Patents by Inventor Chih-Hung Hsu

Chih-Hung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250028110
    Abstract: An electronic device is provided. The electronic device includes a substrate, a first optical film and a second optical film. The first optical film is disposed on the substrate, and the first optical film includes an engaging portion. The second optical film is disposed on the substrate and having an upper surface and a lower surface opposite to each other, and the second optical film is in mutual interference with the engaging portion of the first optical film. The engaging portion includes a first portion, a second portion and an engaging structure, and the first portion and second portion are disposed on opposite sides of the engaging structure, and one of the first portion and the second portion is disposed on the upper surface of the second optical film and the other one is disposed below the lower surface of the second optical film.
    Type: Application
    Filed: June 17, 2024
    Publication date: January 23, 2025
    Inventors: Yi-Cheng LAI, Chih-Hung LIU, Chih-Hung HSU, I-Han LIU
  • Publication number: 20240339383
    Abstract: An electronic device and a method of manufacturing an electronic device are provided. The electronic device includes an electronic component, a carrier, and a lead. The electronic component has a lateral surface. The carrier supports the electronic component. The lead is electrically connected to the electronic component and disposed adjacent to the lateral surface of the electronic component. The carrier and the lead are configured to block an electromagnetic wave between the electronic component and an external of the electronic device.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 10, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ko-Pu WU, Chih-Hung HSU, Chin Li HUANG, Chieh-Yin LIN, Yuan-Chun CHEN, Kai-Sheng PAI
  • Publication number: 20240319539
    Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; a support module disposed between the back plate and the optical film; and an adhesive layer disposed between the back plate and the support module, wherein the support module includes a base and a support unit between the base and the optical film, and the base is fixed to the back plate by the adhesive layer.
    Type: Application
    Filed: June 5, 2024
    Publication date: September 26, 2024
    Inventors: Ming-Tien WANG, Chin-Tu TSAI, Chih-Hung HSU, Chih-Hung LIU, Hsiang-Yu JUAN
  • Patent number: 12044928
    Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; and a support module disposed between the back plate and the optical film, wherein the support module comprises a base and a support unit between the base and the optical film, the base comprises a curved surface away from the back plate, the support unit is connected to an upper surface of the base, and the upper surface comprises the curved surface; wherein a hollow space is enclosed by the base.
    Type: Grant
    Filed: September 12, 2023
    Date of Patent: July 23, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Ming-Tien Wang, Chin-Tu Tsai, Chih-Hung Hsu, Chih-Hung Liu, Hsiang-Yu Juan
  • Publication number: 20240004237
    Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; and a support module disposed between the back plate and the optical film, wherein the support module comprises a base and a support unit between the base and the optical film, the base comprises a curved surface away from the back plate, the support unit is connected to an upper surface of the base, and the upper surface comprises the curved surface; wherein a hollow space is enclosed by the base.
    Type: Application
    Filed: September 12, 2023
    Publication date: January 4, 2024
    Inventors: Ming-Tien WANG, Chin-Tu TSAI, Chih-Hung HSU, Chih-Hung LIU, Hsiang-Yu JUAN
  • Patent number: 11860477
    Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; and a support module disposed between the back plate and the optical film, wherein the support module includes a base, and the base includes a hollow space and a curved surface away from the back plate.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: January 2, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Ming-Tien Wang, Chin-Tu Tsai, Chih-Hung Hsu, Chih-Hung Liu, Hsiang-Yu Juan
  • Publication number: 20230176060
    Abstract: Biomarkers for prognosis of tumours, in hepatocellular carcinoma and other cancers. Measurement of biomarkers for prescription of anticancer immunotherapy targeted against ICOS+ regulatory T cells (TReg), e.g., selecting patients for treatment with an anti-ICOS antibody. Biomarkers comprising: (i) ratio of the number of ICOS FOXP3 double positive cells within a defined radius of influence around ICOS single positive cells to the total number of ICOS single positive cells, (ii) mean distance between each ICOS positive FOXP3 negative cell and its nearest ICOS FOXP3 double positive cell, (iii) proportion of FOXP3 positive cells which are ICOS positive, and (iv) density of ICOS positive cells.
    Type: Application
    Filed: May 13, 2021
    Publication date: June 8, 2023
    Inventors: Richard Charles Alfred SAINSON, Cecilia DEANTONIO, Chih-Hung HSU, Li-Chun LU, Lorcan Adrian SHERRY
  • Publication number: 20230066479
    Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; and a support module disposed between the back plate and the optical film, wherein the support module includes a base, and the base includes a hollow space and a curved surface away from the back plate.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 2, 2023
    Inventors: Ming-Tien WANG, Chin-Tu TSAI, Chih-Hung HSU, Chih-Hung LIU, Hsiang-Yu JUAN
  • Patent number: 11487156
    Abstract: A backlight module includes: a back plate; an optical film disposed on the back plate; and a support module disposed on the back plate and between the back plate and the optical film, wherein the support module includes a base, and an elasticity coefficient of the base is greater than or equal to 0.4 kgf/mm and smaller than or equal to 0.6 kgf/mm.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: November 1, 2022
    Assignee: INNOLUX CORPORATION
    Inventors: Ming-Tien Wang, Chin-Tu Tsai, Chih-Hung Hsu, Chih-Hung Liu, Hsiang-Yu Juan
  • Patent number: 11450596
    Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: September 20, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu, Chin Li Huang
  • Publication number: 20220082888
    Abstract: A backlight module includes: a back plate; an optical film disposed on the back plate; and a support module disposed on the back plate and between the back plate and the optical film, wherein the support module includes a base, and an elasticity coefficient of the base is greater than or equal to 0.4 kgf/mm and smaller than or equal to 0.6 kgf/mm.
    Type: Application
    Filed: August 24, 2021
    Publication date: March 17, 2022
    Inventors: Ming-Tien WANG, Chin-Tu TSAI, Chih-Hung HSU, Chih-Hung LIU, Hsiang-Yu JUAN
  • Patent number: 11190090
    Abstract: An apparatus for automated encapsulation of motor rotor core with magnet steel is introduced. The apparatus includes at least one encapsulation unit, a plastic granule feeding device, a waste removing device, a conveyance device and a control device. Under a coordinated control of the control device, a rotor core feeding mechanism of the encapsulation unit feeds rotor cores to a plastic dispensing mechanism in cycles, the plastic granule feeding device separates, outputs and dispenses plastic granules, so that they are arrayed before being dispensed onto the rotor cores, and the conveyance device conveys plastic granules and moves the waste removing device to carry waste to a waste removal zone. With these arrangements, it is able to realize automated feeding of rotor cores, automated feeding of plastic granules and automated removal of waste to achieve completely automated rotor core encapsulation operation while enables mass production of motor rotor cores.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: November 30, 2021
    Assignee: GALLANT MICRO. MACHINING CO., LTD.
    Inventors: Hung-Neng Lai, Mu-Ching Chang, Chih-Yuan Chiang, Chih-Hung Hsu, Chun-Chiang Ding
  • Publication number: 20210367491
    Abstract: An apparatus for automated encapsulation of motor rotor core with magnet steel is introduced. The apparatus includes at least one encapsulation unit, a plastic granule feeding device, a waste removing device, a conveyance device and a control device. Under a coordinated control of the control device, a rotor core feeding mechanism of the encapsulation unit feeds rotor cores to a plastic dispensing mechanism in cycles, the plastic granule feeding device separates, outputs and dispenses plastic granules, so that they are arrayed before being dispensed onto the rotor cores, and the conveyance device conveys plastic granules and moves the waste removing device to carry waste to a waste removal zone. With these arrangements, it is able to realize automated feeding of rotor cores, automated feeding of plastic granules and automated removal of waste to achieve completely automated rotor core encapsulation operation while enables mass production of motor rotor cores.
    Type: Application
    Filed: May 22, 2020
    Publication date: November 25, 2021
    Inventors: HUNG-NENG LAI, MU-CHING CHANG, CHIH-YUAN CHIANG, CHIH-HUNG HSU, CHUN-CHIANG DING
  • Patent number: 11169605
    Abstract: An operating method in a virtual environment through a wearable device is disclosed, wherein the wearable device has a motion sensor, the virtual environment has an operated object and a virtual device corresponding to the wearable device, the corresponding virtual device has a first operational data constraint, and the operated object has a second operational data constraint. The operating method comprises the following steps of: using the motion sensor to generate a motion sensed data; causing the corresponding virtual device to generate a derived data according to the motion sensed data, wherein the derived data indicates an interaction relationship between the virtual device and the operated object; and when the virtual device separated from the operated object under the interaction relationship, moving the operated object in accordance with the derived data.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: November 9, 2021
    Assignee: J-MEX INC.
    Inventors: Chin-Ting Chu, Chia-Wei Lee, Chih-Hung Hsu, Te-Hsi Chen, Chi-Hung Chen, Meng-Yu Lee
  • Patent number: 11139225
    Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: October 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuang-Hsiung Chen, Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu
  • Patent number: 11052588
    Abstract: An electrically-driven rotor iron core magnetic steel chamber dispensing device is introduced. Dispensing units each include a dispensing channel, dispensing head, plunger barrel, plunger and stop-injection opening pin. The dispensing channel is above the dispensing head and in communication with the dispensing head. The dispensing head is disposed at the top of the plunger barrel and in communication with the plunger barrel. The plunger is displaced in the plunger barrel to move up and down relative to the plunger barrel. The stop-injection opening pin includes a pin body disposed vertically, arranged beside the plunger barrel, and fixed to a lower mold from inside. A pin head portion is disposed at the top of the pin body. A barb is disposed between the pin head portion and the pin body. The pin head portion protrudes into the dispensing channel, allowing molten plastic in the dispensing channel to enter the barb.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: July 6, 2021
    Assignee: GALLANT MICRO. MACHINING CO., LTD.
    Inventors: Hung-Neng Lai, Mu-Ching Chang, Chih-Hung Hsu
  • Publication number: 20210159155
    Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.
    Type: Application
    Filed: November 22, 2019
    Publication date: May 27, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi-Cheng HSU, Chih-Hung HSU, Mei-Lin HSIEH, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU, Chin LI HUANG
  • Publication number: 20200395275
    Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 17, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuang-Hsiung CHEN, Chih-Hung HSU, Mei-Lin HSIEH, Yi-Cheng HSU, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU
  • Patent number: 10807852
    Abstract: An electrically-driven rotor iron core magnetic steel chamber dispensing device effectuates dispensing in the gap between a magnetic steel chamber and a magnetic steel chunk of an electrically-driven rotor iron core. The electrically-driven rotor iron core magnetic steel chamber dispensing device includes a plurality of dispensing units each corresponding in position to one or more magnetic steel chambers. The dispensing units correspond in position to the magnetic steel chamber and are arranged in the circumferential direction of the electrically-driven rotor. The dispensing units are arranged outside the magnetic steel chamber and positioned proximate to the magnetic steel chamber or is located in the direction of the projection of the magnetic steel chamber. A dispensing opening of each dispensing unit corresponds in position to the magnetic steel chamber from below.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: October 20, 2020
    Assignee: GALLANT MICRO. MACHINING CO., LTD.
    Inventors: Hung-Neng Lai, Mu-Ching Chang, Chih-Hung Hsu
  • Publication number: 20200316834
    Abstract: An electrically-driven rotor iron core magnetic steel chamber dispensing device is introduced. Dispensing units each include a dispensing channel, dispensing head, plunger barrel, plunger and stop-injection opening pin. The dispensing channel is above the dispensing head and in communication with the dispensing head. The dispensing head is disposed at the top of the plunger barrel and in communication with the plunger barrel. The plunger is displaced in the plunger barrel to move up and down relative to the plunger barrel. The stop-injection opening pin includes a pin body disposed vertically, arranged beside the plunger barrel, and fixed to a lower mold from inside. A pin head portion is disposed at the top of the pin body. A barb is disposed between the pin head portion and the pin body. The pin head portion protrudes into the dispensing channel, allowing molten plastic in the dispensing channel to enter the barb.
    Type: Application
    Filed: July 31, 2019
    Publication date: October 8, 2020
    Inventors: HUNG-NENG LAI, MU-CHING CHANG, CHIH-HUNG HSU