Patents by Inventor Chih Wei Wen

Chih Wei Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210356857
    Abstract: A reticle pod is provided. The reticle pod includes a container and a fluid regulating module mounted to the container. The fluid regulating module includes a first cap, a second cap and a sealing film. The first cap and the second cap are connected to each other. A flowing path is formed between the first cap and the second cap for allowing a fluid passing through the fluid regulating module. The sealing film is positioned between the first cap and the second cap and configured for regulating a flow of the fluid passing through the flowing path.
    Type: Application
    Filed: August 27, 2020
    Publication date: November 18, 2021
    Inventors: TZU HAN LIU, CHIH-WEI WEN, CHUNG-HUNG LIN
  • Publication number: 20210327735
    Abstract: The present disclosure provides a method for fabricating a semiconductor structure, including disposing a mask at a first position in a first chamber, generating; a first plurality of ions toward the mask by an ionizer, forming a photoresist layer on a substrate, receiving the substrate in the first chamber, and exposing the photoresist layer with actinic radiation through the mask in the first chamber.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Inventors: PO-CHIEN HUANG, CHUNG-HUNG LIN, CHIH-WEI WEN
  • Publication number: 20210311095
    Abstract: A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.
    Type: Application
    Filed: April 2, 2021
    Publication date: October 7, 2021
    Applicant: MPI Corporation
    Inventors: Chung-Yen Huang, Chih-Wei Wen, Sheng-Feng Xu, Fuh-Chyun Tang, Chih-Hao Ho
  • Patent number: 11088003
    Abstract: The present disclosure provides an apparatus for fabricating a semiconductor device, including a first chamber for accommodating a mask, and a first ionizer in the first chamber, wherein the first ionizer is adjacent to the mask.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: August 10, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Po-Chien Huang, Chung-Hung Lin, Chih-Wei Wen
  • Publication number: 20210216007
    Abstract: A method of testing a photomask assembly includes placing the photomask assembly into a chamber, wherein the photomask assembly includes a pellicle attached to a first side of a photomask. The method further includes exposing the photomask assembly to a radiation source having a wavelength ranging from about 160 nm to 180 nm in the chamber to accelerate haze development, wherein the exposing of the photomask assembly includes illuminating an entirety of an area of the photomask covered by the pellicle throughout an entire illumination time and illuminating a frame adhesive attaching the pellicle to the photomask. The method further includes detecting haze of the photomask following exposing the photomask assembly to the radiation source. The method further includes predicting performance of the photomask assembly during a manufacturing process based on the detected haze of the photomask following exposing the photomask assembly to the radiation source.
    Type: Application
    Filed: March 25, 2021
    Publication date: July 15, 2021
    Inventors: Wu-Hung KO, Kun-Lung HSIEH, Chih-Wei WEN
  • Patent number: 10983430
    Abstract: A method of testing a photomask assembly is disclosed. The method includes placing a photomask assembly into a chamber. The photomask assembly includes a pellicle attached to a first side of a photomask. The method further includes exposing the photomask assembly to a radiation source in the chamber. The exposing of the photomask assembly includes illuminating an entirety of an area of the photomask covered by the pellicle throughout an entire illumination time.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: April 20, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wu-Hung Ko, Chih-Wei Wen, Kun-Lung Hsieh
  • Publication number: 20210096460
    Abstract: A method for cleaning a reflective photomask is provided. The method includes: disposing the reflective photomask in a chamber; providing hydrogen radicals to the chamber; and exposing the reflective photomask to the hydrogen radicals. A method of manufacturing a semiconductor structure and system for forming a semiconductor structure are also provided.
    Type: Application
    Filed: July 30, 2020
    Publication date: April 1, 2021
    Inventors: WU-HUNG KO, CHUNG-HUNG LIN, CHIH-WEI WEN
  • Publication number: 20200409254
    Abstract: The present disclosure provides an apparatus for mounting a pellicle to a photomask, including a presser, a pellicle stage facing the presser, and a flexible material layer between the presser and the pellicle stage, wherein the flexible material layer includes a compartment filled with gas.
    Type: Application
    Filed: September 12, 2020
    Publication date: December 31, 2020
    Inventors: TZU HAN LIU, CHIH-WEI WEN, CHUNG-HUNG LIN
  • Publication number: 20200310243
    Abstract: The present disclosure provides a photomask, including a front side having a patterned layer, a back side opposite to the front side, a sidewall connecting the front side and the back side, a reflective layer between the front side and the back side, and a polymer layer on the backside of the photomask.
    Type: Application
    Filed: February 19, 2020
    Publication date: October 1, 2020
    Inventors: TZU HAN LIU, CHIH-WEI WEN, CHUNG-HUNG LIN
  • Patent number: 10775694
    Abstract: The present disclosure provides an apparatus for mounting a pellicle to a photomask, including a cover having a first side and a second side opposite to the first side, wherein the second side is configured to face the photomask, and an air pad disposed between the first side and the second side, wherein the air pad comprises a compartment filled with air.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: September 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Tzu Han Liu, Chih-Wei Wen, Chung-Hung Lin
  • Publication number: 20200243360
    Abstract: The present disclosure provides an apparatus for fabricating a semiconductor device, including a first chamber for accommodating a mask, and a first ionizer in the first chamber, wherein the first ionizer is adjacent to the mask.
    Type: Application
    Filed: January 28, 2019
    Publication date: July 30, 2020
    Inventors: PO-CHIEN HUANG, CHUNG-HUNG LIN, CHIH-WEI WEN
  • Publication number: 20200124994
    Abstract: The present disclosure provides a method of treating a mask for photolithography. The method includes disposing the mask on a stage in a tool. The mask includes a pellicle and a substrate. The method further includes providing oxygen gas in a space between the pellicle and the substrate, and splitting the oxygen gas in the space to form an oxygen atom or an ozone molecule. The method further includes exposing surfaces of the pellicle and the substrate to the oxygen atom or the ozone molecule for a predetermined duration. A mask treating system is also provided.
    Type: Application
    Filed: October 23, 2018
    Publication date: April 23, 2020
    Inventors: WU-HUNG KO, CHUNG-HUNG LIN, CHIH-WEI WEN
  • Publication number: 20200105431
    Abstract: A method for generating extreme ultraviolet (EUV) radiation includes introducing a fuel droplet; applying a first laser beam to strike the fuel droplet at a location to generate EUV radiation and form a movable debris of the fuel droplet; and forming an energy field proximal to the location of the first laser beam strike to trap the movable debris. An EUV radiation source includes a fuel droplet generator, a first laser, a collector and an energy field. The fuel droplet generator is configured to provide a fuel droplet. The first laser is configured to generate a first laser beam to strike the fuel droplet at a location to generate EUV radiation and form a movable debris. The collector is configured to reflect the EUV radiation. The energy field is configured to trap the movable debris, wherein the energy field is proximal to the location of the first laser beam strike.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 2, 2020
    Inventors: TZU HAN LIU, CHIH-WEI WEN, CHUNG-HUNG LIN
  • Publication number: 20190258155
    Abstract: A method of testing a photomask assembly is disclosed. The method includes placing a photomask assembly into a chamber. The photomask assembly includes a pellicle attached to a first side of a photomask. The method further includes exposing the photomask assembly to a radiation source in the chamber. The exposing of the photomask assembly includes illuminating an entirety of an area of the photomask covered by the pellicle throughout an entire illumination time.
    Type: Application
    Filed: February 22, 2018
    Publication date: August 22, 2019
    Inventors: Wu-Hung KO, Chih-Wei WEN, Kun-Lung HSIEH
  • Patent number: 10038170
    Abstract: A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components. The method includes: forming multiple display modules by cutting the substrate and the cover plate of the display panel at a position between adjacent display components; and edging a display module obtained through the cutting with an edging machine by a distance from an edge of the display module to inward of the encapsulation glue, until the encapsulation glue is grinded to a preset width. A design of slim bezel can be achieved for the display panel with high accuracy by the method for cutting the display panel according to the disclosure.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: July 31, 2018
    Assignee: EverDisplay Optronics (Shanghai) Limited
    Inventors: Chih-wei Wen, Denghui Liu
  • Publication number: 20170084879
    Abstract: A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components. The method includes: forming multiple display modules by cutting the substrate and the cover plate of the display panel at a position between adjacent display components; and edging a display module obtained through the cutting with an edging machine by a distance from an edge of the display module to inward of the encapsulation glue, until the encapsulation glue is grinded to a preset width. A design of slim bezel can be achieved for the display panel with high accuracy by the method for cutting the display panel according to the disclosure.
    Type: Application
    Filed: May 19, 2016
    Publication date: March 23, 2017
    Applicant: EVERDISPLAY OPTRONICS (SHANGHAI) LIMITED
    Inventors: Chih-wei WEN, Denghui LIU
  • Patent number: 9530983
    Abstract: A sintering method includes defining a closed pattern having at least one arcuate section. A substance is applied on a substrate along the closed pattern and is sintered along the closed pattern in a first rectilinear direction. The sintering is finished in a second rectilinear direction along the closed pattern. A display device packaging method includes defining a closed pattern having at least one arcuate section. Frit is applied on a substrate of a display device along the closed pattern. A cover plate is provided on the substrate. The frit is sintered along the closed pattern. The sintering is finished in a second rectilinear direction. Then, the cover plate and the substrate of the display device are packaged.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: December 27, 2016
    Assignee: EverDisplay Optronics (Shanghai) Ltd.
    Inventors: Yanhu Li, Chih-Wei Wen
  • Publication number: 20160313834
    Abstract: The present disclosure provides a display device having a display region and a periphery region. The display device includes a display panel, a first flexible circuit board for performing display and a second flexible circuit board for touch. The display panel includes: a first substrate; a display element; a touch panel; and a second substrate. The second substrate is provided with a first gap in the periphery region, and the first gap exposes the display wire, and the first substrate is provided with two second gaps in the periphery region, and the two second gaps are respectively located at both sides of the first gap and expose the touch wires.
    Type: Application
    Filed: April 21, 2016
    Publication date: October 27, 2016
    Applicant: EVERDISPLAY OPTRONICS (SHANGHAI) LIMITED
    Inventors: Kunliang MA, Chih-wei WEN
  • Patent number: 9375897
    Abstract: A display device includes a display module, a cover, and a bonding layer between the display module and the cover. A first ink layer is disposed in at least a portion between the cover and the bonding layer. A second ink layer is disposed in at least a portion between the display module and the bonding layer. A method for producing a display device includes applying an ink on an end of a cover to form a first ink layer. A bonding layer is formed on the first ink layer and the cover. A display module is provided and coupled to the cover via the bonding layer.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: June 28, 2016
    Assignee: EverDisplay Optronics (Shanghai) Ltd.
    Inventors: Kunliang Ma, Chih-Wei Wen
  • Publication number: 20160133870
    Abstract: A sintering method includes defining a closed pattern having at least one arcuate section. A substance is applied on a substrate along the closed pattern and is sintered along the closed pattern in a first rectilinear direction. The sintering is finished in a second rectilinear direction along the closed pattern. A display device packaging method includes defining a closed pattern having at least one arcuate section. Frit is applied on a substrate of a display device along the closed pattern. A cover plate is provided on the substrate. The frit is sintered along the closed pattern. The sintering is finished in a second rectilinear direction. Then, the cover plate and the substrate of the display device are packaged.
    Type: Application
    Filed: January 22, 2015
    Publication date: May 12, 2016
    Inventors: Yanhu Li, Chih-Wei Wen