Abstract: An anti-plasma adhesive tape utilized for manufacturing a semiconductor package includes a substrate; and an adhesive layer formed on the substrate, wherein the adhesive layer is selected from a group composed of acrylic adhesive, light-curable resin and photoinitiator. The anti-plasma adhesive tape is attached to a backside of a lead frame of the semiconductor package before a plasma-cleaning process and removed from the lead frame after a molding process. After the anti-plasma adhesive tape is cured by irradiating an energy ray and removed from the lead frame, there is no residual adhesive left on a molding compound of the semiconductor package.

Abstract: A semiconductor package includes a die comprising at least a via and a least a hot via; a ground lead, formed directly under a back side of the die, contacting with the back side of the die, and directly connected to the a least a hot via and the at least a via of the die; a buffer layer, formed on the die, configured to absorb a stress applied to the die and prevent the die from damage; and a molding portion, formed on the die buffer layer.

Abstract: An EMI testing deviation correction system includes an EMI testing facility. A signal provisioning device in the EMI testing facility includes a power connector coupling coupled to a networking port. A signal generator includes a power connector that is connected to the power connector coupling, and generates and provides signals having first signal characteristics through the power connector. An ISN device is coupled to the first networking port to receive signals that are provided by the signal generator and transmitted through the signal provisioning device. A signal receiver device is coupled to the ISN device and receives signals transmitted through the signal provisioning device and the ISN device. The signals received by the signal receiver device include second signal characteristics, and the difference between the second signal characteristics and the first signal characteristics provides an indication of at least one correction for the EMI testing facility.

Abstract: A biasing circuitry is disclosed. The biasing circuitry includes a biasing module, electrically connected to a power amplifier; and a control series, having an end electrically connected to a positive voltage, and another end electrically connected to the biasing module. The control series includes a switch unit, controlled by a control voltage to be on or off; and a voltage-drop unit, connected to the switch unit in series. The voltage-drop unit is configured to adjust a bias point of the power amplifier.

Abstract: A high-frequency package comprises a ground lead occupying a side of the high-frequency package; and a signal lead comprising at least a protrusion protruding from a central portion of the signal lead; wherein the ground lead and the signal lead perform as a transmission line, and the at least a protrusion forms capacitance of the transmission line.

Abstract: A file managing method for a digital apparatus includes (a) establishing a folder corresponding to a file type generated in an operational mode of the digital apparatus, and (b) storing a file according to its file type to the folder corresponding to the file type established in step (a).

Abstract: A power amplifier (PA) has been disclosed for linearity improvement. The PA comprises at least an amplifying transistor and at least an auxiliary transistor. Each amplifying transistor of the at least an amplifying transistor includes a first terminal for receiving an input signal of the PA, a second terminal for delivering an output signal of the PA, and a third terminal. Each auxiliary transistor of the at least an auxiliary transistor includes a first terminal, a second terminal coupled to the second terminal of the at least an amplifying transistor, and a third terminal electrically connected to the first terminal of the at least an amplifying transistor.

Abstract: A high-frequency package comprises a die; a plurality of leads; and a die pad; wherein a surface of the die pad is lower than top surfaces of the plurality of leads, the die is disposed on the die pad with the lower surface, such that a top surface of the die is substantially aligned with the top surfaces of the plurality of leads.

Abstract: A low noise amplifier (LNA) has been disclosed for the noise and linearity performance improvement. The LNA includes an amplifying transistor and an auxiliary transistor. The amplifying transistor includes a first terminal for receiving an input signal of the LNA, a second terminal for outputting an output signal of the LNA, and a third terminal. The auxiliary transistor has a first terminal, a second terminal coupled to the second terminal of the amplifying transistor, and a third terminal electrically connected to the first terminal of the amplifying transistor.

Abstract: A high-frequency package comprises a ground lead occupying a side of the high-frequency package; and a signal lead comprising at least a protrusion protruding from a central portion of the signal lead; wherein the ground lead and the signal lead perform as a transmission line, and the at least a protrusion forms capacitance of the transmission line.

Abstract: A high-frequency package comprises a die; a plurality of leads; and a die pad; wherein a surface of the die pad is lower than top surfaces of the plurality of leads, the die is disposed on the die pad with the lower surface, such that a top surface of the die is substantially aligned with the top surfaces of the plurality of leads.

Abstract: A biasing circuitry is disclosed. The biasing circuitry includes a biasing module, electrically connected to a power amplifier; and a control series, having an end electrically connected to a positive voltage, and another end electrically connected to the biasing module. The control series includes a switch unit, controlled by a control voltage to be on or off; and a voltage-drop unit, connected to the switch unit in series. The voltage-drop unit is configured to adjust a bias point of the power amplifier.

Abstract: A high-frequency package comprises a ground lead, connected to a die, occupying a side of the high-frequency package, wherein a slot is formed within the ground lead; and a signal lead, connected to the die, disposed within the slot; wherein the ground lead surrounds the signal lead, and the ground lead and the signal lead form as a ground-signal-ground structure.

Abstract: A power amplifier (PA) has been disclosed for linearity improvement. The PA comprises at least an amplifying transistor and at least an auxiliary transistor. Each amplifying transistor of the at least an amplifying transistor includes a first terminal for receiving an input signal of the PA, a second terminal for delivering an output signal of the PA, and a third terminal. Each auxiliary transistor of the at least an auxiliary transistor includes a first terminal, a second terminal coupled to the second terminal of the at least an amplifying transistor, and a third terminal electrically connected to the first terminal of the at least an amplifying transistor.

Abstract: A low noise amplifier (LNA) has been disclosed for the noise and linearity performance improvement. The LNA includes an amplifying transistor and an auxiliary transistor. The amplifying transistor includes a first terminal for receiving an input signal of the LNA, a second terminal for outputting an output signal of the LNA, and a third terminal. The auxiliary transistor has a first terminal, a second terminal coupled to the second terminal of the amplifying transistor, and a third terminal electrically connected to the first terminal of the amplifying transistor.

Abstract: A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the at least a lead, where at least a first hole is formed through the at least a routing layer; a die, disposed on the at least a routing layer, where at least a second hole is formed through the die, and the die generates or receives the at least a signal; and a molding cap, for covering the at least a routing layer and the die; where the at least a signal is delivered through the at least a first hole and the at least a second hole.

Abstract: A file managing method for a digital apparatus includes (a) establishing a folder corresponding to a file type generated in an operational mode of the digital apparatus, and (b) storing a file according to its file type to the folder corresponding to the file type established in step (a).

Abstract: An electronic assembly includes a heat generating element, a heat dissipation fin set disposed above the heat generating element, a filter circuit board, and a heat conducting layer. The filter circuit board is located between the heat generating element and the heat dissipation fin set, and includes a metal layer, an electromagnetic band gap structure layer, and an insulation layer. The metal layer has a first opening and contacts the heat dissipation fin set. The electromagnetic band gap structure layer has conductive patterns. Thermal vias pass through the insulation layer and connect to the metal layer. The heat generating element contacts the conductive patterns. The insulating layer is disposed between the metal layer and the electromagnetic band gap structure layer, and has a second opening and a peripheral region aligned to the conductive patterns. The heat conducting layer contacts the heat dissipation fin set through the first and second openings.

Abstract: Embodiments of a method for generating ions in an ion source are provided. The method for generating ions in an ion source includes introducing a dopant gas and a diluent gas into an ion source arc chamber. The method for generating ions in an ion source further includes generating plasma in the ion source arc chamber based on the dopant gas and the diluent gas.

Abstract: A multimedia playback system includes a multimedia device, for generating a control interface according to a request and performing an operation according to a control signal; a server, coupled to the multimedia device for storing the control interface generated by the multimedia device and generating the control signal according to an instruction signal; and a hand-held device, coupled to the server for accessing the control interface stored in the server and generating the instruction signal according to the control interface and an input signal.