Abstract: A method of fabricating a wafer-level chip package is provided. First, a wafer with two adjacent chips is provided, the wafer having an upper surface and a lower surface, and one side of each chip includes a conducting pad on the lower surface. A recess and an isolation layer extend from the upper surface to the lower surface, which the recess exposes the conducting pad. A part of the isolation layer is disposed in the recess with an opening to expose the conducting pad. A conductive layer is formed on the isolation layer and the conductive pad, and a photo-resist layer is spray coated on the conductive layer. The photo-resist layer is exposed and developed to expose the conductive layer, and the conductive layer is etched to form a redistribution layer. After stripping the photo-resist layer, a solder layer is formed on the isolation layer and the redistribution layer.

Abstract: A stacked chip package is provided. The stacked chip package includes a first substrate having a first side and a second side opposite thereto. The first substrate includes a recess therein. The recess adjoins a side edge of the first substrate. A plurality of redistribution layers is disposed on the first substrate and extends onto the bottom of the recess. A second substrate is disposed on the first side of the first substrate. A plurality of bonding wires is correspondingly disposed on the redistribution layers in the recess, and extends onto the second substrate. A device substrate is disposed on the second side of the first substrate. A method of forming the stacked chip package is also provided.

Abstract: Embodiments of the present invention provide a chip package including: a semiconductor substrate having a first surface and a second surface; a device region formed in the semiconductor substrate; a dielectric layer disposed on the first surface; and a conducting pad structure disposed in the dielectric layer and electrically connected to the device region; a cover substrate disposed between the chip and the cover substrate, wherein the spacer layer, a cavity is created an surrounded by the chip and the cover substrate on the device region, and the spacer layer is in direct contact with the chip without any adhesion glue disposed between the chip and the spacer layer.

Abstract: An exemplary liquid crystal display (LCD) includes a casing and a liquid crystal panel accommodated in the casing. The casing includes a frame and a window surrounded by an inner side of the frame. The liquid crystal panel includes an outside surface essentially serving as a display screen for displaying images and a peripheral wall. The liquid crystal panel is attached to the frame, with the inner side of the frame contacting the peripheral wall of the liquid crystal panel, and the display screen exposed outside of the casing.

Abstract: An exemplary liquid crystal display (LCD) includes a casing and a liquid crystal panel accommodated in the casing. The casing includes a frame and a window surrounded by an inner side of the frame. The liquid crystal panel includes an outside surface essentially serving as a display screen for displaying images and a peripheral wall. The liquid crystal panel is attached to the frame, with the inner side of the frame contacting the peripheral wall of the liquid crystal panel, and the display screen exposed outside of the casing.

Abstract: An exemplary liquid crystal display (LCD) includes a casing and a liquid crystal panel accommodated in the casing. The casing includes a frame and a window surrounded by an inner side of the frame. The liquid crystal panel includes an outside surface essentially serving as a display screen for displaying images and a peripheral wall. The liquid crystal panel is attached to the frame, with the inner side of the frame contacting the peripheral wall of the liquid crystal panel, and the display screen exposed outside of the casing.

Abstract: An exemplary liquid crystal display (LCD) includes a casing and a liquid crystal panel accommodated in the casing. The casing includes a frame and a window surrounded by an inner side of the frame. The liquid crystal panel includes an outside surface essentially serving as a display screen for displaying images and a peripheral wall. The liquid crystal panel is attached to the frame, with the inner side of the frame contacting the peripheral wall of the liquid crystal panel, and the display screen exposed outside of the casing.

Abstract: A method of fabricating a wafer-level chip package is provided. First, a wafer with two adjacent chips is provided, the wafer having an upper surface and a lower surface, and one side of each chip includes a conducting pad on the lower surface. A recess and an isolation layer extend from the upper surface to the lower surface, which the recess exposes the conducting pad. A part of the isolation layer is disposed in the recess with an opening to expose the conducting pad. A conductive layer is formed on the isolation layer and the conductive pad, and a photo-resist layer is spray coated on the conductive layer. The photo-resist layer is exposed and developed to expose the conductive layer, and the conductive layer is etched to form a redistribution layer. After stripping the photo-resist layer, a solder layer is formed on the isolation layer and the redistribution layer.

Abstract: A system for displaying images including a display panel and a fabrication method thereof are provided. The method includes forming a first gate line and a second gate line at each row of pixels of the display panel, wherein the first gate lines and the second gate lines are separated and electrically isolated from each other. A first insulating layer is formed to cover the first gate lines and the second gate lines, and a plurality of via holes are formed in the first insulating layer to expose the first gate lines and the second gate lines. Then, a first conductive pattern is formed on the first insulating layer, such that the first gate line at each row of the pixels is electrically connected to the second gate line at an adjacent row of the pixels, by the first conductive pattern, through the via holes.

Abstract: An exemplary liquid crystal display (LCD) includes a casing and a liquid crystal panel accommodated in the casing. The casing includes a frame and a window surrounded by an inner side of the frame. The liquid crystal panel includes an outside surface essentially serving as a display screen for displaying images and a peripheral wall. The liquid crystal panel is attached to the frame, with the inner side of the frame contacting the peripheral wall of the liquid crystal panel, and the display screen exposed outside of the casing.

Abstract: An exemplary liquid crystal display (LCD) includes a casing and a liquid crystal panel accommodated in the casing. The casing includes a frame and a window surrounded by an inner side of the frame. The liquid crystal panel includes an outside surface essentially serving as a display screen for displaying images and a peripheral wall. The liquid crystal panel is attached to the frame, with the inner side of the frame contacting the peripheral wall of the liquid crystal panel, and the display screen exposed outside of the casing.

Abstract: An embodiment of the invention provides a chip package which includes: a chip including: a semiconductor substrate having a first surface; a device region formed in the semiconductor substrate; and a plurality of micro-lenses on the first surface and the device region; a cover substrate disposed on the chip, wherein the cover substrate is a transparent substrate; a spacer layer disposed between the chip and the cover substrate, wherein the spacer layer, the chip, and the cover substrate collectively surround a cavity in the device region; and at least one main lens on the cover substrate and in the cavity, wherein a width of the main lens is greater than that of each of the micro-lenses.

Abstract: Embodiments of the present invention provide a chip package including: a semiconductor substrate having a first surface and a second surface; a device region formed in the semiconductor substrate; a dielectric layer disposed on the first surface; and a conducting pad structure disposed in the dielectric layer and electrically connected to the device region; a cover substrate disposed between the chip and the cover substrate, wherein the spacer layer, a cavity is created an surrounded by the chip and the cover substrate on the device region, and the spacer layer is in direct contact with the chip without any adhesion glue disposed between the chip and the spacer layer.

Abstract: A system for displaying images including a display panel and a fabrication method thereof are provided. The method includes forming a first gate line and a second gate line at each row of pixels of the display panel, wherein the first gate lines and the second gate lines are separated and electrically isolated from each other. A first insulating layer is formed to cover the first gate lines and the second gate lines, and a plurality of via holes are formed in the first insulating layer to expose the first gate lines and the second gate lines. Then, a first conductive pattern is formed on the first insulating layer, such that the first gate line at each row of the pixels is electrically connected to the second gate line at an adjacent row of the pixels, by the first conductive pattern, through the via holes.

Abstract: A data storage apparatus includes a storage unit; a read/write console connected electrically to an external power supply source; a storage function unit; a power switch connected electrically to the power supply source, the storage unit and the storage function unit in such a manner that in a normal condition, the storage unit is charged electrically by the power supply source via the power switch, and that in an abnormal condition, the storage unit is supplied with electrical power from the power switch via the storage function unit so as to permit continuation of the read/write operation within the storage unit. A current detection unit detects current of the storage function unit in the abnormal condition and upon detecting current of the storage function unit reaching below a predetermined threshold value, the current detection unit generates and transmits a reset signal to the read/write console such that the read/write console orders a reset of the read/write operation.

Abstract: An exemplary liquid crystal display (LCD) includes a casing and a liquid crystal panel accommodated in the casing. The casing includes a frame and a window surrounded by an inner side of the frame. The liquid crystal panel includes an outside surface essentially serving as a display screen for displaying images and a peripheral wall. The liquid crystal panel is attached to the frame, with the inner side of the frame contacting the peripheral wall of the liquid crystal panel, and the display screen exposed outside of the casing.

Abstract: The invention discloses an on-spot hydrophilic enhanced slide/microarray. The preparation method relates to a hydrophobic copolymer prepared by blending, grafting or co-polymerization of a hydrophobic material and a compound bearing functional groups such as anhydride, imide, cyclic amide, and cyclic ester, and application of the hydrophobic copolymer onto an organic or inorganic substrate. The resulting slide has the properties of on-spot hydrophilic/hydrophobic dynamic conversion, as well as on-spot hydrophilic enhancement for the preparation of high-density and high-efficiency bio-chip/microarray.

Abstract: An on-spot selectively activated hydrophobic slide/microarray. The preparation method relates to a hydrophobic copolymer prepared by blending, grafting or co-polymerization of a hydrophobic material and a compound bearing a functional group protected by a protecting group, wherein the functional group is imide or cyclic amide, and the protecting group is a photo acid group such as a tosyloxy group. The hydrophobic copolymer coated on a substrate is then subjected to selective photolithographical activation so that the slide will have functional active copolymer spots separated by inactive copolymers. The resulting slide is suitable for the preparation of high-density and high-efficiency bio-chip/microarray.

Abstract: An on-spot selectively activated hydrophobic slide/microarray. The preparation method relates to a hydrophobic copolymer prepared by blending, grafting or co-polymerization of a hydrophobic material and a compound bearing a functional group protected by a protecting group, wherein the functional group is imide or cyclic amide, and the protecting group is a photo acid group such as a tosyloxy group. The hydrophobic copolymer coated on a substrate is then subjected to selective photolithographical activation so that the slide will have functional active copolymer spots separated by inactive copolymers. The resulting slide is suitable for the preparation of high-density and high-efficiency bio-chip/microarray.

Abstract: An on-spot selectively activated hydrophobic slide/microarray. The preparation method relates to a hydrophobic copolymer prepared by blending, grafting or co-polymerization of a hydrophobic material and a compound bearing a functional group protected by a protecting group, wherein the functional group is imide or cyclic amide, and the protecting group is a photo acid group such as a tosyloxy group. The hydrophobic copolymer coated on a substrate is then subjected to selective photolithographical activation so that the slide will have functional active copolymer spots separated by inactive copolymers. The resulting slide is suitable for the preparation of high-density and high-efficiency bio-chip/microarray.