Abstract: A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly.

Abstract: An active heat dissipating LED illumination lamp includes a substrate holder, at least one LED illumination assembly, a plurality of heat pipes and a heat sink module. The LED illumination assembly is installed on a side of the substrate holder, and the heat pipes and the heat sink module are installed on the other side of the substrate holder, and a plurality of first diversion channels is formed between the heat pipes, and each heat dissipating fin has at least one ventilation hole occupying 12%˜60% of the total area to form a second diversion channel, and a second interval is defined between the bottom of the heat sink module and the substrate holder. When the heat generated by the LED illumination assembly is provided for performing heat conduction, the heat is guided actively to the second diversion channel to perform heat convection.

Abstract: A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the fin.

Abstract: A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat, as a molded one-piece member, combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other.

Abstract: A linear actuator includes a motor, a movable unit, and a stroke control unit. The motor includes a spindle. The movable unit includes a worm gear and a rotary shaft. The worm is provided with annular spiral or helix teeth. The stroke control unit includes at least one transmission member and at least one micro switch. The at least one transmission member is engaged with and driven by the spiral or the helix teeth of the movable unit for synchronical rotation to activating or deactivating the micro switch. In this way, the linear actuator is simplified in structure and reduced in volume.

Abstract: A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins.

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).

Abstract: A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.

Abstract: A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe.

Abstract: The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

Abstract: A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Abstract: A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102).

Abstract: A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

Abstract: An assembly structure for a LED lamp includes a cover plate, a LED module, fasteners and a mask. An inner surface of the cover plate is provided with a fixing portion. Both sides of the cover plate are formed with a slot respectively. The LED module has a substrate and a plurality of LED mounted on the substrate. The substrate is provided with an insertion hole. One end of the fastener is detachably connected into the insertion hole of the substrate and the other end thereof is fixed to the fixing portion. The mask is made of transparent materials and has an accommodating space for allowing the LED module to be disposed therein. Both sides of the mask defining the accommodating space are formed with a locking flange for inserting into the slot of the cover plate. With the above arrangement, the operator can assemble or detach the LED lamp quickly.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.

Abstract: A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die.