Abstract: A vapor chamber includes a main body and a wick structure. The main body includes a first and a second plate, which are closed to each other to define a chamber therein between. A working fluid is filled in the chamber. The wick structure is integrally formed on two facing inner surfaces of the first and the second plate by way of mechanical processing, and is projected from the first and second plates toward a central space in the chamber. By integrally forming the wick structure on the first and second plates, the vapor chamber can be manufactured at reduced time and labor to obtain increased yield. A method of manufacturing vapor chamber with integrally formed wick structure is also disclosed.

Abstract: A vapor chamber and a method of manufacturing same are disclosed. The vapor chamber includes a main body internally defining a chamber. The chamber internally has a plurality of flow guides and contains a working fluid; and at least one flow passage is formed between any two adjacent flow guides, such that the flow guides and the flow passages together define a flow guiding zone in the main body. The flow guiding zone has two opposite ends respectively connecting with a first convection zone and a second convection zone, such that the flow passages and the first and second convection zones communicate with one another. With the main body and the internal flow passages for a vapor chamber being integrally formed by aluminum extrusion, the time, labor and material costs for the vapor chamber can be largely reduced.

Abstract: An air flow guiding structure includes a plurality of straight radiating fins being parallelly spaced to define an air flow passage between any two adjacent ones of the straight radiating fins; a plurality of first oblique sections extended from first ends of at least some of the straight radiating fins, such that a first air flow guiding passage communicating with the air flow passage is defined between any two adjacent ones of the first oblique sections; and a plurality of second oblique sections extended from opposite second ends of at least some of the straight radiating fins, such that a second air flow guiding passage communicating with the air flow passage is defined between any two adjacent ones of the second oblique sections. With these arrangements, air flows can be quickly guided into and out of the air flow passages to improve flow field and achieve best heat dissipation effect.

Abstract: A data de-duplication processing method for point-to-point transmission and a system thereof. An originating client sends a file recovery request to an information management server and a data storage server; obtaining a plurality of partitioned data blocks; if the partitioned data block in the file recovery request in the information management server, the information management server searches for the data storage server according to the file recovery request and returns the found data storage server and the partitioned data block belonging to the data storage server to the originating client as a response; if the partitioned data block in the file recovery request in a target client, the target client transports the partitioned data block to the originating client; the originating client performs data recovery of an input file on the partitioned data blocks according to the partitioned data blocks obtained from the target clients and the data storage server.

Abstract: The present disclosure provides a jig for surface treatment, which is used for fixing a metal plate having a bearing for surface treatment. The jig for surface treatment according to the present disclosure passes a hanging rod through the metal plate. Thereby, the jig for surface treatment will not contact with a processed surface of the metal plate and hence making no apparent flaws on the processed surface and maintaining completeness processed surface. In addition, the jig for surface treatment can load a plurality of metal plates at a time, performing surface treatment on the plurality of metal plates simultaneously, and thus improving productivity and practicability.

Abstract: A flexible heat dissipation module comprises at least one first heat pipe, one second heat pipe, and one flexible component. The first heat pipe includes a first heat absorbing end and a first heat dissipating end; the second heat pipe includes a second heat absorbing end and a second heat dissipating end. The flexible component includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining part, wherein the first and the second joining parts are attached respectively to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe. With the disposition of flexible components, the flexible heat module according to the present invention has wider installation applicability and more flexible programmability to adapt to existing narrow device space.

Abstract: The present invention pertains to a liquid oxidizer of burner consisting of a hydrogen peroxide (H2O2) and a dihydrogen monoxide (H2O, water) . Wherein the proportion of the H2O2 is 30˜100% and the proportion of the H2O is 0˜70%. Whereby, the oxidizer is added into the burner and is subjected to decomposition or catalysis by heating or a catalyst so that it could be transformed into heating steam and gaseous oxygen. Accordingly, the oxidizer possessing the high oxidization accelerates the burning speed of blazing wastes within the burner, and the wastes and firing would be efficiently burnt away. Therefore, the burning effect is advanced, and the emission of carbon monoxide, unburnt hydrocarbon (UHC), and pollutants are certainly decreased.

Abstract: A liquid-cooling type thermal module includes a liquid cooling unit and at least one heat pipe. The heat pipe has a heat-absorbing end and a heat-dissipating end. The heat-absorbing end is connected to at least one heat-producing element. The heat-producing element is located inside a system while the liquid cooling unit is located outside the system. The heat pipe connects the heat-producing element to the liquid cooling unit. Heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred to the remote liquid cooling unit via the heat-dissipating end to be dissipated. With the heat pipe being used as a medium for conducting heat, the problem of fluid leak can be eliminated, and the heat produced by the heat-producing element can be effectively carried away from the system without stagnating around the heat-producing element, enabling the thermal module to provide excellent heat dissipating effect.

Abstract: A reinforced thermal module structure includes a heat pipe, a radiating base, and a radiating fin assembly. The heat pipe includes a conducting section and a heat-dissipating section. The conducting section is in contact with and connected to the radiating base, and the heat-dissipating section is extended through and connected to the radiating fin assembly. The radiating base has at least two support arms. Each of the support arms has an extended free end extended toward and pressed against one side of the radiating fin assembly. The support arms not only help in giving the entire thermal module an enhanced structural strength, but also in increasing the heat conducting area and heat dissipating efficiency of the thermal module.

Abstract: A heat sink testing method for measuring the heat dissipation performance of a heat sink includes the following steps: using at least one fluid supply device to produce an amount of fluid, which has a first temperature and is driven to pass through a heat sink; adjusting an input power to a heat-producing element, so that the heat-producing element produces heat, and the produced heat is transferred to the heat sink to produce heat energy having a second temperature between the heat sink and the heat-producing element; and stopping the adjustment of the input power to the heat-producing element when a preset high limit of the second temperature is reached, and determining the heat dissipation performance of the heat sink according to the input power of the heat-producing element.

Abstract: A radiating fin includes a main body, on which at least one reinforcing section is formed. The reinforcing section is sunken into a first side of the main body and correspondingly protruded from an opposite second side of the main body. With the reinforcing section formed on the main body, the radiating fin can have largely enhanced structural strength and increased heat-radiating area.

Abstract: A light-emitting diode (LED) lampshade with heat-radiating effect is made of a heat-conducting material, and has a plane contact section and an extension section extended from at least one side of the contact section. The plane contact section has at least one LED module mounted thereon. The extension section is so configured that it not only converges and reflects light emitted from the LED module, but also provides a large surface area in direct contact with ambient air. When the LED module produces heat during the operation thereof, the produced heat is transferred from the contact section of the LED lampshade to the extension section and dissipated into ambient air directly from the extension section.

Abstract: A diamond substrate and a method for fabricating the same are provided wherein a SiC layer is formed on a lower surface of a diamond layer for preventing the diamond layer from being deformed after the process of forming the diamond substrate, and then a semiconductor layer is formed on the diamond layer or directly formed on the surface of the SiC layer. Thereby, the lattice mismatch between the diamond film layer and the semiconductor layer is mitigated by the SiC layer, and the crystalline quality of the semiconductor layer is improved, the fabricating process of the diamond substrate is simplified, and the performance and stability are enhanced.

Abstract: A light emitting diode device and a method for manufacturing the same are disclosed. The method comprises following steps: (A) providing a substrate; (B) forming a SiC film on the surface of the substrate; (C) forming a diamond layer on the surface of the SiC film and removing the substrate, wherein the diamond layer has a first surface and a second surface adjacent to the surface of the SiC film; (D) forming a semiconductor epitaxy layer on the surface of SiC film by epitaxial growth process; and (E) forming a first electrode on the surface of the semiconductor epitaxy layer and forming a metal layer on the first surface of the diamond layer. Accordingly, the manufacturing method of the present invention can efficiently reduce manufacturing cost and simplify manufacturing process to provide LEDs with high heat dissipation efficiency and a high-quality epitaxy layer.

Abstract: A light emitting diode device and a method for manufacturing the same are disclosed. The method comprises following steps: (A) providing a substrate; (B) forming a diamond layer on the surface of the substrate; (C) forming a doping region on the upper surface of the diamond layer; (D) bonding a semiconductor epitaxy layer on the upper surface of the diamond layer; and (E) removing the substrate. Accordingly, owing to the absence of an adhesion layer necessary for a conventional LED, the LED of the present invention can reduce the blockage for heat transfer caused by a resin adhesion layer and light obscuration caused by a metal adhesion layer so as to enhance the efficiency of heat dissipation of LEDs, simplify the process, and enhance the performance and the stability of products.

Abstract: A diamond substrate and a method for fabricating the same are provided wherein a SiC layer is formed on a lower surface of a diamond layer for preventing the diamond layer from being deformed after the process of forming the diamond substrate, and then a semiconductor layer is formed on the diamond layer or directly formed on the surface of the SiC layer. Thereby, the lattice mismatch between the diamond film layer and the semiconductor layer is mitigated by the SiC layer, and the crystalline quality of the semiconductor layer is improved, the fabricating process of the diamond substrate is simplified, and the performance and stability are enhanced.

Abstract: A double-winged radiator for central processing unit (CPU) includes a heat-transfer block mounted on a top of a CPU that produces a large amount of heat during an operation thereof, and two sets of first radiator fins fixed to two outer ends of at least one heat-transfer tube that is seated on a top of the heat-transfer block. The heat produced by the CPU and transferred to the heat-transfer block is further transferred via the heat-transfer tube to the two sets of first radiator fins that provide large radiating area and high radiating efficiency to allow quick dissipation of heat therefrom. A locating member may be mounted on and between the two sets of first radiator fins to protect the latter from deformation under pressure. One set of second radiator fins may be mounted between the two sets of first radiator fins to provide increased radiating area and efficiency.

Abstract: A CPU radiator holding mechanism. The mechanism includes a pressure-bearing unit, a pair of holding-down clamps, and a seat for holding a radiator to a main board above a CPU. The radiator is formed from radiating fins and is provided at a top thereof with a receiving recess for receiving the pressure-bearing unit therein. The holding-down clamps are provided with hooks for engaging with receiving holes provided on the seat. The radiator is connected to the seat by pressing the holding-down clamps against the pressure-bearing unit and engaging the hooks of the holding-down clamps with the receiving holes of the seat, such that any pressure applied by the holding-down clamps onto the pressure-bearing unit does not cause any deformation of the radiating fins of the radiator.

Abstract: A CPU radiator holding mechanism. The mechanism includes a pressure-bearing unit, a pair of holding-down clamps, and a seat for holding a radiator to a main board above a CPU. The radiator is formed from radiating fins and is provided at a top thereof with a receiving recess for receiving the pressure-bearing unit therein. The holding-down clamps are provided with hooks for engaging with receiving holes provided on the seat. The radiator is connected to the seat by pressing the holding-down clamps against the pressure-bearing unit and engaging the hooks of the holding-down clamps with the receiving holes of the seat, such that any pressure applied by the holding-down clamps onto the pressure-bearing unit does not cause any deformation of the radiating fins of the radiator.