Patents by Inventor Chih Hung Chuang

Chih Hung Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12261396
    Abstract: A circuit board is for inserting an expansion card with a positioning part. The circuit board includes a board body, a slot, a release assembly, and a transmission mechanism. The release assembly includes a release body, a blocking member, and an elastic member connected between the release body and the blocking member. The release body includes a blocking part for limiting the positioning part. The transmission mechanism includes a linkage part and a force applying part. When the force applying part receives an external force, the linkage part moves to move the release assembly toward a first direction, the elastic member returns to an original position to drive the blocking member to push against the positioning part to move out of the blocking part and to be located at a release position continuously, so as to release the limit of the positioning part by the blocking part.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: March 25, 2025
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
  • Patent number: 12237618
    Abstract: An interface card assembly adapted for fixing an M.2 interface card to a circuit board body with an M.2 connector is provided. The M.2 interface card includes a connecting end and an end. The interface card assembly includes a heat dissipation plate and a fastener. The heat dissipation plate is disposed at a position adjacent to the M.2 connector, and the heat dissipation plate includes a hole. The fastener is detachably disposed in the hole. The fastener includes a main body and a cantilever, and a clamping part is disposed between the main body and the cantilever. When the M.2 interface card is inserted into the M.2 connector through the connecting end, the fastener moves relative to the heat dissipation plate at the end, so that the M.2 interface card extends into the clamping part and is clamped between the main body and the cantilever.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: February 25, 2025
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
  • Publication number: 20240407121
    Abstract: A main board assembly adapted to mount an expansion element is provided. The expansion element includes an electrical connection portion. One end of the electrical connection portion includes a buckling portion. The main board assembly includes a main board, a shielding board, and an operating member. The main board includes a slot and a buckling member. The slot is adapted for insertion of the electrical connection portion. The buckling member is movably disposed at one end of the slot, and is adapted to buckle the buckling portion. The shielding board is disposed on one side of the main board and includes an opening. The operating member includes a first end and a second end. The first end is coupled to the buckling member, and the second end extends through the opening to one side of the shielding board away from the main board.
    Type: Application
    Filed: October 4, 2023
    Publication date: December 5, 2024
    Inventors: Po-Ting CHEN, Chang-Hung CHEN, Chih-Hung CHUANG
  • Patent number: 11868187
    Abstract: A circuit board includes a board body, a card slot, a release structure, and a transmission mechanism. The card slot is disposed on the board body and adapted for inserting an expansion card. The release structure is rotatably disposed beside the card slot. The transmission mechanism includes a contact part and a stressed part that are linked to each other, wherein the contact part is connected to the release structure. When the stressed part receives an external force, the contact part is moved correspondingly, so that the release structure is rotated relative to the card slot, thereby releasing the expansion card.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: January 9, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
  • Patent number: 11853131
    Abstract: A circuit board is applied to be inserted an expansion card, the expansion card includes a positioning part. The circuit board includes a board body, a slot, a release structure and a transmission mechanism. The slot is disposed on the board body. The release structure is movably disposed beside the slot along a first direction, and includes a first inclined surface and a blocking portion for limiting the positioning part. The transmission mechanism includes a linkage part and a forcing part which are linked with each other. The linkage part is connected to the release structure. When the forcing part receives an external force, the linkage part moves to move the release structure to the first direction, and releases the limitation of the positioning part by the blocking portion.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: December 26, 2023
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
  • Publication number: 20230396022
    Abstract: A circuit board is for inserting an expansion card with a positioning part. The circuit board includes a board body, a slot, a release assembly, and a transmission mechanism. The release assembly includes a release body, a blocking member, and an elastic member connected between the release body and the blocking member. The release body includes a blocking part for limiting the positioning part. The transmission mechanism includes a linkage part and a force applying part. When the force applying part receives an external force, the linkage part moves to move the release assembly toward a first direction, the elastic member returns to an original position to drive the blocking member to push against the positioning part to move out of the blocking part and to be located at a release position continuously, so as to release the limit of the positioning part by the blocking part.
    Type: Application
    Filed: September 26, 2022
    Publication date: December 7, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
  • Publication number: 20230251695
    Abstract: A circuit board is applied to be inserted an expansion card, the expansion card includes a positioning part. The circuit board includes a board body, a slot, a release structure and a transmission mechanism. The slot is disposed on the board body. The release structure is movably disposed beside the slot along a first direction, and includes a first inclined surface and a blocking portion for limiting the positioning part. The transmission mechanism includes a linkage part and a forcing part which are linked with each other. The linkage part is connected to the release structure. When the forcing part receives an external force, the linkage part moves to move the release structure to the first direction, and releases the limitation of the positioning part by the blocking portion.
    Type: Application
    Filed: June 22, 2022
    Publication date: August 10, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
  • Publication number: 20230072319
    Abstract: An interface card assembly adapted for fixing an M.2 interface card to a circuit board body with an M.2 connector is provided. The M.2 interface card includes a connecting end and an end. The interface card assembly includes a heat dissipation plate and a fastener. The heat dissipation plate is disposed at a position adjacent to the M.2 connector, and the heat dissipation plate includes a hole. The fastener is detachably disposed in the hole. The fastener includes a main body and a cantilever, and a clamping part is disposed between the main body and the cantilever. When the M.2 interface card is inserted into the M.2 connector through the connecting end, the fastener moves relative to the heat dissipation plate at the end, so that the M.2 interface card extends into the clamping part and is clamped between the main body and the cantilever.
    Type: Application
    Filed: June 8, 2022
    Publication date: March 9, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
  • Publication number: 20230010194
    Abstract: A circuit board includes a board body, a card slot, a release structure, and a transmission mechanism. The card slot is disposed on the board body and adapted for inserting an expansion card. The release structure is rotatably disposed beside the card slot. The transmission mechanism includes a contact part and a stressed part that are linked to each other, wherein the contact part is connected to the release structure. When the stressed part receives an external force, the contact part is moved correspondingly, so that the release structure is rotated relative to the card slot, thereby releasing the expansion card.
    Type: Application
    Filed: March 31, 2022
    Publication date: January 12, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Po-Ting Chen, Chang-Hung Chen, Chih-Hung Chuang
  • Patent number: 11044027
    Abstract: A wireless transmission performance test system is provided, configured to test wireless transmission performance of a device under test (DUT) which is disposed in a testing chamber. The wireless transmission performance test system includes a directional antenna and a control device. The directional antenna is disposed inside the testing chamber and adjacent to the DUT to receive testing signal generated by the DUT after testing. The signal coupling direction of the directional antenna is directed to the DUT. The control device is configured to receive the testing signal transmitted from the directional antenna, process the testing signal, and generate testing result. A wireless transmission performance test method is also provided herein.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: June 22, 2021
    Assignee: AmTRAN Technology Co., Ltd.
    Inventors: Chien-Cheng Lin, Chih-Hung Chuang
  • Publication number: 20210067257
    Abstract: A wireless transmission performance test system is provided, configured to test wireless transmission performance of a device under test (DUT) which is disposed in a testing chamber. The wireless transmission performance test system includes a directional antenna and a control device. The directional antenna is disposed inside the testing chamber and adjacent to the DUT to receive testing signal generated by the DUT after testing. The signal coupling direction of the directional antenna is directed to the DUT. The control device is configured to receive the testing signal transmitted from the directional antenna, process the testing signal, and generate testing result. A wireless transmission performance test method is also provided herein.
    Type: Application
    Filed: April 16, 2020
    Publication date: March 4, 2021
    Inventors: Chien-Cheng LIN, Chih-Hung CHUANG
  • Patent number: 10692825
    Abstract: A light emitting chip package includes a light-emitting chip, a molding compound, and a redistribution wiring structure. The light-emitting chip includes an emission zone, a first electrode, and a second electrode. The molding compound covers at least a sidewall of the light-emitting chip and supports the light-emitting chip. The redistribution wring structure disposed in the molding compound includes a first interconnect wiring structure electrically connected to the first electrode and a second interconnect wiring structure electrically connected to the second electrode. The first interconnect wiring structure and the second interconnect wiring structure respectively include a first pad and a second pad, and the first pad and the second pad are located at the same side of the light emitting chip package.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: June 23, 2020
    Assignee: HLJ TECHNOLOGY CO., LTD.
    Inventors: Chih-Hung Chuang, Jen-Hsiang Yang
  • Patent number: 10633453
    Abstract: Disclosed herein is a hinge antibody capable of being selectively activated in a target cell or tissue to treat a condition therein. The hinge antibody includes a functional antibody, two inhibitory domains and four cleavable linkers. The functional antibody is capable of treating the condition in an activated state, and has two light chains and two heavy chains. Each inhibitory domain includes a hinge domain of an immunoglobulin and consists of two peptide arms. Each cleavable linker includes a peptide substrate cleavable by an enzyme specifically or highly expressed in the target cell or tissue, and connects one of the peptide arms of the inhibitory domains to the N-terminal of one of the light chains and heavy chains of the functional antibody. Also disclosed herein are methods for preparing and using this hinge antibody.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: April 28, 2020
    Assignees: KAOHSIUNG MEDICAL UNIVERSITY, DCB-USA LLC
    Inventors: Tian-Lu Cheng, Chih-Hung Chuang, Hsiu-Fen Ko, Yun-Chi Lu
  • Publication number: 20190260180
    Abstract: A light emitting chip package includes a light-emitting chip, a molding compound, and a redistribution wiring structure. The light-emitting chip includes an emission zone, a first electrode, and a second electrode. The molding compound covers at least a sidewall of the light-emitting chip and supports the light-emitting chip. The redistribution wring structure disposed in the molding compound includes a first interconnect wiring structure electrically connected to the first electrode and a second interconnect wiring structure electrically connected to the second electrode. The first interconnect wiring structure and the second interconnect wiring structure respectively include a first pad and a second pad, and the first pad and the second pad are located at the same side of the light emitting chip package.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 22, 2019
    Inventors: CHIH-HUNG CHUANG, JEN-HSIANG YANG
  • Publication number: 20190115725
    Abstract: A vertical cavity surface emitting laser (VCSEL) and a method for fabricating the same are provided. The VCSEL includes an epitaxial laminate, a lower electrode layer, an upper electrode layer and a current spreading layer. The epitaxial laminate at least includes a first reflector, a second reflector, and an active layer disposed therebetween for generating an initial laser beam. The upper and lower electrode layers jointly define a current path passing through the active layer, and the upper electrode layer has an aperture for defining a light-emitting region. The current spreading layer disposed on the second reflector and electrically connected to the upper electrode layer includes a plurality of beam splitting structures positioned at a light emergent side thereof, and the beam splitting structures is located in the aperture so that the initial laser beam is divided into a plurality of sub-beams.
    Type: Application
    Filed: October 16, 2018
    Publication date: April 18, 2019
    Inventors: LI-HUNG LAI, LI-WEN LAI, CHIH-HUNG CHUANG, MIN-LUN WU
  • Patent number: 10099512
    Abstract: A universal rotating module is provided. The universal rotating module comprises a suspension carrier, a top cover, a globular element, and a plurality of cushion members. The suspension carrier includes a through hole and a plurality of first fixing portions beside the through hole. The top cover includes a plurality of second fixing portions. The globular element is disposed between the suspension carrier and the top cover. A portion of the globular element passes through the through hole. Each of the cushion members is correspondingly connected with the first fixing portion and the second fixing portion.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: October 16, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chang-Ru Hsieh, Li-Wei Yu, Chang-Hung Chen, Chih-Hung Chuang
  • Patent number: 9884513
    Abstract: A universal rotating module is provided. The universal rotating module comprises a main body including a first portion and two second portions; a main shaft passing through the through groove to pivotally connected to the main body; two bearings sleeved on and pivotally connected to the second portions along the second direction, respectively; two rollers pivotally connected to the second portions along a third direction, respectively; two hemispherical casings fixed to the two bearings, respectively. The first portion includes a through groove extending along a first direction, and the two second portions protrude from opposite sides of the first portion along a second direction, respectively. Each of the hemispherical casing includes a through hole at the top, and a portion of each of the rollers is exposed out of the corresponding through hole.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: February 6, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Li-Wei Yu, Chang-Ru Hsieh, Chang-Hung Chen, Chih-Hung Chuang
  • Publication number: 20170267025
    Abstract: A universal rotating module is provided. The universal rotating module comprises a main body including a first portion and two second portions; a main shaft passing through the through groove to pivotally connected to the main body; two bearings sleeved on and pivotally connected to the second portions along the second direction, respectively; two rollers pivotally connected to the second portions along a third direction, respectively; two hemispherical casings fixed to the two bearings, respectively. The first portion includes a through groove extending along a first direction, and the two second portions protrude from opposite sides of the first portion along a second direction, respectively. Each of the hemispherical casing includes a through hole at the top, and a portion of each of the rollers is exposed out of the corresponding through hole.
    Type: Application
    Filed: March 16, 2017
    Publication date: September 21, 2017
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Li-Wei Yu, Chang-Ru Hsieh, Chang-Hung Chen, Chih-Hung Chuang
  • Publication number: 20170253082
    Abstract: A universal rotating module is provided. The universal rotating module comprises a suspension carrier, a top cover, a globular element, and a plurality of cushion members. The suspension carrier includes a through hole and a plurality of first fixing portions beside the through hole. The top cover includes a plurality of second fixing portions. The globular element is disposed between the suspension carrier and the top cover. A portion of the globular element passes through the through hole. Each of the cushion members is correspondingly connected with the first fixing portion and the second fixing portion.
    Type: Application
    Filed: February 23, 2017
    Publication date: September 7, 2017
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chang-Ru Hsieh, Li-Wei Yu, Chang-Hung Chen, Chih-Hung Chuang
  • Publication number: 20160185875
    Abstract: Disclosed herein is a hinge antibody capable of being selectively activated in a target cell or tissue to treat a condition therein. The hinge antibody includes a functional antibody, two inhibitory domains and four cleavable linkers. The functional antibody is capable of treating the condition in an activated state, and has two light chains and two heavy chains. Each inhibitory domain includes a hinge domain of an immunoglobulin and consists of two peptide arms. Each cleavable linker includes a peptide substrate cleavable by an enzyme specifically or highly expressed in the target cell or tissue, and connects one of the peptide arms of the inhibitory domains to the N-terminal of one of the light chains and heavy chains of the functional antibody. Also disclosed herein are methods for preparing and using this hinge antibody.
    Type: Application
    Filed: May 28, 2014
    Publication date: June 30, 2016
    Applicant: DCB-USA LLC
    Inventors: Tian-Lu Cheng, Chih-Hung Chuang, Hsiu-Fen Ko, Yun-Chi Lu