Abstract: A display module having an improved assembly structure is provided. The display module includes a frame, a display panel, and a glue. The frame has a side wall and a supporting part, wherein the supporting part has a supporting surface and the side wall is formed on the periphery of the supporting surface. A groove is formed on the supporting surface adjacent to the side wall and is distributed along the side wall. The display panel is disposed within the frame and has a bottom face and a side face. The bottom face is supported by the supporting surface of the supporting part. The side face faces the side wall and forms a gap with the side wall. The glue is filled in the gap and adheres the side wall to the side face.

Abstract: The present invention relates to a method for removing etching assist gas from a fabrication system used during defect repair of a photomask in the fabrication of an integrated circuit, including: (a) inspecting the photomask and detecting a defect, the defect in a defect region; and (b) repairing the defect, wherein an amount, effective for the purpose of styrene is added to the system. By the method of the present invention, the amount of gas remaining on the MOS film is reduced, resulting in less surface defects present on the photomask.