Patents by Inventor Chih-Yuan Yang

Chih-Yuan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240383100
    Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Inventors: Yu-Chen Wei, Chih-Yuan Yang, Shih-Ho Lin, Jen Chieh Lai, Szu-Cheng Wang, Chun-Jui Chu
  • Patent number: 12043511
    Abstract: A sheet feeding mechanism includes a feeding path, at least one card feeding roller mounted to the feeding path, at least one paper feeding roller coaxial with the at least one card feeding roller, at least one card idle roller contacting with the at least one card feeding roller, at least one paper idle roller contacting with the at least one paper feeding roller, at least one elastic unit connected to the feeding path, and a stroke limiting unit. The at least one elastic unit is fastened to the feeding path. The at least one elastic unit has a stretching stroke. The stroke limiting unit controllably shortens the stretching stroke.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: July 23, 2024
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventor: Chih Yuan Yang
  • Patent number: 11952230
    Abstract: A thick document conveying device includes a paper pickup mechanism. The paper pickup mechanism has a pick roller base, a pick roller axle, a pick roller, a switching assembly, a first universal coupling, a driving mechanism, a second universal coupling, a bearing and a gear. The pick roller axle and the pick roller are located in the pick roller base. The switching assembly is located under the pick roller base. The first universal coupling is connected to the pick roller axle. The driving mechanism is sleeved on the first universal coupling. The second universal coupling is connected to the driving mechanism. The bearing is connected to the driving mechanism. The gear is connected to the bearing. As described above, both a thick document and a thin document can be adapted.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: April 9, 2024
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventors: Wei Fong Lin, Yuan Yi Lin, Chih Yuan Yang
  • Patent number: 11783029
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to improve feature engineering efficiency. An example method disclosed herein includes retrieving a log file in a first file format, the log file containing feature occurrence data, generating a first unit operation based on the first file format to extract the feature occurrence data from the log file to a string, the first unit operation associated with a first metadata tag, generating second unit operations to identify respective features from the feature occurrence data, the second unit operations associated with respective second metadata tags, and generating a first sequence of the first metadata tag and the second metadata tags to create a first vector output file of the feature occurrence data.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: October 10, 2023
    Assignee: Intel Corporation
    Inventors: Chih-Yuan Yang, Yi Gai
  • Patent number: 11754956
    Abstract: A thickness detection mechanism arranged in a scanner or printer for measuring the thickness of mediums fed through the scanner or printer, which comprising: a conveyor section; at least a idle roller set arranged above the conveyor section, which includes at least a shaft and an idle roller pivotally arranged on the shaft; at least an elastic portion arranged above the shaft; and at least a pressure sensor secured on the elastic portion; wherein the thickness detection mechanism measures the thickness of the medium by measuring the pressure applied on the pressure sensor by the idle roller set as the idle roller set being pushed upward, and thus avoids the medium too thin or too thick to enter the scanner or the printer.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: September 12, 2023
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventor: Chih Yuan Yang
  • Publication number: 20230278160
    Abstract: A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Yuan YANG, Huai-Tei YANG, Yu-Chen WEI, Szu-Cheng WANG, Li-Hsiang CHAO, Jen-Chieh LAI, Shih-Ho LIN
  • Patent number: 11713202
    Abstract: A foldable baffle structure is mounted to a tray of a scanner or a printer. The foldable baffle structure includes two limiting components mounted to the tray. Each limiting component includes a sliding element, a stopping element, a guiding element and a pivoting element. Middles of the two sliding elements of the two limiting components have two accommodating spaces penetrating through top surfaces and bottom surfaces of the two sliding elements. The two stopping elements of the two limiting components are mounted in the accommodating spaces of the two limiting components. A middle of one end surface of the stopping element protrudes outward to form a pivoting portion. The guiding element is mounted around an outside of the pivoting portion. The pivoting element is pivotally disposed in the stopping element.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: August 1, 2023
    Assignee: Foxlink Image Technology Co., Ltd.
    Inventors: Yuan Yi Lin, Chih Yuan Yang
  • Patent number: 11685015
    Abstract: A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: June 27, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Yuan Yang, Huai-Tei Yang, Yu-Chen Wei, Szu-Cheng Wang, Li-Hsiang Chao, Jen-Chieh Lai, Shih-Ho Lin
  • Patent number: 11620397
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to facilitate electronic data security. An example apparatus includes a data storage including a memory adjusted to store data organized according to a data table including columns identifying a first data record and a first security tag associated with the first data record. In the example apparatus, retrieval of data from the data storage involves a bit operation comparing the first security tag with a first privilege tag. In the example apparatus, the data storage provides the first data record when the bit operation comparing the first security tag with the first privilege tag has a non-zero result, and the data storage does not provide the first data record when the bit operation comparing the first security tag with the first privilege tag has a zero result.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: April 4, 2023
    Assignee: Intel Corporation
    Inventors: Chih-Yuan Yang, Yi Gai
  • Publication number: 20230065272
    Abstract: A thick document conveying device includes a paper pickup mechanism. The paper pickup mechanism has a pick roller base, a pick roller axle, a pick roller, a switching assembly, a first universal coupling, a driving mechanism, a second universal coupling, a bearing and a gear. The pick roller axle and the pick roller are located in the pick roller base. The switching assembly is located under the pick roller base. The first universal coupling is connected to the pick roller axle. The driving mechanism is sleeved on the first universal coupling. The second universal coupling is connected to the driving mechanism. The bearing is connected to the driving mechanism. The gear is connected to the bearing. As described above, both a thick document and a thin document can be adapted.
    Type: Application
    Filed: January 3, 2022
    Publication date: March 2, 2023
    Inventors: Wei Fong Lin, Yuan Yi Lin, Chih Yuan Yang
  • Patent number: 11568051
    Abstract: A malicious object detection system for use in managed runtime environments includes a check circuit to receive call information generated by an application, such as an Android application. A machine learning circuit coupled to the check circuit applies a machine learning model to assess the information and/or data included in the call and detect the presence of a malicious object, such as malware or a virus, in the application generating the call. The machine learning model may include a global machine learning model distributed across a number of devices, a local machine learning model based on use patterns of a particular device, or combinations thereof. A graphical user interface management circuit halts execution of applications containing malicious objects and generates a user perceptible output.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: January 31, 2023
    Assignee: Intel Corporation
    Inventors: Mingwei Zhang, Xiaoning Li, Ravi L. Sahita, Aravind Subramanian, Abhay S. Kanhere, Chih-Yuan Yang, Yi Gai
  • Publication number: 20220340385
    Abstract: A sheet feeding mechanism includes a feeding path, at least one card feeding roller mounted to the feeding path, at least one paper feeding roller coaxial with the at least one card feeding roller, at least one card idle roller contacting with the at least one card feeding roller, at least one paper idle roller contacting with the at least one paper feeding roller, at least one elastic unit connected to the feeding path, and a stroke limiting unit. The at least one elastic unit is fastened to the feeding path. The at least one elastic unit has a stretching stroke. The stroke limiting unit controllably shortens the stretching stroke.
    Type: Application
    Filed: November 22, 2021
    Publication date: October 27, 2022
    Inventor: Chih Yuan Yang
  • Publication number: 20220326647
    Abstract: A thickness detection mechanism arranged in a scanner or printer for measuring the thickness of mediums fed through the scanner or printer, which comprising: a conveyor section; at least a idle roller set arranged above the conveyor section, which includes at least a shaft and an idle roller pivotally arranged on the shaft; at least an elastic portion arranged above the shaft; and at least a pressure sensor secured on the elastic portion; wherein the thickness detection mechanism measures the thickness of the medium by measuring the pressure applied on the pressure sensor by the idle roller set as the idle roller set being pushed upward, and thus avoids the medium too thin or too thick to enter the scanner or the printer.
    Type: Application
    Filed: August 2, 2021
    Publication date: October 13, 2022
    Inventor: Chih Yuan Yang
  • Publication number: 20220281246
    Abstract: A foldable baffle structure is mounted to a tray of a scanner or a printer. The foldable baffle structure includes two limiting components mounted to the tray. Each limiting component includes a sliding element, a stopping element, a guiding element and a pivoting element. Middles of the two sliding elements of the two limiting components have two accommodating spaces penetrating through top surfaces and bottom surfaces of the two sliding elements. The two stopping elements of the two limiting components are mounted in the accommodating spaces of the two limiting components. A middle of one end surface of the stopping element protrudes outward to form a pivoting portion. The guiding element is mounted around an outside of the pivoting portion. The pivoting element is pivotally disposed in the stopping element.
    Type: Application
    Filed: July 16, 2021
    Publication date: September 8, 2022
    Inventors: Yuan Yi Lin, Chih Yuan Yang
  • Patent number: 11367387
    Abstract: A method and an image processing device for mura detection on a display are proposed. The method includes the following steps. A compressed DeMura table corresponding to the display panel is obtained. Decompression is performed on the compressed DeMura table to generate a decompressed DeMura table. Upsampling is performed on the decompressed DeMura table to generate a reconstructed DeMura table. Mura compensation is performed on the display panel based on the reconstructed DeMura table.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: June 21, 2022
    Assignee: Novatek Microelectronics Corp.
    Inventors: Wenhui Yu, Xiaoming Bu, Chih-Yuan Yang
  • Publication number: 20220189387
    Abstract: A method and an image processing device for mura detection on a display are proposed. The method includes the following steps. A compressed DeMura table corresponding to the display panel is obtained. Decompression is performed on the compressed DeMura table to generate a decompressed DeMura table. Upsampling is performed on the decompressed DeMura table to generate a reconstructed DeMura table. Mura compensation is performed on the display panel based on the reconstructed DeMura table.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 16, 2022
    Applicant: Novatek Microelectronics Corp.
    Inventors: Wenhui Yu, Xiaoming Bu, Chih-Yuan Yang
  • Patent number: 11358252
    Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: June 14, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Chi Lin, Kun-Tai Wu, You-Hua Chou, Chih-Tsung Lee, Min Hao Hong, Chih-Jen Wu, Chen-Ming Huang, Soon-Kang Huang, Chin-Hsiang Chang, Chih-Yuan Yang
  • Patent number: 11251063
    Abstract: A transporter for transporting an article used in semiconductor fabrication is provided. The transporter includes a robotic arm. The transporter further includes two platens connected to the robotic arm. Each of the two platens an inner surface facing the other, and a number of gas holes are formed on each of the inner surfaces of the two platens. The transporter also includes a gas supplier placed in communication with the gas holes. The gas supplier is used to control the flow of gas through the gas holes.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: February 15, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jheng-Si Su, Yu-Chen Wei, Chih-Yuan Yang, Shih-Ho Lin, Jen-Chieh Lai
  • Publication number: 20210200863
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to improve feature engineering efficiency.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 1, 2021
    Inventors: Chih-Yuan Yang, Yi Gai
  • Publication number: 20210060728
    Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.
    Type: Application
    Filed: November 13, 2020
    Publication date: March 4, 2021
    Inventors: Yu-Chen Wei, Chih-Yuan Yang, Shih-Ho Lin, Jen Chieh Lai, Szu-Cheng Wang, Chun-Jui Chu