Abstract: An electronic device includes: a first panel including a first bonding pad and a first edge adjacent to the first bonding pad; a second panel overlapped with the first panel and including a second bonding pad; a circuit board electrically connected to the first panel and used to provide a first signal; and a first conductive connector electrically connected to the first panel and the second panel, wherein the first signal is input to the first bonding pad of the first panel through the circuit board, and input to the second bonding pad of the second panel through the first conductive connector, wherein the first bonding pad is between the second bonding pad and the first edge in a top view direction.

Abstract: A system includes a primary coil, a series combination having a first conducting wire and a first capacitor coupled in series, a second conducting wire, and a secondary coil. A first end of the series combination is coupled to a first end of the primary coil. A first end of the second conducting wire is coupled to the first end of the primary coil. A second end of the second conducting wire is coupled to the second end of the series combination. A first end of the secondary coil is coupled to an output end.

Abstract: A package assembly and a manufacturing method thereof are provided. The package assembly includes a photonic integrated circuit component, an electric integrated circuit component, a lens and an optical signal port. The photonic integrated circuit component comprises an optical input/output portion configured to transmit and receive optical signal. The electric integrated circuit component is electrically connected to the photonic integrated circuit component. The lens is disposed on a sidewall of the photonic integrated circuit component. The optical signal port is optically coupled to the optical input/output portion.

Abstract: A foldable device includes a pivot base, three supporting rods, at least one folding rod unit, a linkage rod, and a pivot member that is located above the pivot base. The linkage rod has a pivot section that is pivotably connected to the pivot member, and a moving section that is opposite to the pivot section. The at least one folding rod unit is pivotably connected to one of the supporting rods. The moving section of the linkage rod is slidably mounted to the at least one folding rod unit. The at least one folding rod unit includes a folding rod that has a connecting section and a swing section, and that is movable relative to the one of the supporting rods between a folded position, in which the moving section of the linkage rod is adjacent to the swing section of the folding rod, and an expanded position.

Abstract: A medical image analysis system comprises: a database for storing a first medical image data indicating a target medical image; and a server for accessing the database. The server includes: a first analysis module for generating a first determination data according to the first medical image data; a second analysis module for generating a second determination data according to the first medical image data; and an ensemble module communicatively connected with the first and second analysis modules and generating a third determination data according to the first and second determination data. The first and second determination data each indicate whether the target medical image includes a cancerous tissue image or indicate a chance of the target medical image including a cancerous tissue image. The third determination data indicates whether the target medical image includes a cancerous tissue image.

Abstract: A key structure of electronic device including a substrate, a light source disposed on the substrate, an elastic member disposed on the substrate, and a key cap disposed on the elastic member is provided. The elastic member has a tunnel for passing light generated by the light source and projecting toward the key cap. An inner diameter of the tunnel gradually expands from the light source toward the key cap.

Abstract: A double-sided display device includes a transparent self-luminous display panel, a switching panel and a projection device. The transparent self-luminous display panel has a light-emitting side and a backside opposite to the light-emitting side. The switching panel is disposed on the backside of the transparent self-luminous display panel. The switching panel includes a first electrode, a second electrode and a liquid crystal layer disposed between the first electrode and the second electrode. The first electrode and the second electrode are configured to control liquid crystal molecules in the liquid crystal layer so that the switching panel includes a scattering state and a transparent state. The projection device is configured to project toward the light-emitting side of the transparent self-luminous display panel.

Abstract: An anti-plasma coating formed on a surface of a component in a plasma chamber includes an insulation layer on the surface and a plasma-resistant layer on the insulation layer. The plasma-resistant layer includes one or more stacks, where each stack includes a crystalline layer and an amorphous layer. The anti-plasma coating improves a lifetime of the component in the plasma chamber with high-energy plasma sources.

Abstract: A method includes forming first semiconductive sheets over a substrate and arranged in a vertical direction, and second semiconductive sheets over the substrate and arranged in the vertical direction, wherein a number of the second semiconductive sheets is different than a number of the first semiconductive sheets; forming first source/drain regions on either side of each of the first semiconductive sheets, and second source/drain regions on either side of each of the second semiconductive sheets; forming a first gate around each of the first semiconductive sheets, and a second gate around each of the second semiconductive sheets.

Abstract: A method for forming transistors includes forming a stack of alternating first semiconductor layers and second semiconductor layers on a substrate and forming nanostructure channels and interposers by forming a source/drain opening in a first device region of the substrate. The source/drain opening extending through the first and second semiconductor layers. The method includes, after the forming a source/drain opening, increasing tensile strain of the nanostructure channels, and, after the increasing tensile strain, forming a source/drain in the source/drain opening.

Abstract: A display device includes a display panel and a switch panel. The switch panel includes a first substrate disposed on the display panel, a shielding pattern layer, a light transmitting layer, pixel electrodes disposed on the light transmitting layer, a second substrate disposed on the pixel electrodes, and the liquid crystal layer disposed between the first substrate and the second substrate. The shielding pattern layer is disposed on the first substrate and includes opening parts and light shielding parts arranged alternately with the opening parts. Each of the light shielding parts has a first thickness. The light transmitting layer is disposed on the shielding pattern layer and includes filling parts filling the opening parts and extending parts arranged alternately with the filling parts. Each of the filling parts has a second thickness greater than the first thickness.

Abstract: An overlay error measurement method includes disposing a lower-layer pattern over a substrate that includes disposing a first pattern having a first plurality of first sub-patterns extending in a first interval along a first direction and being arranged with a first pitch in a second direction crossing the first direction. The method includes disposing a second pattern having a second plurality of second sub-patterns extending in a second interval along the first direction and being arranged with a second pitch, smaller than the first pitch, in the second direction crossing the first direction. The second sub-patterns are disposed interleaved between the first sub-patterns. The method includes disposing an upper-layer pattern including a third pattern having the first pitch and at least partially overlapping with the lower-layer pattern over the lower-layer pattern and determining an overlay error between the lower-layer pattern and the upper-layer pattern.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive configuration information indicating a power offset, per resource block, between one or more first resource blocks to carry acknowledgement/negative acknowledgement feedback and one or more second resource blocks in a common interlace. The UE may transmit, using the power offset and using a transmission power that depends on whether a downlink pathloss value is indicated in the configuration information, a physical sidelink feedback channel transmission in the one or more first resource blocks and the one or more second resource blocks. Numerous other aspects are described.

Abstract: A pivot shaft assembly includes a shaft member extending through a base seat and including a fixed tubular piece pivotably connected with the base seat, and a movable tubular piece movably disposed within the fixed tubular piece. The fixed and movable tubular pieces respectively have a retreated hole and a through hole extending radially. A fastening member has an engaging protrusion resiliently projecting from the through hole. In a fastened state, the shaft member is inclined and the through hole is aligned with the retreated hole to permit the engaging protrusion to extend through the retreated hole so as to retain the movable tubular piece to the fixed tubular piece. During shifting to a releasable state where the shaft member extends parallel, the engaging protrusion is pressed by a fastener releasing portion and retreated into the retreated hole to permit movement of the movable tubular piece.

Abstract: A bonding tool for bonding semiconductor dies to a semiconductor wafer is provided. The bonding tool includes a wafer chuck, an edge support, a hard plate, and a buffer layer. The wafer chuck carries the semiconductor wafer and the semiconductor dies placed on the semiconductor wafer. The edge support is disposed on the wafer chuck, the semiconductor wafer and the semiconductor dies are laterally surrounded by the edge support, and a top surface of the edge support substantially levels with surfaces of the semiconductor dies. The hard plate is movably disposed over the semiconductor dies, the edge support and the wafer chuck. The buffer layer is disposed on a bottom surface of the hard plate, and the buffer layer is in contact with the top surface of the edge support and the semiconductor dies when the hard plate moves towards the edge support.

Abstract: A method for link transition in a USB device includes transmitting a plurality of first RS-FEC blocks by a first transmitter, receiving an UNBOND set by a receiver, waking up a second transmitter by a LASM when the receiver receives the UNBOND set, transmitting a training sequence by the second transmitter, transmitting a specific pattern sequence by the second transmitter after finishing transmitting the training sequence, determining whether a current RS-FEC block to be transmitted by the first transmitter is a DESKEW block, stopping transmitting the specific pattern sequence if the current RS-FEC block is determined to be the DESKEW block, and transmitting a plurality of second RS-FEC blocks by the first transmitter and the second transmitter.

Abstract: Embodiments of methods are provided herein to form an extreme ultra-violet (EUV) photoresist pattern on a semiconductor substrate using a multilayer photoresist film stack. The disclosed embodiments begin by forming a multilayer photoresist film stack including a plurality of relatively thin photoresist film layers, each layer comprising a different photoresist material. After EUV exposure, the disclosed embodiments selectively develop the different photoresist layers in separate different development steps. In doing so, the process flows and methods disclosed herein increase the resist film thickness and improve development selectivity to avoid the photoresist damage and photoresist pattern collapse that often occurs during conventional EUV lithography processes.

Abstract: A tracking system and a device integrating an existing positional tracking system and a docking mechanism include a tracking system hardware module, a docking mechanism, and a positional tracking software module and are adapted to capture a user's finger movement and send in real time and synchronously the user's finger movement to a computer. The docking mechanism is compatible with an existing third-party positional tracking system such that the device can operate in conjunction with existing, commercially-available positional tracking systems, for example, HTC VIVE Tracker, and Oculus Quest, and thus is applicable to an existing game engine.

Abstract: Semiconductor structures and methods for forming the same are provided. A semiconductor structure according to the present disclosure includes a substrate, a first base fin and a second base fin rising from the substrate, an isolation feature disposed over the substrate and between the first base fin and the second base fin, a first bottom epitaxial feature over the first base fin, a second bottom epitaxial feature over the second base fin, an isolation layer on the first bottom epitaxial feature, a first source/drain feature over the isolation layer, a second source/drain feature disposed over and in contact with the second bottom epitaxial feature, a contact etch stop layer (CESL) over the first source/drain feature and the isolation feature, a first interlayer dielectric (ILD) layer over the CESL, and a second ILD layer over and in direct contact with the second source/drain feature.

Abstract: A foldable device includes a pivot seat, at least one leg rod unit including a leg rod that extends through the pivot seat, and a limiting member that is mounted to the leg rod, at least one connecting member pivoted to the leg rod and having a connecting segment, and a pivot unit including at least one biasing member. When the at least one connecting member is substantially collinear with the leg rod, the at least one connecting member is, under exertion of an external force, movable relative to the leg rod to a limiting position. When the external force is released, the at least one connecting member is biased by a resilient force of the at least one biasing member to move relative to the leg rod from the limiting position to a releasing position.