Patents by Inventor Chih-Ping Peng
Chih-Ping Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240123580Abstract: A hand tool capable of switching operating direction includes: a handgrip (10); an actuating unit (20) having an actuating seat (21) and a positioning set (25), the actuating seat (21) has an accommodating slot (221) and pivotal slots (222), the positioning set (25) has an elastic member (26) and a positioning member (27); a positioning unit (30) having latching members (31) and an elastic unit (32), the latching members (31) is pivotally connected to the pivotal slot (222) and has a latching tooth (331); a switching component (40) having a rotation disk (41) and abutting blocks (42), the rotation disk (41) has positioning slots (43) allowing the positioning member (27) to be mounted; and a rotating rod (50) having a ratchet (52); the positioning member (27) is selectively mounted in one of the positioning slots (27) when the rotation disk (41) is being rotated.Type: ApplicationFiled: October 18, 2022Publication date: April 18, 2024Inventor: Chih-Ping PENG
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Patent number: 10163762Abstract: A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.Type: GrantFiled: June 10, 2015Date of Patent: December 25, 2018Assignee: VISHAY GENERAL SEMICONDUCTOR LLCInventors: Hui-Ying Ding, Pengnian Wang, Tao Yu, Jun-Feng Liu, Jun-Kai Bai, Chih-Ping Peng
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Patent number: 9966429Abstract: A semiconductor device such as a Zener diode includes a first semiconductor material of a first conductivity type and a second semiconductor material of a second conductivity type in contact with the first semiconductor material to form a junction therebetween. A first oxide layer is disposed over a portion of the second semiconductor material such that a remaining portion of the second semiconductor material is exposed. A polysilicon layer is disposed on the exposed portion of the second semiconductor material and a portion of the first oxide layer. A first conductive layer is disposed on the polysilicon layer. A second conductive layer is disposed on a surface of the first semiconductor material opposing a surface of the first semiconductor material in contact with the second semiconductor material.Type: GrantFiled: August 6, 2015Date of Patent: May 8, 2018Assignee: VISHAY GENERAL SEMICONDUCTOR LLCInventors: Shih-Kuan Chen, Wan-Lan Chiang, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin
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Publication number: 20160365305Abstract: A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.Type: ApplicationFiled: June 10, 2015Publication date: December 15, 2016Inventors: Hui-Ying Ding, Pengnian Wang, Tao Yu, Jun-Feng Liu, Jun-Kai Bai, Chih-Ping Peng
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Patent number: 9331142Abstract: A semiconductor device such as a Zener diode includes a first semiconductor material of a first conductivity type and a second semiconductor material of a second conductivity type in contact with the first semiconductor material to form a junction therebetween. A first oxide layer is disposed over a portion of the second semiconductor material such that a remaining portion of the second semiconductor material is exposed. A polysilicon layer is disposed on the exposed portion of the second semiconductor material and a portion of the first oxide layer. A first conductive layer is disposed on the polysilicon layer. A second conductive layer is disposed on a surface of the first semiconductor material opposing a surface of the first semiconductor material in contact with the second semiconductor material.Type: GrantFiled: August 6, 2015Date of Patent: May 3, 2016Assignee: VISHAY GENERAL SEMICONDUCTOR LLCInventors: Shih-Kuan Chen, Wan-Lan Chiang, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin
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Patent number: 9202935Abstract: A semiconductor device such as a Zener diode includes a first semiconductor material of a first conductivity type and a second semiconductor material of a second conductivity type in contact with the first semiconductor material to form a junction therebetween. A first oxide layer is disposed over a portion of the second semiconductor material such that a remaining portion of the second semiconductor material is exposed. A polysilicon layer is disposed on the exposed portion of the second semiconductor material and a portion of the first oxide layer. A first conductive layer is disposed on the polysilicon layer. A second conductive layer is disposed on a surface of the first semiconductor material opposing a surface of the first semiconductor material in contact with the second semiconductor material.Type: GrantFiled: October 1, 2013Date of Patent: December 1, 2015Assignee: VISHAY GENERAL SEMICONDUCTOR LLCInventors: Shih-Kuan Chen, Wan-Lan Chiang, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin
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Publication number: 20150340431Abstract: A semiconductor device such as a Zener diode includes a first semiconductor material of a first conductivity type and a second semiconductor material of a second conductivity type in contact with the first semiconductor material to form a junction therebetween. A first oxide layer is disposed over a portion of the second semiconductor material such that a remaining portion of the second semiconductor material is exposed. A polysilicon layer is disposed on the exposed portion of the second semiconductor material and a portion of the first oxide layer. A first conductive layer is disposed on the polysilicon layer. A second conductive layer is disposed on a surface of the first semiconductor material opposing a surface of the first semiconductor material in contact with the second semiconductor material.Type: ApplicationFiled: August 6, 2015Publication date: November 26, 2015Inventors: Shih-Kuan Chen, Wan-Lan Chiang, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin
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Publication number: 20150340458Abstract: A semiconductor device such as a Zener diode includes a first semiconductor material of a first conductivity type and a second semiconductor material of a second conductivity type in contact with the first semiconductor material to form a junction therebetween. A first oxide layer is disposed over a portion of the second semiconductor material such that a remaining portion of the second semiconductor material is exposed. A polysilicon layer is disposed on the exposed portion of the second semiconductor material and a portion of the first oxide layer. A first conductive layer is disposed on the polysilicon layer. A second conductive layer is disposed on a surface of the first semiconductor material opposing a surface of the first semiconductor material in contact with the second semiconductor material.Type: ApplicationFiled: August 6, 2015Publication date: November 26, 2015Inventors: Shih-Kuan Chen, Wan-Lan Chiang, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin
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Patent number: 9041188Abstract: An axially-mountable device includes a semiconductor chip comprising lower and upper electrical contacts. A lower die pad is electrically and mechanically connected to the lower electrical contact of the chip. An upper die pad is electrically and mechanically connected to the upper electrical contact of the chip. A first axially extending electrical lead is electrically and mechanically connected to the upper die pad and extends in a first axial direction. A second axially extending electrical lead is electrically and mechanically connected to the lower die pad and extends in a second axial direction that is opposite to the first axial direction. Packaging material encapsulates the semiconductor chip, the upper and lower die pads and a portion of the first and second axially extending leads. The first and second leads extend from the packaging material and are adapted to allow the device to be axially-mounted with another electrical component.Type: GrantFiled: November 10, 2012Date of Patent: May 26, 2015Assignee: VISHAY GENERAL SEMICONDUCTOR LLCInventors: Wan-Lan Chiang, Chih-Ping Peng, Hui-Ying Ding
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Publication number: 20150091136Abstract: A semiconductor device such as a Zener diode includes a first semiconductor material of a first conductivity type and a second semiconductor material of a second conductivity type in contact with the first semiconductor material to form a junction therebetween. A first oxide layer is disposed over a portion of the second semiconductor material such that a remaining portion of the second semiconductor material is exposed. A polysilicon layer is disposed on the exposed portion of the second semiconductor material and a portion of the first oxide layer. A first conductive layer is disposed on the polysilicon layer. A second conductive layer is disposed on a surface of the first semiconductor material opposing a surface of the first semiconductor material in contact with the second semiconductor material.Type: ApplicationFiled: October 1, 2013Publication date: April 2, 2015Applicant: Vishay General Semiconductor LLCInventors: Shih-Kuan Chen, Wan-Lan Chiang, Ming-Tai Chiang, Chih-Ping Peng, Yih-Yin Lin
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Patent number: 8796840Abstract: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.Type: GrantFiled: March 16, 2012Date of Patent: August 5, 2014Assignee: Vishay General Semiconductor LLCInventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
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Publication number: 20140131842Abstract: An axially-mountable device includes a semiconductor chip comprising lower and upper electrical contacts. A lower die pad is electrically and mechanically connected to the lower electrical contact of the chip. An upper die pad is electrically and mechanically connected to the upper electrical contact of the chip. A first axially extending electrical lead is electrically and mechanically connected to the upper die pad and extends in a first axial direction. A second axially extending electrical lead is electrically and mechanically connected to the lower die pad and extends in a second axial direction that is opposite to the first axial direction. Packaging material encapsulates the semiconductor chip, the upper and lower die pads and a portion of the first and second axially extending leads. The first and second leads extend from the packaging material and are adapted to allow the device to be axially-mounted with another electrical component.Type: ApplicationFiled: November 10, 2012Publication date: May 15, 2014Applicant: Vishay General Semiconductor LLCInventors: Wan-Lan Chiang, Chih-Ping Peng, Hui-Ying Ding
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Patent number: 8252633Abstract: The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.Type: GrantFiled: February 22, 2011Date of Patent: August 28, 2012Assignee: Vishay General Semiconductor LLCInventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
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Publication number: 20120168932Abstract: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.Type: ApplicationFiled: March 16, 2012Publication date: July 5, 2012Applicant: Vishay General Semiconductor LLCInventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
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Patent number: 8138597Abstract: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.Type: GrantFiled: November 4, 2010Date of Patent: March 20, 2012Assignee: Vishay General Semiconductor LLCInventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
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Publication number: 20110171784Abstract: The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.Type: ApplicationFiled: February 22, 2011Publication date: July 14, 2011Applicant: VISHAY GENERAL SEMICONDUCTOR LLCInventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
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Patent number: 7915728Abstract: The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.Type: GrantFiled: July 12, 2007Date of Patent: March 29, 2011Assignee: Vishay General Semiconductor LLCInventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
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Publication number: 20110049700Abstract: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.Type: ApplicationFiled: November 4, 2010Publication date: March 3, 2011Applicant: VISHAY GENERAL SEMICONDUCTOR LLCInventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
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Patent number: 7838985Abstract: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.Type: GrantFiled: July 12, 2007Date of Patent: November 23, 2010Assignee: Vishay General Semiconductor LLCInventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
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Patent number: 7821189Abstract: This invention provides a method for maintaining vacuum of a panel module and a structure of the panel module. A sealing material is suspended inside the panel module right above an exhaust opening of the panel module connecting with an exhaust tube. After exhausting the inside of the panel module, the sealing material is heated and molten so as to drop down to seal the exhaust tube. As such, the panel module becomes vacuum-tight. During a subsequent annealing process to heat the exhaust tube to its melting temperature, ambient air is prohibited from flowing into the panel module.Type: GrantFiled: May 17, 2006Date of Patent: October 26, 2010Assignee: Industrial Technology Research InstituteInventors: Chih-Ping Peng, Yun-Jiau Shiau