band antenna for an electronic device includes a ground patch (10) having a connecting portion (101) and a bending portion (102), a first radiating branch (11) transversely extending from the connecting portion, and a second radiating branch (12) partly surrounding the first radiating branch and including a connecting patch (121) extending from the connecting portion and a radiating patch (120) extending from the connecting patch. The connecting portion, the first radiating branch and the connecting patch are located in a same first plane. The bending portion and the radiating patch respectively bend at predetermined angles to the first plane to form a bending structure adapted for an irregular installation space in the electronic device.
    Type: Application
    Filed: December 29, 2001
    Publication date: July 3, 2003
    Inventors: Chuck Hood, Chung-Ta Cheng, Chih-Hsien Chou, Chien-Hsun Huang
  • Patent number: 6577277
    Abstract: An antenna (1) includes a first radiating branch (20), a second radiating branch (30), a grounding plate (40), a linking segment (121), a connecting plate (60), and a feed cable (50). The first radiating branch is in a first plane and is provided to receive/transmit signals in a first frequency band. A feed point (21) is formed on the first radiating branch. The second radiating branch is in a second plane perpendicular to the first plane and is provided to receive/transmit signals in a second frequency band. The grounding plate is in a third plane facing the first plane for fixing and grounding the antenna. The feed cable includes a core conductor (51) and an outer shield conductor (53). The core conductor is electrically connected to the feed point for feeding signals into the antenna. The outer shield conductor is soldered to the grounding plate.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: June 10, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chien-Hsun Huang, Chih-Hsien Chou, Chung Ta Cheng
  • Patent number: 6577278
    Abstract: A dual band antenna for an electronic device includes a ground patch (10) having a connecting portion (101) and a bending portion (102), a first radiating branch (11) transversely extending from the connecting portion, and a second radiating branch (12) partly surrounding the first radiating branch and including a connecting patch (121) extending from the connecting portion and a radiating patch (120) extending from the connecting patch. The connecting portion, the first radiating branch and the connecting patch are located in a same first plane. The bending portion and the radiating patch respectively bend at predetermined angles to the first plane to form a bending structure adapted for an irregular installation space in the electronic device.
    Type: Grant
    Filed: December 29, 2001
    Date of Patent: June 10, 2003
    Assignees: Hon Hai Precision Ind. Co., Ltd., Dell Products, L.P.
    Inventors: Chuck Hood, Chung-Ta Cheng, Chih-Hsien Chou, Chien-Hsun Huang
  • Patent number: 6348651
    Abstract: A twisted-pair cable includes a plurality of twisted pairs of conductors closely side by side arranged one another. The pair of conductors are twisted with some degrees axially offset relative to the adjacent twisted pair of conductors, whereby for each victim conductor, the induced signals can be eliminated within each twisted cycle, so that the crosstalk at the far end of the cable can be reduced.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: February 19, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chih-Hsien Chou, David Quiroz, Joseph Tang
  • Patent number: 6235995
    Abstract: An FPC assembly (10) includes a circuit unit (12) with two different pitch arrangement connectors (14, 16) at two opposite ends. The circuit unit (12) includes a signal FPC (18) and a grounding FPC (20). A buffer layer (22) with adhesives on two opposite surfaces (24, 26) is sandwiched between the signal FPC (18) and the grounding FPC (20), and thus the signal FPC (18), the buffer layer (22) and the grounding FPC (20) are adhesively fastened with one another as one circuit unit (12). The signal FPC (18), the buffer layer (22) and the grounding FPC (20) respectively include contact tail holes (34, 35) at two opposite ends for receivable engagement with the corresponding contact tails (36, 37) of the connectors (14, 16).
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: May 22, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ken Cheng, Chih-Hsien Chou, Eric Juntwait
  • Patent number: 6227917
    Abstract: A contact (16) of an electrical connector (10) includes a base (18) fixed in a corresponding slot (14) defined in a housing (12) of the connector and a spring beam (22) extending from the base for resiliently engaging with a circuit board inserted into the connector. The contact is made from a thin metal sheet by blanking. The spring beam of the contact has a cross-sectional area determined by first and second dimensions thereof. The second dimension corresponds to the thickness (T) of the metal sheet and the first dimension (W) is parallel to the surface of the metal sheet and thus is allowed to increase as desired in the blanking process. The increase of the first dimension increases the cross-sectional area thereby reducing the inductance of the spring beam.
    Type: Grant
    Filed: August 23, 1999
    Date of Patent: May 8, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chih-Hsien Chou
  • Patent number: 6139358
    Abstract: A cable assembly comprises a substrate forming first and second mating portions and a ground pad. A first connector is assembled to the first mating portion and a ribbon cable electrically connected to the first mating portion. A ground plane is assembled to the ribbon cable and electrically connected to the ground pad of the substrate at one end. A second connector is connected to another end of the ribbon cable. A metal tab electrically connected to ground terminals of the second connector at one end and electrically connected to the ground plane at another end.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: October 31, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ken Cheng, Chih-Hsien Chou, Eric Juntwait
  • Patent number: 6111203
    Abstract: A ground plane cable assembly (10) includes a flat ribbon cable (12) and a ground plane (18) sandwiching a dielectric spacer (20) therebetween wherein several openings are provided in the dielectric spacer (20) to lower the capacitance between the flat ribbon cable (12) and the ground plane (18) so that the impedance of the whole cable assembly (10) can be raised to a relative high value without increasing the thickness of the dielectric spacer (20).
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: August 29, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ken Cheng, Chih-Hsien Chou, Eric Juntwait