Patents by Inventor Chih-Ping Hsu

Chih-Ping Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10896882
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes bonding a portion of an inactive surface of an electronic component to a thermal conductive layer of a heat dissipating element, encapsulating the electronic component and the thermal conductive layer with an encapsulant, and forming a circuit structure on the encapsulant and electrically connecting the circuit structure to the electronic component. Since the heat dissipating element is bonded to the electronic component through the thermal conductive layer, the heat dissipating effect of the electronic package is improved.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: January 19, 2021
    Assignee: PHOENIX & CORPORATION
    Inventors: Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang
  • Patent number: 10853552
    Abstract: A method of manufacturing an integrated circuit (IC) includes receiving a layout of the IC having a first region interposed between two second regions. The layout includes a first layer having first features and second and third layer having second and third features in the first region. The second and third features collectively form cut patterns for the first features. The method further includes modifying the second and third features by a mask house tool, resulting in modified second and third features, which collectively form modified cut patterns for the first features. The modifying of the second and third features meets at least one of following conditions: total spacing between adjacent modified second (third) features is greater than total spacing between adjacent second (third) features, and total length of the modified second (third) features is smaller than total length of the second (third) features.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Lin Wu, Cheng-Cheng Kuo, Chia-Ping Chiang, Chih-Wei Hsu, Hua-Tai Lin, Kuei-Shun Chen, Yuan-Hsiang Lung, Yan-Tso Tsai
  • Publication number: 20200258784
    Abstract: A fin structure is on a substrate. The fin structure includes an epitaxial region having an upper surface and an under-surface. A contact structure on the epitaxial region includes an upper contact portion and a lower contact portion. The upper contact portion includes a metal layer over the upper surface and a barrier layer over the metal layer. The lower contact portion includes a metal-insulator-semiconductor (MIS) contact along the under-surface. The MIS contact includes a dielectric layer on the under-surface and the barrier layer on the dielectric layer.
    Type: Application
    Filed: May 1, 2020
    Publication date: August 13, 2020
    Inventors: Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang, Chen-Feng Hsu, Hau-Yu Lin, Chih-Hsin Ko, Sey-Ping Sun, Clement Hsingjen Wann
  • Patent number: 10684842
    Abstract: A portable electronic device includes a transmission interface, a wireless communication circuit and microprocessor. The wireless communication circuit connects to a cloud server through the Internet. The microprocessor obtains firmware-version information and device-setting information of an electronic device through the transmission interface, and controls the wireless communication circuit to send the firmware-version information and the device-setting information to the cloud server.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 16, 2020
    Assignee: ACER INCORPORATED
    Inventors: Shih-Hao Lin, Chao-Kuang Yang, Wen-Cheng Hsu, Wen-Ping Chang, Chih-Hsueh Huang
  • Patent number: 10651091
    Abstract: A fin structure is on a substrate. The fin structure includes an epitaxial region having an upper surface and an under-surface. A contact structure on the epitaxial region includes an upper contact portion and a lower contact portion. The upper contact portion includes a metal layer over the upper surface and a barrier layer over the metal layer. The lower contact portion includes a metal-insulator-semiconductor (MIS) contact along the under-surface. The MIS contact includes a dielectric layer on the under-surface and the barrier layer on the dielectric layer.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: May 12, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang, Chen-Feng Hsu, Hau-Yu Lin, Chih-Hsin Ko, Sey-Ping Sun, Clement Hsingjen Wann
  • Publication number: 20200126976
    Abstract: A device includes a dielectric layer, an interlayer metal pad in the dielectric layer, a first capacitor over the interlayer metal pad, and a second capacitor over the dielectric layer. The first capacitor includes a first bottom capacitor electrode over and in contact with the interlayer metal pad, a first top capacitor electrode, and a first inter-electrode dielectric layer between the first bottom capacitor electrode and the first top capacitor electrode. The second capacitor includes a second bottom capacitor electrode over and in contact with the dielectric layer, a second top capacitor electrode, and a second inter-electrode dielectric layer between the second bottom capacitor electrode and the second top capacitor electrode.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 23, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shao-Yu CHEN, Chih-Ping CHAO, Chun-Hung CHEN, Chung-Long CHANG, Kuan-Chi TSAI, Wei-Kung TSAI, Hsiang-Chi CHEN, Ching-Chung HSU, Cheng-Chang HSU, Yi-Sin WANG
  • Patent number: 10515949
    Abstract: An integrated circuit includes a stacked MIM capacitor and a thin film resistor and methods of fabricating the same are disclosed. A capacitor bottom metal in one capacitor of the stacked MIM capacitor and the thin film resistor are substantially at the same layer of the integrated circuit, and the capacitor bottom metal and the thin film resistor are also made of substantially the same materials. The integrated circuit with both of a stacked MIM capacitor and a thin film resistor can be made in a cost benefit way accordingly, so as to overcome disadvantages mentioned above.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: December 24, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shao-Yu Chen, Chih-Ping Chao, Chun-Hung Chen, Chung-Long Chang, Kuan-Chi Tsai, Wei-Kung Tsai, Hsiang-Chi Chen, Ching-Chung Hsu, Cheng-Chang Hsu, Yi-Sin Wang
  • Publication number: 20190258770
    Abstract: A method of manufacturing an integrated circuit (IC) includes receiving a layout of the IC having a first region interposed between two second regions. The layout includes a first layer having first features and second and third layer having second and third features in the first region. The second and third features collectively form cut patterns for the first features. The method further includes modifying the second and third features by a mask house tool, resulting in modified second and third features, which collectively form modified cut patterns for the first features. The modifying of the second and third features meets at least one of following conditions: total spacing between adjacent modified second (third) features is greater than total spacing between adjacent second (third) features, and total length of the modified second (third) features is smaller than total length of the second (third) features.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Inventors: Yun-Lin Wu, Cheng-Cheng Kuo, Chia-Ping Chiang, Chih-Wei Hsu, Hua-Tai Lin, Kuei-Shun Chen, Yuan-Hsiang Lung, Yan-Tso Tsai
  • Publication number: 20190252261
    Abstract: A fin structure is on a substrate. The fin structure includes an epitaxial region having an upper surface and an under-surface. A contact structure on the epitaxial region includes an upper contact portion and a lower contact portion. The upper contact portion includes a metal layer over the upper surface and a barrier layer over the metal layer. The lower contact portion includes a metal-insulator-semiconductor (MIS) contact along the under-surface. The MIS contact includes a dielectric layer on the under-surface and the barrier layer on the dielectric layer.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang, Chen-Feng Hsu, Hau-Yu Lin, Chih-Hsin Ko, Sey-Ping Sun, Clement Hsingjen Wann
  • Publication number: 20190214349
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes bonding a portion of an inactive surface of an electronic component to a thermal conductive layer of a heat dissipating element, encapsulating the electronic component and the thermal conductive layer with an encapsulant, and forming a circuit structure on the encapsulant and electrically connecting the circuit structure to the electronic component. Since the heat dissipating element is bonded to the electronic component through the thermal conductive layer, the heat dissipating effect of the electronic package is improved.
    Type: Application
    Filed: March 15, 2019
    Publication date: July 11, 2019
    Inventors: Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang
  • Publication number: 20190082478
    Abstract: Certain aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may determine a predicted tune-away for a set of voice frames. In some aspects, the user equipment may alter a vocoder rate from a first vocoder rate to a second vocoder rate that is less than the first vocoder rate based at least in part on determining the predicted tune-away for the set of voice frames. In some aspects, the user equipment may drop, in connection with an occurrence of the predicted tune-away, a subset of packets for a time period corresponding to the predicted tune-away. Numerous other aspects are provided.
    Type: Application
    Filed: September 13, 2017
    Publication date: March 14, 2019
    Inventors: Kuo-Chun LEE, Qingxin Chen, Min Wang, Chih-Ping Hsu, Omar Sabbarini
  • Patent number: 10231282
    Abstract: Certain aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may determine a predicted tune-away for a set of voice frames. In some aspects, the user equipment may alter a vocoder rate from a first vocoder rate to a second vocoder rate that is less than the first vocoder rate based at least in part on determining the predicted tune-away for the set of voice frames. In some aspects, the user equipment may drop, in connection with an occurrence of the predicted tune-away, a subset of packets for a time period corresponding to the predicted tune-away. Numerous other aspects are provided.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: March 12, 2019
    Assignee: QUALCOMM, Incorporated
    Inventors: Kuo-Chun Lee, Qingxin Chen, Min Wang, Chih-Ping Hsu, Omar Sabbarini
  • Publication number: 20170353955
    Abstract: Methods, systems, and devices for wireless communication are described. A user equipment (UE) may perform uplink communications on a first radio frequency spectrum band using a first transceiver and a first antenna. The first transceiver may have a first capability configuration. The UE may receive an assignment for uplink communications on a second radio frequency spectrum band and couple a second transceiver to the first antenna to perform the uplink communications on the first radio frequency spectrum band. The spectrum transceiver may have a second capability configuration that is different from the first capability configuration with respect to at least the second radio frequency spectrum band. The UE may switch the first transceiver to a second antenna for the uplink communications on the second radio frequency spectrum band.
    Type: Application
    Filed: June 1, 2016
    Publication date: December 7, 2017
    Inventors: Chih-Ping Hsu, Tarandeep Virk, Robert Chan, Xiaohu Zhang
  • Publication number: 20170295513
    Abstract: Embodiments include systems and methods for managing access to receive chains of a multi-subscription multi-standby (MSMS) communication device. A device processor may determine a receive mode of the MSMS communication device. In response to determining that the receive mode is a diversity sharing mode, the device processor may determine a first subscription schedule and a second subscription schedule. The device processor may that there is an upcoming overlap between the first subscription schedule and the second subscription schedule, and in response the device processor may prevent the second subscription from using the second receive chain.
    Type: Application
    Filed: June 22, 2017
    Publication date: October 12, 2017
    Inventors: Kuo-Chun Lee, Sivaramakrishna Veerepalli, Chih-Ping Hsu, Jack Shyh-Hurng Shauh, Shailesh Maheshwari, Mohan Krishna Gowda, Alexey Semjonovs, Omar Sabbarini, Daniel Amerga, Shishir Ramesha, Pavan Chaithanya Kiavaram, Ramchandran Srinivasan
  • Patent number: 9648635
    Abstract: Embodiments described herein relate to systems and methods for scheduling subscriptions in a user equipment (UE) having at least a first receive radio and a second receive radio, including receiving, by the first receive radio, a broadcast activity for a first subscription and receiving, by the second receive radio, a reception activity for a second subscription. A trigger event is detected while the broadcast activity for the first subscription is being received by the first receive radio and the reception activity for the second subscription is being received by the second receive radio. In response to detecting the trigger event, the reception activity for the second subscription is received by the first receive radio and the broadcast activity for the first subscription is received by the second receive radio.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: May 9, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Kuo-Chun Lee, Chih-Ping Hsu, Jack Shyh-Hurng Shauh, Sivaramakrishna Veerepalli, Reza Shahidi, Chintan Shirish Shah, Francis Ming-Meng Ngai, Daniel Amerga, Shailesh Maheshwari
  • Publication number: 20170086210
    Abstract: Embodiments include systems and methods for managing inter-radio access technology (IRAT) procedure concurrency between subscriptions on a multi-subscription multi-active communication device. A device processor may identify a higher-priority subscription and a lower-priority subscription on the multi-subscription multi-active communication device. The device processor may determine whether an IRAT procedure on the lower-priority subscription will overlap in time with an IRAT procedure on the higher-priority subscription. The device processor may calculate a deferral time period for the lower-priority subscription in response to determining that the IRAT procedure on the lower-priority subscription will overlap in time with the IRAT procedure on the higher-priority subscription.
    Type: Application
    Filed: September 23, 2015
    Publication date: March 23, 2017
    Inventors: Anand Rajurkar, Parthasarathy Krishnamoorthy, Chih-Ping Hsu, Reza Shahidi, Raghavendra Shyam Anand
  • Publication number: 20170078951
    Abstract: Embodiments include systems and methods for managing access to receive chains of a multi-subscription multi-standby (MSMS) communication device. A device processor may determining a receive mode of the MSMS communication device. In response to determining that the receive mode is a diversity sharing mode, the device processor may monitor a data loss from the broadcast data stream, and may determine a first subscription schedule and a second subscription schedule. The device processor may determine that the data loss is greater than or equal to a threshold, and the device processor may determine that there is an upcoming overlap between the first subscription schedule and the second subscription schedule. The device processor may prevent the second subscription from using the second receive chain.
    Type: Application
    Filed: October 2, 2015
    Publication date: March 16, 2017
    Inventors: Kuo-Chu Lee, Sivaramakrishna Veerepalli, Chih-Ping Hsu, Jack Shyh-Hurng Shauh, Shailesh Maheshwari, Mohan Krishna Gowda, Alexey Semjonovs, Omar Sabbarini, Daniel Amerga, Shishir Ramesha, Pavan Chaithanya Kiavaram, Ramchandran Srinivasan
  • Patent number: 9549354
    Abstract: Various embodiments include methods, systems, and devices for communicating with a first network and a second network using a mobile device having a single radio comprising a transmitter and a receiver. The transmitter and the receiver may be tuned to the first network. The transmitter may also transmit to the first network. The receiver may tune away to the second network for a tune-away period. The transmitter may transmit to the first network during the tune-away period. A determination may be made whether the transmitter and the receiver will cause interference during the tune-away period. Transmissions may be paused from the transmitter in response to determining that the transmitter and the receiver will cause interference during the tune-away period.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: January 17, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Chih-Ping Hsu, Farrukh Usmani, Ling Hang, Rajagopal Jeenagala
  • Publication number: 20160374108
    Abstract: Embodiments described herein relate to systems and methods for scheduling subscriptions in a user equipment (UE) having at least a first receive radio and a second receive radio, including receiving, by the first receive radio, a broadcast activity for a first subscription and receiving, by the second receive radio, a reception activity for a second subscription. A trigger event is detected while the broadcast activity for the first subscription is being received by the first receive radio and the reception activity for the second subscription is being received by the second receive radio. In response to detecting the trigger event, the reception activity for the second subscription is received by the first receive radio and the broadcast activity for the first subscription is received by the second receive radio.
    Type: Application
    Filed: June 19, 2015
    Publication date: December 22, 2016
    Inventors: Kuo-Chun Lee, Chih-Ping Hsu, Jack Shyh-Hurng Shauh, Sivaramakrishna Veerepalli, Reza Shahidi, Chintan Shirish Shah, Francis Ming-Meng Ngai, Daniel Amerga, Shailesh Maheshwari
  • Publication number: 20160353516
    Abstract: Various embodiments include methods implemented on a mobile communication device for sharing network information among subscriptions when both a first subscription and a second subscription are in an idle mode. The methods may include determining whether the first subscription and the second subscription share a network operator and are camped on a same base station. If so, the first subscription may receive network information from the base station and store the network information in a shared memory of the mobile communication device that can be accessed by the second subscription. The second subscription may then perform some idle mode operations using the network information stored in the shared memory.
    Type: Application
    Filed: May 26, 2015
    Publication date: December 1, 2016
    Inventors: Anand Rajurkar, Chih-Ping Hsu, Reza Shahidi, Parthasarathy Krishnamoorthy