Abstract: A heat dissipating system for a data center includes a data center and an air processing unit. The data center includes an enclosure and an electronic device, and defines a first air vent and a second air vent. The air processing unit includes a case and an air processing device. The case defines a first air inlet, a second air inlet, and a first air outlet. At least one air inlet damper is mounted on the case, and a first return air damper is mounted in the case. The data center can adjust cooling based on ambient temperature through the air inlet damper and the first return air damper.

Abstract: A wide-angle illumination device includes a base, a first light guiding module and two second light guiding modules. The base includes a central region and two lateral regions, and the two lateral regions are respectively located on opposite positions of the central region. A first light emitting module is disposed on the central region, and two second light emitting modules are disposed on the two lateral regions. The first light guiding module is disposed on the central region and matched with the first light emitting module, to guide a first optical signal of the first light emitting module toward a front of the base. The two second light guiding modules are disposed on the lateral regions and matched with the second light emitting modules, to guide a second optical signal of the second light emitting module out of an end of the base.

Abstract: A light emitting module includes a lens and first and second light sources aligning with the lens. The lens includes a first biconcave section having a first light-entrance concave surface and a first light-exit concave surface, a second biconcave section having a second light-entrance concave surface and a second light-exit concave surface, and a shared section having a light-exit shared surface. A tangent slope of the shared section where the light-exit shared surface is connected to the first light-exit concave surface is less than a tangent slope of the first biconcave section where the first light-exit concave surface is connected to the light-exit shared surface. A tangent slope of the shared section where the light-exit shared surface is connected to the second light-exit concave surface is larger than a tangent slope of the second biconcave section where the second light-exit concave surface is connected to the light-exit shared surface.

Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.

Abstract: Disclosed herein are embodiments of sensor devices comprising a sensing component able to determine the presence of, detect, and/or quantify detectable species in a variety of environments and applications. The sensing components disclosed herein can comprise MOF materials, plasmonic nanomaterials, or combinations thereof. In an exemplary embodiment, light guides can be coupled with the sensing components described herein to provide sensor devices capable of increased NIR detection sensitivity in determining the presence of detectable species, such as gases and volatile organic compounds. In another exemplary embodiment, optical properties of the plasmonic nanomaterials combined with MOF materials can be monitored directly to detect analyte species through their impact on external conditions surrounding the particle or as a result of charge transfer to and from the plasmonic material as a result of interactions with the plasmonic material and/or the MOF material.

Abstract: A waterproof cabinet includes a cabinet body, a cooling device and a waterproof device. The cabinet body includes a gate, the cooling device is slidably received in the cabinet body via the gate. The waterproof cabinet can be switched between a storage state, where the cooling device is accommodated in the cabinet body, and a working state, where the cooling device is located out of the cabinet body and the connection portions of the cooling device and the cabinet body are sealed by the waterproof device. A container data center is further disclosed.

Abstract: A waterproof cabinet includes a cabinet body, a cooling device and a waterproof device. The cabinet body includes a gate, the cooling device is slidably received in the cabinet body via the gate. The waterproof cabinet can be switched between a storage state, where the cooling device is accommodated in the cabinet body, and a working state, where the cooling device is located out of the cabinet body and the connection portions of the cooling device and the cabinet body are sealed by the waterproof device. A container data center is further disclosed.

Abstract: Disclosed herein are embodiments of sensor devices comprising a sensing component able to determine the presence of, detect, and/or quantify detectable species in a variety of environments and applications. The sensing components disclosed herein can comprise MOF materials, plasmonic nanomaterials, redox-active molecules, a metal, or any combinations thereof. In some exemplary embodiments, optical properties of the plasmonic nanomaterials and/or the redox-active molecules combined with MOF materials can be monitored directly to detect analyte species through their impact on external conditions surrounding the material or as a result of charge transfer to and from the plasmonic nanomaterial and/or the redox-active molecule as a result of interactions with the MOF material.

Abstract: A heat dissipation system for cabinet servers supported on a raised floor includes a condenser, airflow adjusting apparatus, a controller, and a temperature sensor located at an air outlet of each cabinet server. The raised floor defines air outlets adjacent to each cabinet server. The adjusting apparatus are mounted to the raised floor and aligning with the air outlets. Each of the airflow adjusting apparatus includes a number of shielding members rotatable relative to the raised floor and aligning with the air outlets, and a motor electrically coupled to the controller. The temperature sensors are electrically coupled to the controller. The condenser generates cool air entering the raised floor through the air inlet, to enter the cabinet servers through the airflow adjusting apparatus and the air outlets. The controller controls the shielding members to rotate, to change the opening size of the air outlets of the raised floor.

Abstract: A heat dissipating system for a data center includes a return air area and an installation area. The return air area defines a return air damper and an air outlet, and the installation area defines an air inlet damper and an air outlet damper. The installation area includes a fan control unit, a humidity control unit and an electronic device. When the humidity control unit detects that the humidity value in the installation area is greater than a standard value, the humidity control unit controls the return air damper to partly open. Warmed air generated by the electronic device partly flows to the return air area through the return air damper, and the cold air and the warmed air are mixed. The mixed air is configured to dissipate heat for the electronic device, and the humidity in the data center is reduced.

Abstract: Highly conductive silver may be fabricated at room temperature using in-situ reactive silver precursor inks by microreactor-assisted printing without any post-processing. Reactive silver nanoinks, synthesized in-situ from the microreactor, may be directly delivered onto glass and polymeric substrates without any surface treatment to form a highly dense and uniform silver feature. The distribution of the reactive silver nanoinks can be controlled by adjusting the flow rate of the continuous flow. Silver lines may be fabricated using the in-situ reactive precursors delivered via a micro-channel applicator.

Abstract: A heat exchange system includes a cold source, a heat dissipation apparatus, a water storage tank, a heating portion, and a cooling portion. The heating portion is coupled between the cold source and the water storage tank. The cooling portion is coupled between the heat dissipation apparatus and the water storage tank. The cooling portion transmits heat of the heat dissipation apparatus to water of the water storage tank to cool the heating portion, and the heating portion transmits heat of the water of the water storage tank to the cold source to heat the cold source.

Abstract: Systems and methods for synthesizing high-quality nanocrystals via segmented, continuous flow microwave-assisted reactor were developed.

Abstract: A light compensating system in accordance with this invention comprises a plurality of light emitting devices, an image capturing device, and a processing device. The processing device is respectively coupled to the plurality of light emitting devices and the image capturing device. Each light emitting device is used for emitting light to illuminate a certain area in space. The image capturing device is used for capturing a first image, which can be defined as a plurality of image blocks. Each image block is affected by the light from at least one corresponding light emitting device. The processing device is used for analyzing a brightness value of at least one of the plurality image block and adjusting at least one light emitting device corresponding to the analyzed image block based on the brightness value.

Abstract: A lighting device includes a light source, a driving module, a sensing module, and a control module. The driving module is configured to drive the light source. The sensing module is configured to obtain a brightness value corresponding to the environmental scene. The control module is configured to control the driving module to use a first current to drive the light source, control the sensing module to obtain a first brightness value, control, when the first brightness value is less than a reference brightness value, the driving module to use a second current to drive the light source, control the sensing module to obtain a second brightness value, the second current being greater than the first current by a predetermined amplitude value, compare the second brightness value with the first brightness value, determine that the light source is in a thermal attenuation state or an optical attenuation state.

Abstract: A lighting device includes a light source, a driving module, a sensing module, and a control module. The driving module is configured to drive the light source. The sensing module is configured to obtain a brightness value corresponding to the environmental scene. The control module is configured to control the driving module to use a first current to drive the light source, control the sensing module to obtain a first brightness value, control, when the first brightness value is less than a reference brightness value, the driving module to use a second current to drive the light source, control the sensing module to obtain a second brightness value, the second current being greater than the first current by a predetermined amplitude value, compare the second brightness value with the first brightness value, determine that the light source is in a thermal attenuation state or an optical attenuation state.

Abstract: Aspects of the present disclosure are directed to methods and apparatuses involving a chip carrier having openings therein that align integrated circuit (IC) chips relative to an alignment feature. The IC chips and carrier are tested, such as by final testing the affixed IC chips after manufacture, and further testing after subjecting the affixed IC chips to one or more stress conditions. A test probe is aligned to one or more contacts on each chip based on the location of an alignment feature of the carrier relative to the opening in which the IC chip being tested is located. Responsiveness of the IC chip, before and after application of the one or more stress conditions, can be assessed by probing the IC chip via the aligned test probe, and assessing electrical signals received over the test probe.

Abstract: A data center cooling system utilizing natural elements in the environment includes a housing, a chimney, and a data center. The housing defines a cold air channel and a hot air channel separated by at least one separating piece. The chimney is mounted on the housing and aligned to the hot air channel. The data center is located in the housing. The data center includes an air inlet side and an air outlet side. The air inlet side is located in the cold air channel. The air outlet side is located in the hot air channel. Air from the cold air channel flows in the data center from the air inlet side to absorb heat of the data center, flows out of the data center into the hot air channel via the air outlet side, and is exhausted out of the housing via the chimney.

Abstract: The invention relates generally to remote data collecting systems and methods. In a general aspect, the present invention provides a remote data collecting system comprising a measuring device having at least two scales in communication with a web server. The web server can be used to display data from the measuring device on a website to be accessed by one or more users, for example, using a computing device. The remote data collecting system is particularly useful for real-time, uncontrolled environment (e.g., in-home) product testing.

Abstract: An image monitoring apparatus includes a casing, a camera module in the casing, and a lighting module disposed on the casing and located above or under the camera module on a plane corresponding to a vertical angle of view of the camera module. A horizontal light-emitting plane of a LED of the lighting module is perpendicular to the plane corresponding to the vertical angle of view. A lens of the lighting module covers the LED and has a convex light-exit surface, a bottom surface, and a concave light-entrance surface. A long axis of the convex light-exit surface is located at the horizontal light-emitting plane. A section thickness of the lens from the concave light-entrance surface to the convex light-exit surface along the long axis is greater than a section thickness of the lens from the concave light-entrance surface to the convex light-exit surface along a normal of the bottom surface.