Abstract: A backlight module includes a light source, a first prism sheet disposed on the light source, and a light type adjustment sheet disposed on a side of the first prism sheet away from the light source and including a base and multiple light type adjustment structures. The multiple light type adjustment structures are disposed on the first surface of the base. Each light type adjustment structure has a first structure surface and a second structure surface connected to each other. The first structure surface of each light type adjustment structure and the first surface of the base form a first base angle therebetween, and the second structure surface of each light type adjustment structure and the first surface of the base form a second base angle therebetween. The angle of the first base angle is different from the angle of the second base angle.

Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.

Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.

Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.

Abstract: The disclosure provides a socket connector including a housing, a circuit board, an electronic device, a contact element, and a switch component. The housing has an insertion hole configured for an insertion of a plug connector. The circuit board is fixed in the insertion hole. The electronic component is disposed in the insertion hole. The contact element is located in the insertion hole. The contact element has a fixed end and a movable end, the fixed end is electrically connected to the circuit board, and the movable end is movable with respect to the circuit board. The switch component is movably located in the insertion hole and is in contact with the contact element. The switch component is configured to be movable by the plug connector so as to force the movable end of the contact element to electrically connect to or disconnect from the electronic component.

Abstract: The disclosure provides a socket connector including a housing, a circuit board, an electronic device, a contact element, and a switch component. The housing has an insertion hole configured for an insertion of a plug connector. The circuit board is fixed in the insertion hole. The electronic component is disposed in the insertion hole. The contact element is located in the insertion hole. The contact element has a fixed end and a movable end, the fixed end is electrically connected to the circuit board, and the movable end is movable with respect to the circuit board. The switch component is movably located in the insertion hole and is in contact with the contact element. The switch component is configured to be movable by the plug connector so as to force the movable end of the contact element to electrically connect to or disconnect from the electronic component.

Abstract: An identity authentication method verifies an identity by selecting a portion of the first biometric information and all or part of a second biometric information. The identity authentication method uses part of the biometric information of the user to perform authentication, which may improve the convenience of use. The identity authentication method adopts two biometric verifications, which may maintain the accuracy of the authentication.

Abstract: A manufacturing method of an optical element applied to a miniature microscope includes the steps of: emitting a signal light and a reference light to an optical material; and forming a plurality of gratings on the optical material by interfering the signal light and the reference light. A miniature microscope is also disclosed.

Abstract: A foot brush structure includes a frame and at least a brush. The frame includes a positioning section and a support section. The support section is coupled to the positioning section and extends upward at a predetermined angle. The support section includes at least one elastic member. The brush is mounted to the support section. A user may step on and hold the positioning section in position with one foot and places the sole of another foot on the brush or places the instep in contact with the brush, while having the foot move back and forth so as to achieve an operation of reciprocally brushing the foot with the brush. An efficacy of the present invention is that the elder is allowed to brush and clean the feet in an independent, easy, effortless, and efficient manner without hand operation or bending waist and requiring no assistant from other people.

Abstract: Disclosed is a rescue system for semi-sealed marine vessels, which includes a rescue unit and a backup rescue machine. The rescue unit is installed in a vessel compartment and includes an air bag, a canister containing compressed gas, a needle valve, and a flow control valve for employing the physical property that air has a specific gravity smaller than water, whereby when water leaks into the vessel compartment, through pressing down the needle valve, the compressed air is supplied into the air bag for inflating and expanding the air bag to get floating on the seawater inside the vessel compartment and occupy the internal space of the vessel compartment. The backup rescue machine includes an air compressor and at least a diversion valve to supplement a great amount of high-pressure gas to the vessel compartment for preventing water leaking into the vessel compartment.

Abstract: Disclosed is a rescue system for semi-sealed marine vessels, which includes a rescue unit and a backup rescue machine The rescue unit is installed in a vessel compartment and includes an air bag, a canister containing compressed gas, a needle valve, and a flow control valve for employing the physical property that air has a specific gravity smaller than water, whereby when water leaks into the vessel compartment, through pressing down the needle valve, the compressed air is supplied into the air bag for inflating and expanding the air bag to get floating on the seawater inside the vessel compartment and occupy the internal space of the vessel compartment. The backup rescue machine includes an air compressor and at least a diversion valve to supplement a great amount of high-pressure gas to the vessel compartment for preventing water leaking into the vessel compartment.

Abstract: A manufacturing method of an optical element applied to a miniature microscope comprises the steps of: emitting a signal light and a reference light to an optical material; and forming a plurality of gratings on the optical material by interfering the signal light and the reference light. A miniature microscope is also disclosed.

Abstract: An active solid heatsink device and fabricating method thereof is related to a high-effective solid cooling device, where heat generated by a heat source with a small area and a high heat-generating density diffuses to a whole substrate using a heat conduction characteristic of hot electrons of a thermionic (TI) structure, and the thermionic (TI) structure and a thermo-electric (TE) structure share the substrate where the heat diffuses to. Further, the shared substrate serves as a cold end of the TE structure, and the heat diffusing to the shared substrate is pumped to another substrate of the TE structure serving as a hot end of the TE structure.

Abstract: An interconnect structure of an integrated circuit and manufacturing method therefore are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.

Abstract: A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.

Abstract: A near field optical disc and a near field optical disc reading apparatus are provided. The near field optical disc has at least one light source and a near field optical pick-up head, and the near field optical disc includes a light guiding substance, a first reflection layer and a second reflection layer. The light guiding substance has a first surface, a second surface opposite thereto and at least one light entrance window. Light emitted from the light source enters the light guiding substance through the light entrance window. The second reflection layer is disposed on the second surface. The first reflection layer is disposed on the first surface and has a plurality of light pervious holes. A part of the light is transmitted through the light pervious holes and picked up by the near field optical pick-up head.

Abstract: A near field optical disc and a near field optical disc reading apparatus are provided. The near field optical disc has at least one light source and a near field optical pick-up head, and the near field optical disc includes a light guiding substance, a first reflection layer and a second reflection layer. The light guiding substance has a first surface, a second surface opposite thereto and at least one light entrance window. Light emitted from the light source enters the light guiding substance through the light entrance window. The second reflection layer is disposed on the second surface. The first reflection layer is disposed on the first surface and has a plurality of light pervious holes. A part of the light is transmitted through the light pervious holes and picked up by the near field optical pick-up head.

Abstract: A manufacturing method of a semiconductor package structure includes the following steps. Firstly, a carrier having an adhesion tape is provided. Next, a plurality of chips are disposed on the adhesion tape. Then, a molding compound is dispensed on the adhesion tape, so that the molding compound covers the chips. Afterwards, a heat spreader is disposed on a plurality of chips. Then, the molding compound is solidified as an encapsulant to fix the heat spreader on the chips. After that, the carrier and the adhesion tape are removed to expose the active surfaces of the chips. Then, a redistribution layer is formed adjacent to the active surfaces of the chips. Next, a plurality of solder balls are disposed on the redistribution layer. Lastly, a plurality of packages are formed by cutting the redistribution layer, the encapsulant and the heat spreader according to the positions of the chip.

Abstract: A refresh method for a non-volatile memory for preventing disturb phenomenon includes reading data of a memory unit of the non-volatile memory at a first time point within a predefined period and storing the data in a buffer, determining whether data of the memory unit and data of the buffer are identical at a second time point within the predefined period, so as to generate a determination result, and refreshing the memory unit according to the determination result.

Abstract: A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.