VAPOR CHAMBER WITH INTEGRALLY FORMED WICK STRUCTURE AND METHOD OF MANUFACTURING SAME
A vapor chamber includes a main body and a wick structure. The main body includes a first and a second plate, which are closed to each other to define a chamber therein between. A working fluid is filled in the chamber. The wick structure is integrally formed on two facing inner surfaces of the first and the second plate by way of mechanical processing, and is projected from the first and second plates toward a central space in the chamber. By integrally forming the wick structure on the first and second plates, the vapor chamber can be manufactured at reduced time and labor to obtain increased yield. A method of manufacturing vapor chamber with integrally formed wick structure is also disclosed.
The present invention relates to a vapor chamber with integrally formed wick structure, and more particularly to a vapor chamber with integrally formed wick structure that can be manufactured at reduced time and labor to obtain increased yield. The present invention also relates to a method of manufacturing vapor chamber with integrally formed wick structure.
BACKGROUND OF THE INVENTIONDue to the constant progress in many technological fields, electronic elements now have largely increased power and performance, which, however, also brings the electronic elements to generate more heat during the operation thereof. The generated heat must be timely removed, lest it should accumulate in the electronic elements to adversely affect the performance or even cause burnout of the electronic elements. To effectively solve the problem of heat dissipation in different electronic devices and elements, vapor chambers with better heat transfer effect have been developed from time to time.
A prior art vapor chamber usually includes a chamber and a wick structure provided in the chamber. A working fluid is filled in the chamber. The wick structure provided in the chamber or on inner surfaces of the chamber may be sintered powder, metal meshes, or fibers. One side of the vapor chamber is a vaporizing zone that is in contact with a heat-generating element, such as a central processing unit, a graphics chip, a south bridge chip, a north bridge chip, or a communication chip, to absorb the generated heat. The liquid-phase working fluid in the chamber near the vaporizing zone is heated by the absorbed heat and vaporized into a vapor-phase working fluid, which flows toward and accordingly transfers heat to the other side of the vapor chamber, i.e. a condensing zone. At the condensing zone, the vapor-phase working liquid is cooled and condensed into a liquid-phase working fluid again. The liquid-phase working fluid flows back to the vaporizing zone through gravity force or the wick structure to continue the cycles of vapor/liquid phase conversion and thereby achieve the temperature lowering and heat dissipating effects.
While the prior art vapor chamber may achieve the effect of lowering temperature, it has another problem with the wick structure thereof. The wick structure in the prior art vapor chamber is attached to the inner surfaces of the chamber through sintering, for example, instead of being integrally formed thereon. Thus, the wick structure tends to separate from the inner surfaces of the vapor chamber when the latter is subjected to some external factors, such as deformation caused by collision, compression and the like, resulting in unmovable working fluid in the chamber and accordingly, lowered heat transfer efficiency of the vapor chamber.
Furthermore, the manufacture of the prior art vapor chamber involves rather complicated procedures to provide the wick structure in the form of sintered powder, metal meshes or fibers in the chamber. The complicated procedures for forming the wick structure in the vapor chamber would inevitably require more labor and time to reduce the yield.
In conclusion, the prior art vapor chamber has the following disadvantages: (1) consuming more time and labor; (2) having lowered yield; and (3) involving complicated manufacturing procedures.
It is therefore tried by the inventor to develop an improved vapor chamber with integrally formed wick structure and a method for manufacturing same, so as to eliminate the drawbacks in the prior art vapor chamber.
SUMMARY OF THE INVENTIONA primary object of the present invention is to provide a vapor chamber with integrally formed wick structure, so as to save the time and labor needed to manufacture the vapor chamber.
Another object of the present invention is to provide a vapor chamber with integrally formed wick structure to enable increased yield thereof.
A further object of the present invention is to provide a method of manufacturing vapor chamber with integrally formed wick structure, so as to save the time and labor needed to manufacture the vapor chamber.
A still further object of the present invention is to provide a method of manufacturing vapor chamber with integrally formed wick structure to enable increased yield thereof.
To achieve the above and other objects, the vapor chamber with integrally formed wick structure according to the present invention includes a main body and a wick structure. The main body includes a first and a second plate, which are closed to each other to define a chamber therein between. A working fluid is filled in the chamber. The wick structure is integrally formed on two facing inner surfaces of the first and the second plate by way of mechanical processing, and is projected from the first and second plates toward a central space in the chamber. By integrally forming the wick structure on the first and second plates, the vapor chamber can be manufactured at reduced time and labor to obtain increased yield.
To achieve the above and other objects, the method of manufacturing vapor chamber with integrally formed wick structure according to the present invention includes the following steps: providing a first and a second plate; forming a wick structure on two facing inner surfaces of the first and the second plate by way of mechanical processing; closing the first and the second plate to each other to thereby define a chamber therein between; evacuating the chamber, filling the chamber with a working fluid, and sealing the chamber. With the method of manufacturing vapor chamber with integrally formed wick structure according to the present invention, the manufacturing process for a vapor chamber is effectively simplified to achieve the effects of saving time and labor as well as increased yield.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to
An outer side of the second plate 12, i.e. a vaporizing zone of the vapor chamber, is in contact with a heat-generating element, such as a central processing unit, a graphics chip, a south bridge chip, a north bridge chip, a communication chip and the like (not shown), for absorbing heat generated by the heat-generating element. The working fluid in the chamber 14 located at an inner side of the second plate 12 is heated by the absorbed heat and vaporized into a vapor-phase working fluid. The vapor-phase working fluid flows to the first plate 11, which is also a condensing zone of the vapor chamber, and is cooled and condensed into a liquid-phase working fluid. The liquid-phase working fluid flows back to the vaporizing zone through gravity force or the wick structure 15 to continue the cycles of vapor/liquid phase conversion to thereby enable effective and excellent temperature lowing and heat dissipating effects.
As can be seen in
In the illustrated first embodiment, the wick structure 15 is configured as two roughened surfaces (see
With the wick structure 15 being integrally formed on the two facing inner surfaces of the first and second plates 11, 12, it is possible to effectively avoid undesired separation of the wick structure 15 from the first and second plates 11, 12 and therefore ensure stable quality and enhanced heat transfer effect of the vapor chamber. Furthermore, by integrally forming the wick structure 15 with the first and second plates 11, 12, it is able to save the labor and time for manufacturing the vapor chamber.
By forming the supporting structure 17, the first and the second plate 11, 12 facing toward each other are effectively supported by the supporting structure 17 to prevent or resist deformation of the vapor chamber due to an external factor, such as a compressive force applied thereto.
With the supporting structures 17 integrally formed on the two facing inner surfaces of the first and the second plate 11, 12, the first and second plates 11, 12 are effectively supported and structurally reinforced by the supporting structures 17 to effectively prevent the vapor chamber from deformation due to an external factor, such as a compressive force applied thereto.
In the step S1, a first plate and a second plate are provided.
More specifically, a first plate 11 and a second plate 12 are provided.
In the step S2, a wick structure is formed on two facing inner surfaces of the first and the second plate by way of mechanically processing.
More specifically, the first and the second plate 11, 12 are machined on their two facing inner surfaces, such as by stamping, rolling, slotting, or milling, so that a wick structure 15 is formed on the two facing inner surfaces of the first and second plates 11, 12. That is, the wick structure 15 is integrally formed on the two facing inner surfaces of the first and the second plate 11, 12. The wick structure 15 may include roughened surfaces as shown in
In the step S3, the first and the second plate are closed to each other, so as to define a chamber therein between; and the chamber is evacuated and filled with a working fluid before being sealed.
More specifically, the first plate 11 and the second plate 12 are closed to each other to form a main body 1 of the vapor chamber, which internally defines a chamber 14. The chamber 14 is evacuated and filled with a working fluid before being sealed. The working fluid may be purified water, inorganic compounds, alcohols, ketones, liquid metals, coolants, or organic compounds.
With the first method of manufacturing vapor chamber with integrally formed wick structure, the manufacturing process for a vapor chamber is effectively simplified to achieve the effect of saving time and labor. Moreover, the wick structure 15 integrally formed with the main body may have stable quality and can be differently configured according to users' requirements.
In the step S1, a first plate and a second plate are provided.
In the step S2, a wick structure is formed on two facing inner surfaces of the first and the second plate by way of mechanically processing.
In the step S3, the first and the second plate are closed to each other, so as to define a chamber therein between; and the chamber is evacuated and filled with a working fluid before being sealed.
Since the steps S1 to S3 are identical to those in the first method, they are not described in details herein. The second method is different from the first method in the step S4, which is performed after the step S1. In the step S4, at least one supporting structure is formed on an inner surface of the first facing toward the second plate or on an inner surface of the second plate facing toward the first plate by way of mechanically processing.
More specifically, in the step S4, the first plate 11 is machined on its inner surface facing toward the second plate 12, such as by stamping, rolling, slotting, or milling, so that at least one supporting structure 17 is formed on the inner surface of the first plate 11. Alternatively, the second plate 12 is machined on its inner surface facing toward the first plate 1, so that at least one supporting structure 17 is formed on the inner surface of the second plate 12. The supporting structure 17 provides effective supporting to prevent the first and the second plate 11, 12 from undesired deformation.
In the step S1, a first plate and a second plate are provided.
In the step S2, a wick structure is formed on two facing inner surfaces of the first and the second plate by way of mechanically processing.
In the step S3, the first and the second plate are closed to each other, so as to define a chamber therein between; and the chamber is evacuated and filled with a working fluid before being sealed.
Since the steps S1 to S3 are identical to those in the first method, they are not described in details herein. The third method is different from the first method in the step S5, which is performed after the step S1. In the step S5, a plurality of supporting structures is formed on two facing inner surfaces of the first and the second plate by way of mechanically processing.
More specifically, in the step S5, the first plate 11 and the second plate 12 are machined on their two facing inner surfaces, so that a plurality of supporting structures 17 is formed on the two facing inner surfaces of the first and second plates 11, 12. The supporting structures 17 integrally formed on the two facing inner surfaces of the first and second plates 11, 12 not only effectively structurally reinforce the first and the second plate 11, 12, but also provide excellent supporting to prevent the first and the second plate 11, 12 from undesired deformation.
Accordingly, compared to the prior art vapor chamber, the vapor chamber of the present invention provides the following advantages: (1) saving time and labor for manufacturing the vapor chamber and the wick structure thereof; (2) enabling increased yield thereof; and (3) reinforcing and protecting the main body of the vapor chamber from deformation.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims
1. A vapor chamber with integrally formed wick structure, comprising:
- a main body including a first plate and a second plate; the first plate and the second plate being closed to each other, so as to define a chamber therein between; and the chamber being filled with a working fluid; and
- a wick structure being formed on two facing inner surfaces of the first and the second plate to project from the first and the second plate toward a central space in the chamber.
2. The vapor chamber with integrally formed wick structure as claimed in claim 1, further comprising at least one supporting structure; the supporting structure being formed on the inner surface of one of the first and the second plate having the wick structure formed thereon.
3. The vapor chamber with integrally formed wick structure as claimed in claim 1, further comprising a plurality of supporting structures; the supporting structures being formed on the two facing inner surfaces of the first and the second plate having the wick structure formed thereon.
4. The vapor chamber with integrally formed wick structure as claimed in claim 1, wherein the first plate is provided on an outer surface with a
5. The vapor chamber with integrally formed wick structure as claimed in claim 2, wherein the first plate is provided on an outer surface with a radiating fin unit; and the radiating fin unit including a plurality of radiating fins outward extended from the outer surface of the first plate.
6. The vapor chamber with integrally formed wick structure as claimed in claim 3, wherein the first plate is provided on an outer surface with a radiating fin unit; and the radiating fin unit including a plurality of radiating fins outward extended from the outer surface of the first plate.
7. The vapor chamber with integrally formed wick structure as claimed in claim 1, wherein the wick structure is integrally formed on the two facing inner surfaces of the first and the second plate.
8. The vapor chamber with integrally formed wick structure as claimed in claim 1, wherein the wick structure is selected from the group consisting of grooves, roughened surfaces, and grids.
9. A method of manufacturing vapor chamber with integrally formed wick structure, comprising the following steps:
- providing a first and a second plate;
- forming a wick structure on two facing inner surfaces of the first and the second plate by way of mechanical processing; and
- closing the first and the second plate to each other to thereby define a chamber therein between; evacuating the chamber, filling the chamber with a working fluid, and sealing the chamber.
10. The method of manufacturing vapor chamber with integrally formed wick structure as claimed in claim 9, further comprising a step after the step of providing the first and the second plate to mechanically process an inner surface of one of the first and the second plate, so as to form at least one supporting structure on the inner surface.
11. The method of manufacturing vapor chamber with integrally formed wick structure as claimed in claim 9, further comprising a step after the step of providing the first and the second plate to mechanically process two facing inner surfaces of the first and the second plate, so as to form a plurality of supporting structures on the two facing inner surfaces.
12. The method of manufacturing vapor chamber with integrally formed wick structure as claimed in claim 9, wherein the wick structure is selected from the group consisting of grooves, roughened surfaces, and grids.
13. The method of manufacturing vapor chamber with integrally formed wick structure as claimed in claim 9, wherein the mechanical processing is selected from the group consisting of stamping, rolling, slotting and milling.
Type: Application
Filed: Nov 18, 2011
Publication Date: May 23, 2013
Inventor: Chih-Peng Chen (New Taipei City)
Application Number: 13/299,707
International Classification: F28D 15/04 (20060101); B21D 53/02 (20060101);