Abstract: A door alarm system comprises a door having a doorframe, a door body and a door alarm device mounted in the doorframe or door body. The door alarm device comprises a housing, a cover mounted on the housing and having a rear surface, a push button hole and four guideposts formed on and protruding from the rear surface, a battery compartment, a push button and a controller. The push button is mounted slidably in and protrudes from the push button hole and has a cap with a neck, an electrical pad mounted on the guideposts and having a through hole, a metallic plug and a resilient member. The metallic plug is mounted through the through hole in the electrical pad, connects to the neck and selectively makes contact with the electrical pad when the door is open. The controller mounted in the housing and provides an audible warning when the door body is open.

Abstract: A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted.

Abstract: A light emitting diode (LED) device comprises a first lead frame, a second lead frame, a LED die and at least one bump. The LED die is fixed on and electrically connected to the first lead frame. The second lead frame separated from the first lead frame with a distance is connected to the LED die. The bump disposed on at least one of the first lead frame and the second lead frame to identify a gripping space for allowing an electronic element inserted or gripped therein.

Abstract: A parallel-to-serial conversion method for IBMA in a Reed Solomon decoder is used for obtaining discrepancies in IBMA iterations, thereby acquiring an error location polynomial and an error value polynomial. Syndrome sequences for the calculation of discrepancies in IBMA iterations have a fixed length. The number of syndromes is t+1, where t is the largest number of symbols that can be corrected of the error location polynomial. The feature that syndrome sequences have the same length is based on the fact that the discrepancies are not affected if the coefficients of polynomial orders of the error location polynomial are zero.

Abstract: The present invention relates to semiconductor package and the method of making the same. The method of the invention comprises the following steps: (a) providing a first substrate; (b) mounting a first chip onto a surface of the first substrate; (c) forming a plurality of conductive elements on the surface of the first substrate; (d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and (e) forming a first molding compound for encapsulating the surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements. Thus, the first molding compound encapsulates the entire surface of the first substrate, so that the mold flush of the first molding compound will not occur, and the rigidity of the first substrate is increased.

Abstract: A chip package structure includes a die pad of which at least a notch is formed on at least one side and opposite to a mold gate. The die pad contributes to accelerating the injection of an encapsulating material, so as to exhaust the air in the mold in time, before the encapsulating material solidifies during the molding step, thereby overcoming or at least improving the problem of defects such as air bubbles in the encapsulation.

Abstract: A semiconductor package structure is disclosed. The structure comprises a die pad, a chip, leads, a recess, and an encapsulant. The chip is disposed on the die pad. The leads are disposed on a periphery of the die pad and electrically connected to the chip. The recess is formed on the top surface of at least one of the leads and extends to the outside surface thereof. The encapsulant is used for encapsulating the die pad, the chip, the leads, and the recess.

Abstract: A lamp fixing structure is arranged with a lamp which has an electrode and a wire electrically connected to the electrode. The lamp fixing structure includes a lamp holder and at least one lamp protecting member. The lamp holder has at least one pressing part. The lamp protecting member has a first hole. The lamp is inserted into the lamp protecting member. The wire passes through the lamp protecting member from the first hole. The pressing part presses the lamp protecting member so that the first hole is fitted to the wire tightly.

Abstract: A method of manufacturing photo couplers is provided. At first, a receiver lead-frame array is cut from a lead-frame matrix having a transmitter lead-frame array and the receiver lead-frame array. Then, the receiver lead-frame array is overturned and placed on the lead-frame matrix to allow light-receiver elements on the receiver lead-frame array to face light-emitting elements on the transmitter lead-frame array of the lead-frame matrix. Finally, the receiver lead-frame array and the lead-frame matrix are connected.

Abstract: A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted.

Abstract: A medical therapeutic treadmill capable of automatically adjusting its rail height includes, a base having a treadmill platform disposed on the base, a control panel disposed at the front of the base; and a rail set having a rail separately disposed on both sides of the base, characterized in that the bottom of each rail has a rail height adjusting mechanism that can simultaneously drive the rail to move up and down, so that the height adjusting mechanism can adjust the height of the rails on both sides of the treadmill, and quickly and easily adjusting the rail height for patients.

Abstract: A burglar alarm device has a body and a mounting bracket. The body has a casing, a rear cover and a detection and alarm assembly. The detection and alarm assembly is mounted on the rear cover inside the casing and has a vibration sensor and an illumination source. The body is attached to the optional mounting bracket. When a doorframe with the burglar alarm device is touched, the detection and alarm assembly will sound an audible alarm to warn people in the house, and the illumination source will light up. Further, the illumination source can be turned on to illuminate the keyhole so a person can easily insert a key.

Abstract: A burglar alarm device has a body and a mounting bracket. The body has a casing, a rear cover and a detection and alarm assembly. The detection and alarm assembly is mounted on the rear cover inside the casing and has a vibration sensor and an illumination source. The body is attached to the optional mounting bracket. When a doorframe with the burglar alarm device is touched, the detection and alarm assembly will sound an audible alarm to warn people in the house, and the illumination source will light up. Further, the illumination source can be turned on to illuminate the keyhole so a person can easily insert a key.