Abstract: A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-function material using first process conditions to form the work-function material having a first proportion of different crystalline orientations and forming a second transistor, which includes forming a second gate dielectric layer over a second channel region in the substrate and forming a second work-function layer over the second gate dielectric layer, wherein forming the second work-function layer includes depositing the work-function material using second process conditions to form the work-function material having a second proportion of different crystalline orientations.

Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to improve feature engineering efficiency. An example method disclosed herein includes retrieving a log file in a first file format, the log file containing feature occurrence data, generating a first unit operation based on the first file format to extract the feature occurrence data from the log file to a string, the first unit operation associated with a first metadata tag, generating second unit operations to identify respective features from the feature occurrence data, the second unit operations associated with respective second metadata tags, and generating a first sequence of the first metadata tag and the second metadata tags to create a first vector output file of the feature occurrence data.

Abstract: A thickness detection mechanism arranged in a scanner or printer for measuring the thickness of mediums fed through the scanner or printer, which comprising: a conveyor section; at least a idle roller set arranged above the conveyor section, which includes at least a shaft and an idle roller pivotally arranged on the shaft; at least an elastic portion arranged above the shaft; and at least a pressure sensor secured on the elastic portion; wherein the thickness detection mechanism measures the thickness of the medium by measuring the pressure applied on the pressure sensor by the idle roller set as the idle roller set being pushed upward, and thus avoids the medium too thin or too thick to enter the scanner or the printer.

Abstract: A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.

Abstract: A foldable baffle structure is mounted to a tray of a scanner or a printer. The foldable baffle structure includes two limiting components mounted to the tray. Each limiting component includes a sliding element, a stopping element, a guiding element and a pivoting element. Middles of the two sliding elements of the two limiting components have two accommodating spaces penetrating through top surfaces and bottom surfaces of the two sliding elements. The two stopping elements of the two limiting components are mounted in the accommodating spaces of the two limiting components. A middle of one end surface of the stopping element protrudes outward to form a pivoting portion. The guiding element is mounted around an outside of the pivoting portion. The pivoting element is pivotally disposed in the stopping element.

Abstract: A method of using a polishing system includes securing a wafer in a carrier head, the carrier head including a housing enclosing the wafer, in which the housing includes a retainer ring recess and a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, in which the retainer ring includes a main body portion and a bottom portion connected to the main body portion, and a bottom surface of the bottom portion includes at least one first engraved region and a first non-engraved region adjacent to the first engraved region; pressing the wafer against a polishing pad; and moving the carrier head or the polishing pad relative to the other.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to facilitate electronic data security. An example apparatus includes a data storage including a memory adjusted to store data organized according to a data table including columns identifying a first data record and a first security tag associated with the first data record. In the example apparatus, retrieval of data from the data storage involves a bit operation comparing the first security tag with a first privilege tag. In the example apparatus, the data storage provides the first data record when the bit operation comparing the first security tag with the first privilege tag has a non-zero result, and the data storage does not provide the first data record when the bit operation comparing the first security tag with the first privilege tag has a zero result.

Abstract: A thick document conveying device includes a paper pickup mechanism. The paper pickup mechanism has a pick roller base, a pick roller axle, a pick roller, a switching assembly, a first universal coupling, a driving mechanism, a second universal coupling, a bearing and a gear. The pick roller axle and the pick roller are located in the pick roller base. The switching assembly is located under the pick roller base. The first universal coupling is connected to the pick roller axle. The driving mechanism is sleeved on the first universal coupling. The second universal coupling is connected to the driving mechanism. The bearing is connected to the driving mechanism. The gear is connected to the bearing. As described above, both a thick document and a thin document can be adapted.

Abstract: A malicious object detection system for use in managed runtime environments includes a check circuit to receive call information generated by an application, such as an Android application. A machine learning circuit coupled to the check circuit applies a machine learning model to assess the information and/or data included in the call and detect the presence of a malicious object, such as malware or a virus, in the application generating the call. The machine learning model may include a global machine learning model distributed across a number of devices, a local machine learning model based on use patterns of a particular device, or combinations thereof. A graphical user interface management circuit halts execution of applications containing malicious objects and generates a user perceptible output.

Abstract: A sheet feeding mechanism includes a feeding path, at least one card feeding roller mounted to the feeding path, at least one paper feeding roller coaxial with the at least one card feeding roller, at least one card idle roller contacting with the at least one card feeding roller, at least one paper idle roller contacting with the at least one paper feeding roller, at least one elastic unit connected to the feeding path, and a stroke limiting unit. The at least one elastic unit is fastened to the feeding path. The at least one elastic unit has a stretching stroke. The stroke limiting unit controllably shortens the stretching stroke.

Abstract: A thickness detection mechanism arranged in a scanner or printer for measuring the thickness of mediums fed through the scanner or printer, which comprising: a conveyor section; at least a idle roller set arranged above the conveyor section, which includes at least a shaft and an idle roller pivotally arranged on the shaft; at least an elastic portion arranged above the shaft; and at least a pressure sensor secured on the elastic portion; wherein the thickness detection mechanism measures the thickness of the medium by measuring the pressure applied on the pressure sensor by the idle roller set as the idle roller set being pushed upward, and thus avoids the medium too thin or too thick to enter the scanner or the printer.

Abstract: A foldable baffle structure is mounted to a tray of a scanner or a printer. The foldable baffle structure includes two limiting components mounted to the tray. Each limiting component includes a sliding element, a stopping element, a guiding element and a pivoting element. Middles of the two sliding elements of the two limiting components have two accommodating spaces penetrating through top surfaces and bottom surfaces of the two sliding elements. The two stopping elements of the two limiting components are mounted in the accommodating spaces of the two limiting components. A middle of one end surface of the stopping element protrudes outward to form a pivoting portion. The guiding element is mounted around an outside of the pivoting portion. The pivoting element is pivotally disposed in the stopping element.

Abstract: A method and an image processing device for mura detection on a display are proposed. The method includes the following steps. A compressed DeMura table corresponding to the display panel is obtained. Decompression is performed on the compressed DeMura table to generate a decompressed DeMura table. Upsampling is performed on the decompressed DeMura table to generate a reconstructed DeMura table. Mura compensation is performed on the display panel based on the reconstructed DeMura table.

Abstract: A method and an image processing device for mura detection on a display are proposed. The method includes the following steps. A compressed DeMura table corresponding to the display panel is obtained. Decompression is performed on the compressed DeMura table to generate a decompressed DeMura table. Upsampling is performed on the decompressed DeMura table to generate a reconstructed DeMura table. Mura compensation is performed on the display panel based on the reconstructed DeMura table.

Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.

Abstract: A transporter for transporting an article used in semiconductor fabrication is provided. The transporter includes a robotic arm. The transporter further includes two platens connected to the robotic arm. Each of the two platens an inner surface facing the other, and a number of gas holes are formed on each of the inner surfaces of the two platens. The transporter also includes a gas supplier placed in communication with the gas holes. The gas supplier is used to control the flow of gas through the gas holes.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to improve feature engineering efficiency.

Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.