Abstract: A backlight module includes a housing, a light source, at least one supporting member, a diffuser plate, and an optical film. The housing includes a backplate portion, a sidewall portion, and a panel mounting platform. The sidewall portion is arranged along a periphery of the backplate portion. The panel mounting platform is connected and bent relative to the sidewall portion, such that the panel mounting platform, the sidewall portion, and the backplate portion form a concavity. The light source is disposed on the backplate portion. The supporting member is disposed in the housing and at least partially located in the concavity. The optical film and the diffuser plate are stacked on the supporting member. The supporting member has a reflective incline structure that is configured to directly reflect light traveling towards an inner side surface of the housing towards the diffuser plate.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: Aspects of camera-based pallet placement detection and notification are described. An image is captured using a camera device. The image includes a pallet placement region within a field of view of a camera device. A pallet placement is detected by determining at least one orthogonal intersection between a plurality of position lines identified from the image. A user interface provides the detected pallet position to facilitate corrective measures.

Abstract: A storage device includes a base and a plurality of wire management modules. The wire management module includes a partition and a positioning assembly. The partition is disposed to the base and has a supporting surface and a wire management groove. The wire management groove is located at the supporting surface for accommodating a wire. The positioning assembly includes a first positioning member, a second positioning member and an assembling member. The first positioning member is disposed to the partition. The second positioning member is connected to the assembling member. The assembling member is assembled together with the partition. The second positioning member is rotatable around the edge of the second positioning member as a rotation axis in relation to the assembling member to be at either a fastening position or a releasing position. The partitions and the base jointly form a plurality of accommodation spaces.

Abstract: A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided.

Abstract: A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided.

Abstract: A storage device includes a base and a plurality of wire management modules. The wire management module includes a partition and a positioning assembly. The partition is disposed to the base and has a supporting surface and a wire management groove. The wire management groove is located at the supporting surface for accommodating a wire. The positioning assembly includes a first positioning member, a second positioning member and an assembling member. The first positioning member is disposed to the partition. The second positioning member is connected to the assembling member. The assembling member is assembled together with the partition. The second positioning member is rotatable around the edge of the second positioning member as a rotation axis in relation to the assembling member to be at either a fastening position or a releasing position. The partitions and the base jointly form a plurality of accommodation spaces.

Abstract: A charging apparatus is for charging an electronic device and accommodating an electronic device and a power cable connected to the electronic device, the power cable has a transformer. The charging apparatus includes a case body, a partition member and a power supply component. The case body has an accommodation space. The accommodation space has a main accommodating zone, a power supply zone and a sub-accommodating zone. The power supply zone is located above the main accommodating zone. The sub-accommodating zone is located on a side of the main accommodating zone. The sub-accommodating zone is for accommodating the transformer. The partition member is disposed in the main accommodating zone. The main accommodating zone is divided into a plurality of housing spaces by the partition member divides for accommodating the electronic device. The power supply component is disposed in the power supply zone for being coupled to the power cable.

Abstract: A charging device is for charging at least one electronic device and fixing a cable which is connected to the at least one electronic device. The charging device includes a tray, a power supply part, at least one partition member and at least one cable management member. The tray has a loading zone. The power supply part is connected to the tray. The at least one partition member is disposed on the tray. The loading zone is divided into a plurality of loading sub-zones by the at least one partition member, and each of the loading sub-zones is for housing at least one electronic device. The at least one cable management member is disposed on the at least one partition member for fixing the cable.

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.

Abstract: A linear actuator includes a motor, a movable unit, and a stroke control unit. The motor includes a spindle. The movable unit includes a worm gear and a rotary shaft. The worm is provided with annular spiral or helix teeth. The stroke control unit includes at least one transmission member and at least one micro switch. The at least one transmission member is engaged with and driven by the spiral or the helix teeth of the movable unit for synchronical rotation to activating or deactivating the micro switch. In this way, the linear actuator is simplified in structure and reduced in volume.

Abstract: An LED bay light includes a heat pipe module, a light condenser and at least one LED light emitting module. The heat pipe module is coupled to a side of the light condenser, and both are made of a thermally conductive material. The light condenser includes a top plate and at least one reflecting plate. The LED light emitting module is installed on a side of the top plate and covered by an inner side of the reflecting plate, and the inner side of the reflecting plate is coated with a color layer. The LED bay light dissipates heat produced from the LED light emitting module by the heat pipe module and the light condenser simultaneously to improve the heat dissipation efficiency effectively, and the light of the LED bay light can change its color through the reflection from the reflecting plate or the color layer.

Abstract: A circuit capable of automatically calibrating a resonant frequency of an antenna includes the antenna, a switch, a conversion unit, a count comparator, and a capacitor array. The switch is coupled to the antenna for being turned on and turned off according to a pulse. The antenna is used for generating the resonant frequency according to on and off of the switch. The conversion unit is coupled to the antenna for generating a clock according to a signal with the resonant frequency. The count comparator is coupled to the conversion unit for counting a number generated by a reference clock during a period of the clock, and comparing the pulse number with a predetermined value to generate an adjustment signal. The capacitor array is used for adjusting capacitance of the capacitor array according to the adjustment signal.

Abstract: A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.

Abstract: A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Abstract: A resistance regulating balance board includes a disc body disposed onto a semispherical base. A resistance member is disposed inside the semispherical base. An elastic component and a locking member are disposed inside a containing chamber within the resistance member. A screw rod passes through the disc body, the semispherical base and the elastic component to engage with the locking member so that a user can rotate the screw rod to regulate a resistance value generated between the resistance member and the semispherical base to change the magnitude of motion resistance of the balance board, thereby achieving optimum exercise and balancing effects.

Abstract: A heat sink system and a heat sinking method having auto switching function are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Abstract: A heat dissipating structure of a lightweight lamp cup 10 made of a porous material includes a containing cavity 11 at an end of the lamp cup 10, a lamp holder 30 at another end of the containing cavity 11, a metal hood 60 sheathed with the lamp holder 30 and covered onto an external side of the lamp cup 10, a heat conduction medium 50 between the lamp cup 10 and the metal hood 60, and a light emitting unit 20 contained in the containing cavity 11 of the lamp cup 10, such that the heat produced by the light emitting unit 20 can be conducted form the lamp cup 10 to the metal hood 60 and dissipated from the metal hood 60 to the outside.

Abstract: A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly.