Patents by Inventor Chih-Ping Peng

Chih-Ping Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7821189
    Abstract: This invention provides a method for maintaining vacuum of a panel module and a structure of the panel module. A sealing material is suspended inside the panel module right above an exhaust opening of the panel module connecting with an exhaust tube. After exhausting the inside of the panel module, the sealing material is heated and molten so as to drop down to seal the exhaust tube. As such, the panel module becomes vacuum-tight. During a subsequent annealing process to heat the exhaust tube to its melting temperature, ambient air is prohibited from flowing into the panel module.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: October 26, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Ping Peng, Yun-Jiau Shiau
  • Patent number: 7780494
    Abstract: This invention provides a method for maintaining vacuum of a panel module and a structure of the panel module. A sealing material is suspended inside the panel module right above an exhaust opening of the panel module connecting with an exhaust tube. After exhausting the inside of the panel module, the sealing material is heated and molten so as to drop down to seal the exhaust tube. As such, the panel module becomes vacuum-tight. During a subsequent annealing process to heat the exhaust tube to its melting temperature, ambient air is prohibited from flowing into the panel module.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: August 24, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Ping Peng, Yun-Jiau Shiau
  • Publication number: 20090139645
    Abstract: This invention provides a method for maintaining vacuum of a panel module and a structure of the panel module. A sealing material is suspended inside the panel module right above an exhaust opening of the panel module connecting with an exhaust tube. After exhausting the inside of the panel module, the sealing material is heated and molten so as to drop down to seal the exhaust tube. As such, the panel module becomes vacuum-tight. During a subsequent annealing process to heat the exhaust tube to its melting temperature, ambient air is prohibited from flowing into the panel module.
    Type: Application
    Filed: January 22, 2009
    Publication date: June 4, 2009
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Ping Peng, Yun-Jiau Shiau
  • Patent number: 7489071
    Abstract: The present invention provides a field emission system and a method for improving its vacuum. The present invention employs aging surface-unsaturated carbon nanotubes in non-display areas of the field emission system as getter material to absorb residual gas within the system so as to improve its vacuum. The present method for improving vacuum of the field emission system can be integrated with the standard process of a field emission display device without additional fabricating steps, and thus facilitating the mass production of the field emission display device.
    Type: Grant
    Filed: November 7, 2006
    Date of Patent: February 10, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Han Chien, Chih-Ping Peng, Chuan-Hsu Fu, Wei-Yi Lin, Lih-Hsiung Chan
  • Publication number: 20090014863
    Abstract: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.
    Type: Application
    Filed: July 12, 2007
    Publication date: January 15, 2009
    Inventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
  • Publication number: 20090014862
    Abstract: The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package.
    Type: Application
    Filed: July 12, 2007
    Publication date: January 15, 2009
    Inventors: Wan-Lan Chiang, Kuang Hann Lin, Chih-Ping Peng
  • Publication number: 20080042547
    Abstract: The present invention provides a field emission system and a method for improving its vacuum. The present invention employs aging surface-unsaturated carbon nanotubes in non-display areas of the field emission system as getter material to absorb residual gas within the system so as to improve its vacuum. The present method for improving vacuum of the field emission system can be integrated with the standard process of a field emission display device without additional fabricating steps, and thus facilitating the mass production of the field emission display device.
    Type: Application
    Filed: November 7, 2006
    Publication date: February 21, 2008
    Inventors: Yu-Han Chien, Chih-Ping Peng, Chuan-Hsu Fu, Wei-Yi Lin, Lih-Hsiung Chan
  • Publication number: 20070210695
    Abstract: This invention provides a method for maintaining vacuum of a panel module and a structure of the panel module. A sealing material is suspended inside the panel module right above an exhaust opening of the panel module connecting with an exhaust tube. After exhausting the inside of the panel module, the sealing material is heated and molten so as to drop down to seal the exhaust tube. As such, the panel module becomes vacuum-tight. During a subsequent annealing process to heat the exhaust tube to its melting temperature, ambient air is prohibited from flowing into the panel module.
    Type: Application
    Filed: May 17, 2006
    Publication date: September 13, 2007
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Ping Peng, Yun-Jiau Shiau