Abstract: Present disclosure provides a semiconductor structure, including a semiconductor fin having a first portion and a second portion over the first portion, a first conductive region abutting a first lateral surface of the first portion and a first lateral surface of the second portion, a metal gate having a bottom portion and an upper portion, the bottom portion being between the first portion and the second portion of the semiconductor fin, and the upper portion being over the second portion of the semiconductor fin, and a first spacer between the bottom portion of the metal gate and the first conductive region. A method for manufacturing the semiconductor structure described herein is also provided.

Abstract: A security authentication method is provided. In a step (a), a to-be-recognized image information and a to-be-recognized voice information about a user are provided. Then, a step (b) is performed to identify and judge whether the to-be-recognized image information and the to-be-recognized voice information comply with a registered image information and a registered voice information, respectively. In a step (c), if the judging condition of the step (b) is satisfied, a security information prompt signal is generated. In a step (d), a to-be-recognized security information is provided by the user. Then, a step (e) is performed to identify and judge whether the to-be-recognized security information complies with an abnormal warning information. In a step (f), if the judging condition of the step (e) is satisfied, an abnormal state warning and processing process is performed.

Abstract: A security authentication method is provided. In a step (a), a to-be-recognized image information and a to-be-recognized voice information about a user are provided. Then, a step (b) is performed to identify and judge whether the to-be-recognized image information and the to-be-recognized voice information comply with a registered image information and a registered voice information, respectively. In a step (c), if the judging condition of the step (b) is satisfied, a security information prompt signal is generated. In a step (d), a to-be-recognized security information is provided by the user. Then, a step (e) is performed to identify and judge whether the to-be-recognized security information complies with an abnormal warning information. In a step (f), if the judging condition of the step (e) is satisfied, an abnormal state warning and processing process is performed.

Abstract: A gimbal device for supporting an external photographing device includes a depth camera, a control unit and an actuator. The depth camera is configured to obtain spatial coordinates of a subject being photographed. The control unit is configured to determine a direction adjustment value of the gimbal device according to the spatial coordinates. The actuator is configured to receive the direction adjustment value and to adjust spatial orientation of the gimbal device according to the direction adjustment value, so that the external photographing device is able to track the subject being photographed. The control unit is further configured to obtain initial three-axis data of the gimbal device and three-axis data after the gimbal device is set to determine an angle difference between the initial three-axis data and the set three-axis data, and the actuator is further configured to receive the angle difference.

Abstract: A method for aligning a camera lens with a light source is provided. The method is used in an aligning system. The aligning system includes an alignment element, a reference camera and a fixture. Firstly, the reference camera shoots a reference chart on the alignment element. Then, the light source is placed on the fixture. The light source illuminates the alignment element to generate an illumination result. The reference camera shoots the illumination result. If the illumination result does not comply with a preset specification represented by the reference chart, the fixture adjusts the light source. Then, the camera lens is placed on the fixture. Then, the camera lens shoots the reference chart on the alignment element to acquire a shooting result. If the shooting result does not comply with the preset specification, the fixture adjusts the camera lens.

Abstract: A method for aligning a camera lens with a light source is provided. The method is used in an aligning system. The aligning system includes an alignment element, a reference camera and a fixture. Firstly, the reference camera shoots a reference chart on the alignment element. Then, the light source is placed on the fixture. The light source illuminates the alignment element to generate an illumination result. The reference camera shoots the illumination result. If the illumination result does not comply with a preset specification represented by the reference chart, the fixture adjusts the light source. Then, the camera lens is placed on the fixture. Then, the camera lens shoots the reference chart on the alignment element to acquire a shooting result. If the shooting result does not comply with the preset specification, the fixture adjusts the camera lens.

Abstract: A camera module aligning method includes the following steps. Firstly, a reference chart having plural chart characteristic points is provided. Then, a camera module is used to shoot the reference chart, and an installation position and an installation posture of the camera module are acquired according to an internal parameter matrix and an external parameter matrix. When the camera module shoots the reference chart and an image is formed on an imaging plane of the camera module, a relationship between at least one image characteristic point of the image and the corresponding chart characteristic point complies with a standard relationship. The standard relationship is defined by the internal parameter matrix and the external parameter matrix.

Abstract: A camera module aligning method includes the following steps. Firstly, a reference chart having plural chart characteristic points is provided. Then, a camera module is used to shoot the reference chart, and an installation position and an installation posture of the camera module are acquired according to an internal parameter matrix and an external parameter matrix. When the camera module shoots the reference chart and an image is formed on an imaging plane of the camera module, a relationship between at least one image characteristic point of the image and the corresponding chart characteristic point complies with a standard relationship. The standard relationship is defined by the internal parameter matrix and the external parameter matrix.

Abstract: A method for determining camera module assembling quality is provided. The method includes a step of determining whether the shooting position and the shooting posture of and under-test camera module are correct according to a result of judging whether a relationship between the world coordinate of at least one chart characteristic point of a reference chart and the image coordinate of a corresponding image characteristic point of an image plane coordinate system complies with a standard relationship. Then, the under-test camera module at the correct shooting position and with the correct shooting posture is used to shoot the reference chart. Consequently, an assembling information of the under-test camera module is obtained.

Abstract: An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.

Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Abstract: An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.

Abstract: An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.

Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Abstract: A dual chips stacked packaging structure. A first chip comprises an active surface and an opposing non-active surface, the active surface consisting of a central area and a peripheral area having a plurality of first bonding pads. A lead frame comprises a plurality of leads and a chip paddle having a first adhering surface and a second adhering surface, with the first adhering surface adhering to the active surface of the first chip in such a way as to avoid contact with the first bonding pads. A second chip comprises an active surface and an opposing non-active surface connecting with the second adhering surface of the chip paddle, and the active surface consisting of a central area and a peripheral area having a plurality of second bonding pads. Parts of the wires electrically connect with the first bonding pad and the leads, and parts of the wires electrically connect with the second bonding pad and the leads.

Abstract: A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

Abstract: A method for performing a built-in and at-speed test in a system-on-chip includes receiving a statistic timing analysis report of the system-on-chip, determining a plurality of critical paths for an at-speed test in the system-on-chip according to the statistic timing analysis report, analyzing signals at observe control points and capture control points of each of the critical paths for generating a plurality of test states, and transmitting the test states to a virtual instrumentation software architecture wrapper.

Abstract: A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.