Patents by Inventor Chih-Ping Lu

Chih-Ping Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100109828
    Abstract: A transformer includes a main body and a wire. The main body has several winding partitions and two end portions. Several leads are disposed in either end portion and a buffer region is formed between the right end portion and the right-most winding partition. An intermediate area is disposed between the buffer region and the right-most winding partition. One end of the wire is connected to one of the leads and the wire passes the right end portion. Before the wire goes into the buffer region, the wire is folded for several times and then is twisted and rolled for several turns to make the wire thicker. Next, the thicker wire is wound around the iron core in the buffer region for several turns and then the thicker wire passes the intermediate area and goes into the right-most winding partition.
    Type: Application
    Filed: October 30, 2009
    Publication date: May 6, 2010
    Inventors: Chih-Ping LU, Chih-Shen Chiang
  • Publication number: 20070260404
    Abstract: This patent delineates methods for quantifying and mitigating dip-induced azimuthal AVO effects in seismic fracture detection using Azimuthal AVO analysis by accurately accounting for the divergence correction and azimuthal dependence of the reflection angle. Solutions are provided for three cases: (1) dipping isotropic reservoirs; (2) anisotropic reservoirs with fractures aligned in arbitrary direction; and (3) anisotropic reservoirs where vertical fractures are aligned perpendicular to the dip direction.
    Type: Application
    Filed: October 14, 2005
    Publication date: November 8, 2007
    Inventors: Wenjie Dong, Chih-Ping Lu
  • Patent number: 6866825
    Abstract: A micro-dispenser for dispensing predetermined amounts of fluids under the control of a controller. The micro-dispenser comprises a base and a high-density array of tube assemblies. The base, having a plurality of holes, is electrically connected to the controller. The tube assemblies, pre-filled with predetermined fluids, are detachably disposed in the holes and separately electrically connected to the base. The tube assemblies dispense the fluids through the base under the control of the controller. The tube assemblies are replaceable.
    Type: Grant
    Filed: November 5, 2001
    Date of Patent: March 15, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Chung-Fan Chiou, Ying-Chi Chen, Shyh-Haur Su, Chih-Ping Lu, Ching-Yi Mao, Je-Ping Hu
  • Publication number: 20030086828
    Abstract: A micro-dispenser for dispensing predetermined amounts of fluids under the control of a controller. The micro-dispenser comprises a base and a high-density array of tube assemblies. The base, having a plurality of holes, is electrically connected to the controller. The tube assemblies, pre-filled with predetermined fluids, are detachably disposed in the holes and separately electrically connected to the base. The tube assemblies dispense the fluids through the base under the control of the controller. The tube assemblies are replaceable.
    Type: Application
    Filed: November 5, 2001
    Publication date: May 8, 2003
    Applicant: Industrial Technology Research Institute
    Inventors: Chung-Fan Chiou, Ying-Chi Chen, Shyh-Haur Su, Chih-Ping Lu, Ching-Yi Mao, Je-Ping Hu
  • Publication number: 20020075368
    Abstract: The present invention pertains to a packaging method and the structure of an inkjet cartridge print head chip. The main technique disclosed herein is to package a chip substrate that can resist the corrosion of the ink at the ink cartridge outlet. A preferred embodiment is to package the chip substrate at the ink outlet at the same time when the inkjet cartridge is formed through plastic molding. Another preferred embodiment is to package the chip substrate at the ink cartridge outlet using ultrasonic or heat welding and then glue the print head on the chip substrate. These means can solve the problem of ink leakage in conventional ink cartridge because of the corrosion of ink to the glue between the print head chip and the ink cartridge.
    Type: Application
    Filed: August 9, 2001
    Publication date: June 20, 2002
    Inventors: Shyh-Haur Su, Chieh-Wen Wang, Chih-Ping Lu