Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: A circuit board includes a board body, a card slot, a release structure, and a transmission mechanism. The card slot is disposed on the board body and adapted for inserting an expansion card. The release structure is rotatably disposed beside the card slot. The transmission mechanism includes a contact part and a stressed part that are linked to each other, wherein the contact part is connected to the release structure. When the stressed part receives an external force, the contact part is moved correspondingly, so that the release structure is rotated relative to the card slot, thereby releasing the expansion card.

Abstract: A circuit board is applied to be inserted an expansion card, the expansion card includes a positioning part. The circuit board includes a board body, a slot, a release structure and a transmission mechanism. The slot is disposed on the board body. The release structure is movably disposed beside the slot along a first direction, and includes a first inclined surface and a blocking portion for limiting the positioning part. The transmission mechanism includes a linkage part and a forcing part which are linked with each other. The linkage part is connected to the release structure. When the forcing part receives an external force, the linkage part moves to move the release structure to the first direction, and releases the limitation of the positioning part by the blocking portion.

Abstract: A circuit board is for inserting an expansion card with a positioning part. The circuit board includes a board body, a slot, a release assembly, and a transmission mechanism. The release assembly includes a release body, a blocking member, and an elastic member connected between the release body and the blocking member. The release body includes a blocking part for limiting the positioning part. The transmission mechanism includes a linkage part and a force applying part. When the force applying part receives an external force, the linkage part moves to move the release assembly toward a first direction, the elastic member returns to an original position to drive the blocking member to push against the positioning part to move out of the blocking part and to be located at a release position continuously, so as to release the limit of the positioning part by the blocking part.

Abstract: A circuit board is applied to be inserted an expansion card, the expansion card includes a positioning part. The circuit board includes a board body, a slot, a release structure and a transmission mechanism. The slot is disposed on the board body. The release structure is movably disposed beside the slot along a first direction, and includes a first inclined surface and a blocking portion for limiting the positioning part. The transmission mechanism includes a linkage part and a forcing part which are linked with each other. The linkage part is connected to the release structure. When the forcing part receives an external force, the linkage part moves to move the release structure to the first direction, and releases the limitation of the positioning part by the blocking portion.

Abstract: An interface card assembly adapted for fixing an M.2 interface card to a circuit board body with an M.2 connector is provided. The M.2 interface card includes a connecting end and an end. The interface card assembly includes a heat dissipation plate and a fastener. The heat dissipation plate is disposed at a position adjacent to the M.2 connector, and the heat dissipation plate includes a hole. The fastener is detachably disposed in the hole. The fastener includes a main body and a cantilever, and a clamping part is disposed between the main body and the cantilever. When the M.2 interface card is inserted into the M.2 connector through the connecting end, the fastener moves relative to the heat dissipation plate at the end, so that the M.2 interface card extends into the clamping part and is clamped between the main body and the cantilever.

Abstract: A circuit board includes a board body, a card slot, a release structure, and a transmission mechanism. The card slot is disposed on the board body and adapted for inserting an expansion card. The release structure is rotatably disposed beside the card slot. The transmission mechanism includes a contact part and a stressed part that are linked to each other, wherein the contact part is connected to the release structure. When the stressed part receives an external force, the contact part is moved correspondingly, so that the release structure is rotated relative to the card slot, thereby releasing the expansion card.

Abstract: A wireless transmission performance test system is provided, configured to test wireless transmission performance of a device under test (DUT) which is disposed in a testing chamber. The wireless transmission performance test system includes a directional antenna and a control device. The directional antenna is disposed inside the testing chamber and adjacent to the DUT to receive testing signal generated by the DUT after testing. The signal coupling direction of the directional antenna is directed to the DUT. The control device is configured to receive the testing signal transmitted from the directional antenna, process the testing signal, and generate testing result. A wireless transmission performance test method is also provided herein.

Abstract: A wireless transmission performance test system is provided, configured to test wireless transmission performance of a device under test (DUT) which is disposed in a testing chamber. The wireless transmission performance test system includes a directional antenna and a control device. The directional antenna is disposed inside the testing chamber and adjacent to the DUT to receive testing signal generated by the DUT after testing. The signal coupling direction of the directional antenna is directed to the DUT. The control device is configured to receive the testing signal transmitted from the directional antenna, process the testing signal, and generate testing result. A wireless transmission performance test method is also provided herein.

Abstract: A light emitting chip package includes a light-emitting chip, a molding compound, and a redistribution wiring structure. The light-emitting chip includes an emission zone, a first electrode, and a second electrode. The molding compound covers at least a sidewall of the light-emitting chip and supports the light-emitting chip. The redistribution wring structure disposed in the molding compound includes a first interconnect wiring structure electrically connected to the first electrode and a second interconnect wiring structure electrically connected to the second electrode. The first interconnect wiring structure and the second interconnect wiring structure respectively include a first pad and a second pad, and the first pad and the second pad are located at the same side of the light emitting chip package.

Abstract: Disclosed herein is a hinge antibody capable of being selectively activated in a target cell or tissue to treat a condition therein. The hinge antibody includes a functional antibody, two inhibitory domains and four cleavable linkers. The functional antibody is capable of treating the condition in an activated state, and has two light chains and two heavy chains. Each inhibitory domain includes a hinge domain of an immunoglobulin and consists of two peptide arms. Each cleavable linker includes a peptide substrate cleavable by an enzyme specifically or highly expressed in the target cell or tissue, and connects one of the peptide arms of the inhibitory domains to the N-terminal of one of the light chains and heavy chains of the functional antibody. Also disclosed herein are methods for preparing and using this hinge antibody.

Abstract: A light emitting chip package includes a light-emitting chip, a molding compound, and a redistribution wiring structure. The light-emitting chip includes an emission zone, a first electrode, and a second electrode. The molding compound covers at least a sidewall of the light-emitting chip and supports the light-emitting chip. The redistribution wring structure disposed in the molding compound includes a first interconnect wiring structure electrically connected to the first electrode and a second interconnect wiring structure electrically connected to the second electrode. The first interconnect wiring structure and the second interconnect wiring structure respectively include a first pad and a second pad, and the first pad and the second pad are located at the same side of the light emitting chip package.

Abstract: A vertical cavity surface emitting laser (VCSEL) and a method for fabricating the same are provided. The VCSEL includes an epitaxial laminate, a lower electrode layer, an upper electrode layer and a current spreading layer. The epitaxial laminate at least includes a first reflector, a second reflector, and an active layer disposed therebetween for generating an initial laser beam. The upper and lower electrode layers jointly define a current path passing through the active layer, and the upper electrode layer has an aperture for defining a light-emitting region. The current spreading layer disposed on the second reflector and electrically connected to the upper electrode layer includes a plurality of beam splitting structures positioned at a light emergent side thereof, and the beam splitting structures is located in the aperture so that the initial laser beam is divided into a plurality of sub-beams.

Abstract: A universal rotating module is provided. The universal rotating module comprises a suspension carrier, a top cover, a globular element, and a plurality of cushion members. The suspension carrier includes a through hole and a plurality of first fixing portions beside the through hole. The top cover includes a plurality of second fixing portions. The globular element is disposed between the suspension carrier and the top cover. A portion of the globular element passes through the through hole. Each of the cushion members is correspondingly connected with the first fixing portion and the second fixing portion.

Abstract: A universal rotating module is provided. The universal rotating module comprises a main body including a first portion and two second portions; a main shaft passing through the through groove to pivotally connected to the main body; two bearings sleeved on and pivotally connected to the second portions along the second direction, respectively; two rollers pivotally connected to the second portions along a third direction, respectively; two hemispherical casings fixed to the two bearings, respectively. The first portion includes a through groove extending along a first direction, and the two second portions protrude from opposite sides of the first portion along a second direction, respectively. Each of the hemispherical casing includes a through hole at the top, and a portion of each of the rollers is exposed out of the corresponding through hole.

Abstract: A universal rotating module is provided. The universal rotating module comprises a main body including a first portion and two second portions; a main shaft passing through the through groove to pivotally connected to the main body; two bearings sleeved on and pivotally connected to the second portions along the second direction, respectively; two rollers pivotally connected to the second portions along a third direction, respectively; two hemispherical casings fixed to the two bearings, respectively. The first portion includes a through groove extending along a first direction, and the two second portions protrude from opposite sides of the first portion along a second direction, respectively. Each of the hemispherical casing includes a through hole at the top, and a portion of each of the rollers is exposed out of the corresponding through hole.

Abstract: A universal rotating module is provided. The universal rotating module comprises a suspension carrier, a top cover, a globular element, and a plurality of cushion members. The suspension carrier includes a through hole and a plurality of first fixing portions beside the through hole. The top cover includes a plurality of second fixing portions. The globular element is disposed between the suspension carrier and the top cover. A portion of the globular element passes through the through hole. Each of the cushion members is correspondingly connected with the first fixing portion and the second fixing portion.

Abstract: Disclosed herein is a hinge antibody capable of being selectively activated in a target cell or tissue to treat a condition therein. The hinge antibody includes a functional antibody, two inhibitory domains and four cleavable linkers. The functional antibody is capable of treating the condition in an activated state, and has two light chains and two heavy chains. Each inhibitory domain includes a hinge domain of an immunoglobulin and consists of two peptide arms. Each cleavable linker includes a peptide substrate cleavable by an enzyme specifically or highly expressed in the target cell or tissue, and connects one of the peptide arms of the inhibitory domains to the N-terminal of one of the light chains and heavy chains of the functional antibody. Also disclosed herein are methods for preparing and using this hinge antibody.

Abstract: A manufacturing method of composite material includes following steps: shaping a stainless steel plate to a stainless structural component; putting the stainless structural component in a female mold; putting a fiber material over a surface of the stainless structural component away from the female mold; and pressing a male mold towards the female mold to make the fiber material attached to the stainless structural component. The present invention is able to make different materials attached to each other to form a composite material in a simple and efficient manufacturing process, and the composite material is light; thin and has advantages of high rigidity and high strength.