Patents by Inventor Chih Hung Chuang
Chih Hung Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9202953Abstract: The invention relates to a method for manufacturing a solar cell with a nanostructural film, including steps of treating a glass substrate with UV ozone, uniformly coating a polystyrene nanospherical layer containing plural nanospheres on the surface of the glass substrate and curing the polystyrene nanospherical layer for adhesion onto the glass substrate, forming a first optical layer on the surface of the polystyrene nanospherical layer, curing and releasing the first optical layer from the polystyrene nanospherical layer to obtain a concave spherical nanostructured film, and finally affixing the concave spherical nanostructured film on the surface of a solar cell to manufacture a solar cell with nanostructure after curing by baking.Type: GrantFiled: May 16, 2014Date of Patent: December 1, 2015Assignee: National Cheng Kung UniversityInventors: Yu-Shun Cheng, Chie Gau, Chi-Feng Chang, Chih-Hung Chuang, Yu-Cheng Hong, Kai-Hung Chen
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Publication number: 20150333195Abstract: The invention relates to a method for manufacturing a solar cell with a nanostructural film, including steps of treating a glass substrate with UV ozone, uniformly coating a polystyrene nanospherical layer containing plural nanospheres on the surface of the glass substrate and curing the polystyrene nanospherical layer for adhesion onto the glass substrate, forming a first optical layer on the surface of the polystyrene nanospherical layer, curing and releasing the first optical layer from the polystyrene nanospherical layer to obtain a concave spherical nanostructured film, and finally affixing the concave spherical nanostructured film on the surface of a solar cell to manufacture a solar cell with nanostructure after curing by baking.Type: ApplicationFiled: May 16, 2014Publication date: November 19, 2015Applicant: NATIONAL CHENG KUNG UNIVERSITYInventors: YU-SHUN CHENG, CHIE GAU, CHI-FENG CHANG, CHIH-HUNG CHUANG, YU-CHENG HONG, KAI-HUNG CHEN
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Publication number: 20150333194Abstract: A method for manufacturing a nanostructural film in a solar cell is revealed herein to include steps of forming an optical layer on a surface of a solar cell, heating a substrate of the solar cell at a temperature ranging from 100° C. to 200° C., imprinting a micro-pattern of a brightness enhanced film (BEF) on the optical layer in a vacuum environment, wherein the micro-pattern has a triangular pyramid shape and arranged periodically on the optical layer, finally removing the BEF after cooling so that the optical layer is formed into a nanostructured film corresponding to the micro-pattern of the BEF.Type: ApplicationFiled: May 16, 2014Publication date: November 19, 2015Applicant: NATIONAL CHENG KUNG UNIVERSITYInventors: YU-SHUN CHENG, CHIE GAU, CHI-FENG CHANG, CHIH-HUNG CHUANG, YU-CHENG HONG, KAI-HUNG CHEN
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Patent number: 9093645Abstract: The invention relates to a manufacturing method of an organic solar cell. First deposit in order a first electrode and a first transmission layer on a substrate. Then coat a photoresist layer having a preferred thickness ranging from 1000 nm to 1600 nm on the surface of the first transmission layer by a spin coater at a preferred spin-coating speed ranging from 3000 rpm and 6000 rpm for 30 seconds. Then develop an area by a photolithograph process, and coat an organic active layer in the area and on the surface of the photoresist layer by use of the spin coater at a preferred spin-coating speed ranging from 500 rpm and 800 rpm, in which the organic active layer has a thickness ranging from 230 nm to 320 nm at 500 rpm. Final deposit a second transmission layer and a second electrode on the organic active layer to obtain the organic solar cell.Type: GrantFiled: September 13, 2013Date of Patent: July 28, 2015Assignee: National Cheng Kung UniversityInventors: Chie Gau, Yu-Shun Cheng, Chih-Hung Chuang, Yu-Cheng Hong, Yung-Tsan Lin
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Publication number: 20150013757Abstract: The invention relates to a manufacturing method of an organic solar cell. First deposit in order a first electrode and a first transmission layer on a substrate. Then coat a photoresist layer having a preferred thickness ranging from 1000 nm to 1600 nm on the surface of the first transmission layer by a spin coater at a preferred spin-coating speed ranging from 3000 rpm and 6000 rpm for 30 seconds. Then develop an area by a photolithograph process, and coat an organic active layer in the area and on the surface of the photoresist layer by use of the spin coater at a preferred spin-coating speed ranging from 500 rpm and 800 rpm, in which the organic active layer has a thickness ranging from 230 nm to 320 nm at 500 rpm. Final deposit a second transmission layer and a second electrode on the organic active layer to obtain the organic solar cell.Type: ApplicationFiled: September 13, 2013Publication date: January 15, 2015Applicant: NATIONAL CHENG KUNG UNIVERSITYInventors: CHIE GAU, YU-SHUN CHENG, CHIH-HUNG CHUANG, YU-CHENG HONG, YUNG-TSAN LIN
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Publication number: 20140099163Abstract: A clamping component and an electronic device using the same are provided. The clamping component includes a base and a combining portion. The base is disposed at one side of an accommodating space of the body. The combining portion has a obstructing structure and is disposed at the base. The obstructing structure is exposed to the accommodating space. When the second body is received into the accommodating space, the obstructing structure is elastically deformed to against the second body. The clamping component of the disclosure make the two bodies disassembled and assembled without affecting the appearance, and therefore the aesthetic of the two bodies can be maintained, further, the obstructing structure can improve the convenience in assembling the electronic device. In addition, the risk that the second body is detached from the first body under the external shock or a sudden vibration can be reduced via the clamping component.Type: ApplicationFiled: September 23, 2013Publication date: April 10, 2014Applicant: ASUSTEK COMPUTER INC.Inventors: Chih-Hung Chuang, Fu-Sheng Kao, Shin-Min Lee, Chih-Ho Hsieh
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Publication number: 20130299071Abstract: A manufacturing method of composite material includes following steps: shaping a stainless steel plate to a stainless structural component; putting the stainless structural component in a female mold; putting a fiber material over a surface of the stainless structural component away from the female mold; and pressing a male mold towards the female mold to make the fiber material attached to the stainless structural component. The present invention is able to make different materials attached to each other to form a composite material in a simple and efficient manufacturing process, and the composite material is light; thin and has advantages of high rigidity and high strength.Type: ApplicationFiled: May 6, 2013Publication date: November 14, 2013Applicant: ASUSTeK COMPUTER INC.Inventors: Hung-Yuan WANG, Yang-Po CHIU, Chih-Hung CHUANG
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Publication number: 20130016055Abstract: A wireless transmitting stylus configured to a touch control apparatus includes a motion sensing unit and a wireless transmitting unit. The motion sensing unit senses the motion of the wireless transmitting stylus so that the wireless transmitting stylus generates a motion signal. The wireless transmitting unit transmits the motion signal to the touch control apparatus, so that the touch control apparatus to trigger the execution. Accordingly, a user can grab the wireless transmission stylus and make a hand gesture to control the touch control apparatus.Type: ApplicationFiled: July 13, 2012Publication date: January 17, 2013Inventor: Chih-Hung CHUANG
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Publication number: 20130016483Abstract: An adapter module for a portable electronic device is disclosed. The adapter module is applied with a tablet electronic device. The adapter module includes an antenna unit, a first connection interface and a second connection interface. The first connection interface is configured for electrically connecting to the portable electronic device. The second connection interface is configured for electrically connecting to the tablet electronic device. When the first connection interface is electrically connected to the portable electronic device and the second connection interface is electrically connected to the tablet electronic device, the portable electronic device transmits a signal through the antenna unit of the adapter module, and the tablet electronic device displays an output information of the portable electronic device.Type: ApplicationFiled: July 13, 2012Publication date: January 17, 2013Inventors: Chih-Hung CHUANG, Chih-Ho Hsieh
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Patent number: 7711111Abstract: A mobile phone at least includes a first back cover, a second back cover and a main body. The first back cover has a first fastening part on its inner wall. The second back cover has a first interfering part on its inner wall. The first back cover and the second back cover are assembled with the main body. The main body has a resilient hook including a resilient arm, a second fastening part and a second interfering part. One end of the resilient arm is fixed to the main body, and the second fastening part is provided on the other end of the resilient arm. The second interfering part is provided on the resilient arm. When the second back cover is separated from the main body, the first interfering part pushes against the second interfering part to drive the second fastening part to separate from the first fastening part.Type: GrantFiled: September 24, 2007Date of Patent: May 4, 2010Assignee: Asustek Computer Inc.Inventor: Chih-Hung Chuang
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Publication number: 20090117952Abstract: The invention provides a first component, a second component and a rotation component. The rotation component has a first pivotal portion, a second pivotal portion and a connection portion. The first and second pivotal portions are located at the two ends of the connection portions and are pivotally connected to the first and second components. Thus, the state of the mobile phone may be switched between an open state and a closed state.Type: ApplicationFiled: October 21, 2008Publication date: May 7, 2009Applicant: ASUSTEK COMPUTER INC.Inventors: Chih-Hung Chuang, Chen-Yang Wu
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Publication number: 20080161048Abstract: A wireless handheld communication device is described. A main body has a first interfering portion in inner walls thereof. A keyboard structure has a frame and a flexible body, wherein the plastic frame has a second interfering portion for engaging with the first interfering portion so as to fix the keyboard structure in the main body.Type: ApplicationFiled: November 2, 2007Publication date: July 3, 2008Applicant: ASUSTEK COMPUTER INC.Inventor: Chih-Hung Chuang
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Publication number: 20080084994Abstract: A mobile phone at least includes a first back cover, a second back cover and a main body. The first back cover has a first fastening part on its inner wall. The second back cover has a first interfering part on its inner wall. The first back cover and the second back cover are assembled with the main body. The main body has a resilient hook including a resilient arm, a second fastening part and a second interfering part. One end of the resilient arm is fixed to the main body, and the second fastening part is provided on the other end of the resilient arm. The second interfering part is provided on the resilient arm. When the second back cover is separated from the main body, the first interfering part pushes against the second interfering part to drive the second fastening part to separate from the first fastening part.Type: ApplicationFiled: September 24, 2007Publication date: April 10, 2008Applicant: ASUSTEK COMPUTER INC.Inventor: Chih-Hung Chuang
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Publication number: 20070292033Abstract: This invention relates to a passive and interactive real-time image recognition software method, particularly to a real-time image recognition software method without the effects of the ambient light sources and noises, which includes passive and interactive recognition methods.Type: ApplicationFiled: June 19, 2006Publication date: December 20, 2007Inventors: Chao-Wang Hsiung, Chih Hung Chuang, Hsien-Wen Chang
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Publication number: 20070191061Abstract: The invention provides an apparatus for switching from a first Subscriber Identity Module (SIM) card with a set of first contact points to a second SIM card with a set of second contact points. The first SIM card and the second SIM card are both disposed inside a communication equipment. When a user replaces the first SIM card with the second SIM card, the user rotates the circumference of the disc exposed outside the casing, until the second SIM card is positioned so that the second set of contact points contact the fourth set of contact points on the inner wall, and the resilient pins on the inner wall pass through the second set of openings to contact the third contact points on the battery.Type: ApplicationFiled: February 6, 2007Publication date: August 16, 2007Inventor: CHIH-HUNG CHUANG
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Patent number: 7239333Abstract: According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.Type: GrantFiled: January 21, 2005Date of Patent: July 3, 2007Assignee: Opto Tech CorporationInventors: Shun-Lih Tu, Chih-Hung Chuang, Huai-Ku Chung, Chia-Feng Yang, Cheng-Wei Yang, Tsu-An Han, Hung-Tung Wang, Chien-Chen Hung
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Publication number: 20060132578Abstract: According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.Type: ApplicationFiled: January 21, 2005Publication date: June 22, 2006Inventors: Shun-Lih Tu, Chih-Hung Chuang, Huai-Ku Chung, Chia-Feng Yang, Cheng-Wei Yang, Tsu-An Han, Hung-Tung Wang, Chien-Chen Hung
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Publication number: 20060049475Abstract: The present invention relates to a high-power LED array. The high-power LED array has a printed circuit board (PCB), anodes, cathodes, high-power LED dies, packing materials, and lenses. The PCB has cavities arranged in an array. One anode and one cathode are located in each cavity. The anode and the cathode are correspondingly connected to the anode and cathode in the neighboring cavities. At least one high-power LED die is placed in the cavity and connected to the anode and the cathode in series or in parallel. The cavity is filled with packing material to secure the high-power LED die. Lenses are placed on the cavities to focus light emitted by the high-power LED die.Type: ApplicationFiled: March 8, 2005Publication date: March 9, 2006Inventors: Hung-Tung Wang, Chien-Chen Hung, Shun-Lih Tu, Dennis Yen, Chih-Hung Chuang, Huai-Ku Chung, Cheng-Wei Yang, Tsu-An Han
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Patent number: 6894315Abstract: The present invention discloses a structure of light-emitting diode (LED) array module, comprising a substrate, a carrier substrate, a chip, a driving circuit chip, and a plurality of metal lines. The carrier substrate is on top of the substrate, and the top surface of the carrier substrate is divided into a first area and a second area. The chip is attached to the first area of the carrier substrate, and further comprising a light-emitting component array and a pad array. The driving circuit chip is attached to the second area of the carrier substrate, and further comprising a pad array and a pad. The metal lines are for electrically connecting the substrate to the driving circuit chip, and the chip to the driving circuit chip, respectively. The present invention can reduce the manufacturing cost, and improve the yield rate.Type: GrantFiled: August 12, 2003Date of Patent: May 17, 2005Assignee: Opto Tech Corp.Inventors: Huai Ku Chung, Chih Hung Chuang, Shun Lih Tu, Chien Chen Hung