Abstract: An immersion cooling tank includes a tank body and a liquid flow tube. The tank body holds a coolant and an electronic device. The tank body defines an inlet and an outlet. The inlet and the outlet are respectively located at opposite ends of the electronic device for inputting and outputting the coolant. The coolant flows through the electronic device. The liquid flow tube includes at least one adjuster. The liquid flow tube is located inside the tank body and coupled to at least one of the inlet or the outlet. The at least one adjuster faces the electronic device for controlling an amount of the coolant flowing in or out of the tank body.

Abstract: A display apparatus includes a wireless transmission unit and a display panel. The display panel includes a substrate, a plurality of pixel units and a signal line. The substrate includes a display region and a periphery region. The periphery region surrounds the display region. The pixel units are disposed on the display region. Each of the pixel units includes an active device and a pixel electrode. The active device is electrically connected to the pixel electrode. The signal line is on the periphery region. As viewed from a top view, the signal line has an annular shape having a gap and surrounds the display region.

Abstract: An apparatus for inserting a seal member into a seal groove includes a tray. The tray includes a holding groove formed in a front surface for containing the seal member. The holding groove is sized and shaped to correspond with the seal groove. A method of installing a seal member into a seal groove includes aligning the holding groove with the seal groove, and applying a pressure to a back surface of the tray, thereby deforming the tray and inserting the seal member into the seal groove.

Abstract: A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base portion and a fin portion over the base portion. The semiconductor device structure includes an epitaxial structure over the fin portion. The semiconductor device structure includes a dielectric fin over the base portion. The semiconductor device structure includes a silicide layer between the dielectric fin and the epitaxial structure. A void is between the silicide layer and the dielectric fin.

Abstract: A method for manufacturing a semiconductor device includes forming a conductive feature in a first dielectric layer; forming a second dielectric layer on the first dielectric layer; forming a trench that penetrates through the second dielectric layer, and terminates at the conductive feature; forming a contact layer in the trench and on the conductive feature; etching back the contact layer to form a first via contact feature in the trench, the first via contact feature being electrically connected to the conductive feature; and forming a second via contact feature on the first via contact feature in the trench.

Abstract: An antenna structure for a metal-cased electronic device includes a radiator, a feed portion, and a slit. The feed portion can feed signals into the radiator, the radiator includes a first end and a second end, the first end disposes a first radiation portion, the second end disposes a second radiation portion and a third radiation portion, the second radiation portion and the third radiation portion are coupled to each other to radiate a radiation signal at a first frequency band, the slit and the radiator is spaced at intervals, and the slit is coupled to the first radiation portion to radiate the radiation signal at a second frequency band. The present disclosure also provides an electronic device with the antenna structure.

Abstract: A bus system is provided. A plurality of slave devices are electrically connected to a master device through an enhanced serial peripheral interface (eSPI) bus. The slave devices are electrically connected together via a control line. A first slave device is configured to provide a first clock signal to each second slave device via the control line, so that a second clock signal of each second slave device is synchronized with the first clock signal. After the second clock signals are synchronized with the first clock signal, each second slave device is configured to adjust a phase of the second clock signal in a clock phase shift stage, so that each second clock signal has a phase difference with the first clock signal. The phase differences between the second clock signals of the second slave devices and the first clock signal are different.

Abstract: A winding mechanism includes a housing, an inner cylinder and a wire. The housing is formed with an accommodating space therein. An inner surface of the housing is formed with an internal thread structure. The inner cylinder is disposed in the accommodating space and defines a central axis. An outer surface of the inner cylinder is formed with an external thread structure. The external thread structure is cooperated with the internal thread structure. The inner cylinder is capable of displacing along the central axis by rotating relative to the housing. The external thread structure includes at least two contact portions and at least two non-contact portions, and gaps are formed between the non-contact portions of the external thread structure and the internal thread structure. An end of the wire is connected to the inner cylinder and is wound along the external thread structure of the inner cylinder.

Abstract: An image processing system and an image processing device are provided. The image processing system includes an electronic device and the image processing device. The image processing device is connected to the electronic device. The image processing device displays a floating three-dimensional input device image information. The image processing device interacts with an object through the three-dimensional input device image information to generate a plurality of control signals, and transmits the plurality of control signals to the electronic device.

Abstract: A lamp, a lamp system, a method for assembling a lamp system, and a method for disassembling a lamp system are provided. The lamp includes a frame body, a light guide plate, a light source, and a connecting mechanism. The frame body includes two side covers and two end caps. An accommodating space is formed among the side covers and the end caps. The light guide plate is disposed in the accommodating space. The light source is disposed in one of the side covers. The connecting mechanism includes an electrical connecting assembly and a suspension member. The electrical connecting assembly is connected to the light source to form an electrical loop. Each of the end caps has a groove, and one end of the suspension member is passed through one of the grooves from a first end of the groove and is positioned in a second end of the groove.

Abstract: A stereoscopic image display device is provided and includes a flat panel display unit, a lens array unit, and a spacer unit. The flat panel display unit has a display surface. The lens array unit includes at least one condenser lens, which is disposed on a side of the display surface. The spacer unit is disposed between the display surface and the condenser lens, such that the lens array unit and the flat panel display unit are spaced apart from each other. In a light field system of the stereoscopic image display device, an object distance between the display surface of the flat panel display unit and the condenser lens of the lens array unit is configured to enable an absolute value of a central depth plane (CDP) of the stereoscopic image display device in the light field system to be between 1 mm and 200 mm.

Abstract: A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.

Abstract: A cooling and heating energy saving system includes a cooling and heating device, a data center, a boiler, a heat exchanger, and a circulating pump. The boiler receives excess heat of the data center and heat generated by the cooling and heating device, and then generates high-temperature heat and transfers the high-temperature heat to an indoor heating device. The heat exchanger receives heat from the cooling and heating device and the data center. The circulating pump receives the heat generated by the data center and transmits the heat to an outdoor cold source, and further transmits the outdoor cold source to an indoor device through the heat exchanger.

Abstract: A semiconductor device includes a substrate, a plurality of nanosheets, a plurality of source/drain (S/D) features, and a gate stack. The substrate includes a first fin and a second fin. The first fin has a first width less than a second width of the second fin. The plurality of nanosheets is disposed on the first fin and the second fin. The plurality of source/drain (S/D) features are located on the first fin and the second fin and abutting the plurality of nanosheets. A bottom surface of the plurality of source/drain (S/D) features on the first fin is equal to or lower than a bottom surface of the plurality of source/drain (S/D) features on the second fin. The gate stack wraps each of the plurality of nanosheets.

Abstract: A display device includes a screen, a screen stand and a fixing module. The screen stand is pivotally connected to the screen. The fixing module is connected to the screen stand and configured to clamp a first surface and a second surface of a board and includes a connecting element, a first abutting element and a second abutting element. The first abutting element is fixed to the connecting element and configured to abut against the first surface of the board. The second abutting element is pivotally connected to the connecting element and includes an abutting end configured to abut against the second surface of the board.

Abstract: Disclosed herein are peptide fragments of Amuc_1100* and the use thereof. The peptide is shown to be a ligand to activate TLR2 and is used to treat obesity and the related disease or condition. The peptide of the present invention is further used in the treatment of intestinal cancer, promoting immune response, and intestinal epithelial barrier dysfunction.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base portion and a fin portion over the base portion. The semiconductor device structure includes an epitaxial structure over the fin portion. The semiconductor device structure includes a dielectric fin over the base portion. The semiconductor device structure includes a silicide layer between the dielectric fin and the epitaxial structure. A distance between the silicide layer and the dielectric fin increases toward the base portion.

Abstract: The present disclosure provides a lamp and a lamp system. The lamp includes two opposing side covers, a light guide plate, at least one light source and an electrical connecting assembly. The light guide plate has a light incident surface and a light emitting surface connected to the light incident surface, and the light emitting surface of the light guide plate is a curved surface. The light source is disposed in one of the side frames, and the light source is disposed near the light incident surface of the light guide plate. The electrical connecting assembly is connected to the light source to form an electrical loop.

Abstract: A semiconductor package element includes a die, a passive layer, a conductive structure and an encapsulation layer. The die includes a first surface, a second surface and a third surface. The second surface is opposite to the first surface. The third surface is connected between the first surface and the second surface. The passive layer is disposed on the first surface and formed with a hole. The conductive structure is electrically coupled to the die through the hole. The encapsulation layer covers the first surface and the third surface of the die, wherein the passive layer is embedded in the encapsulation layer, a portion of the conductive structure is embedded in the encapsulation layer, and the other portion of the conductive structure protrudes from an etched surface of the encapsulation layer, the etched surface is formed by plasma etching.