Patents by Inventor Chi-Ming Huang

Chi-Ming Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250218922
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.
    Type: Application
    Filed: March 17, 2025
    Publication date: July 3, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou
  • Patent number: 12283541
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.
    Type: Grant
    Filed: January 14, 2024
    Date of Patent: April 22, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou
  • Publication number: 20250062097
    Abstract: The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for adjusting a ribbon beam angle of an ion implantation system. An exemplary ion implantation system includes an ion source configured to generate a ribbon beam, a wafer chuck configured to hold a wafer during implantation by the ribbon beam, a dipole magnet disposed between the ion source and the wafer chuck, and a controller. The dipole magnet includes at least two coils configured to adjust a ribbon beam angle of the ribbon beam at one or more locations along a path of the ribbon beam between the ion source and the wafer held in the wafer chuck. The controller is configured to control the ion source, the wafer chuck, and the dipole magnet.
    Type: Application
    Filed: November 6, 2024
    Publication date: February 20, 2025
    Inventors: Zhimin WAN, Chi-ming HUANG, Shao-Yu HU
  • Patent number: 12170182
    Abstract: The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for adjusting a ribbon beam angle of an ion implantation system. An exemplary ion implantation system includes an ion source configured to generate a ribbon beam, a wafer chuck configured to hold a wafer during implantation by the ribbon beam, a dipole magnet disposed between the ion source and the wafer chuck, and a controller. The dipole magnet includes at least two coils configured to adjust a ribbon beam angle of the ribbon beam at one or more locations along a path of the ribbon beam between the ion source and the wafer held in the wafer chuck. The controller is configured to control the ion source, the wafer chuck, and the dipole magnet.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: December 17, 2024
    Assignee: Advanced Ion Beam Technology, Inc.
    Inventors: Zhimin Wan, Chi-ming Huang, Shao-Yu Hu
  • Publication number: 20240153861
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.
    Type: Application
    Filed: January 14, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou
  • Patent number: 11916009
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.
    Type: Grant
    Filed: May 30, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou
  • Publication number: 20240006113
    Abstract: An inductor includes a coil, a conductive lead frame, and a housing. The coil includes a coil body and a lead protruding from the coil body. The lead has a U-bend portion. The lead is electrically fixed onto the conductive lead frame. The housing encapsulates the coil and exposes the conductive lead frame. A method of manufacturing an inductor includes the following steps: providing a coil, providing a conductive lead frame, making a lead of the coil be electrically fixed onto the conductive lead frame, bending the lead to form a U-bend portion and make the main body of the coil close to a portion of the lead that connects with the conductive lead frame, and forming a housing to encapsulate the coil and expose the conductive lead frame.
    Type: Application
    Filed: June 4, 2023
    Publication date: January 4, 2024
    Applicant: DARFON ELECTRONICS CORP.
    Inventors: Zuei-Chown Jou, Chih-Ho Liu, Jui-Wen Kuo, Chi-Ming Huang, Bo-Yu Huang, Yao-Tsung Chen
  • Publication number: 20230395320
    Abstract: An integrated-type coupled inductor is applied to a related manufacturing method and includes a lead frame, a first coil, a second coil and a magnetic packing component. The lead frame has a first surface and a second surface opposite to each other and includes four pins. The first coil is disposed on the first surface and coupled to two of the four pins. The second coil is disposed on the second surface and coupled to other pins. The magnetic packing component covers the first coil and the second coil to expose parts of the four pins.
    Type: Application
    Filed: May 29, 2023
    Publication date: December 7, 2023
    Applicant: DARFON ELECTRONICS CORP.
    Inventors: Chih-Ho Liu, Jui-Wen Kuo, Chi-Ming Huang, Bo-Yu Huang, Yao-Tsung Chen
  • Publication number: 20230317827
    Abstract: Some embodiments provide a process of tunning sidewall profiles of gate openings prior to filling a replacement gate electrode layer therein to improve etching rate uniformity and stability during a subsequent gate electrode etch back process. Particularly, the profile sacrificial gate electrode is adjusted to be more straight profile rather than a bowl type profile, which reduces the seam void created in the replacement gate electrode during the replacement gate process. In some embodiments, tuning the profile of gate opening further includes performing a pullback etching process of the sidewall spacers prior to depositing gate dielectric layer and work function metal layer to achieve a wider opening for metal gate filling in the replacement gate process.
    Type: Application
    Filed: August 18, 2022
    Publication date: October 5, 2023
    Inventors: Chi-Ming HUANG, Chun-I LIU, Yu-Li LIN, Chih-Lun LU, Chen-Wei PAN, Chih-Teng LIAO
  • Patent number: 11688547
    Abstract: An inductor device and a method of fabricating the same. The inductor device according to the invention includes a conductive coil, a pillar and a cladding body. The pillar is molded from a plurality of first composite material powders by a pressing process. Each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin. The cladding body is molded from a plurality of second composite powders. Each second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin. The first weight ratio of the first thermosetting resin to the first composite material powders is less than the second weight ratio of the second thermosetting resin to the second composite material powders. The cladding body and the conductive coil and the pillar cladded by the cladding body are heated to a curing temperature.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: June 27, 2023
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Ping-Hung Lin, Zuei-Chown Jou, Yung-Ping Wu, Chi-Ming Huang, Yao-Tsung Chen, Bo-Yu Huang
  • Patent number: 11625111
    Abstract: A control method is provided, applied to an electronic device. The electronic device includes a screen and a knob module. The control method includes: receiving a trigger signal to enable the knob module, and displaying an operating interface corresponding to the knob module on the screen according to the trigger signal, where the operating interface includes a plurality of functional regions that is arranged annularly, and the functional regions are configured to display a plurality of function options, where one of the functional regions shows a marked state; switching the functional region corresponding to the marked state according to a first input signal from the knob module; and selecting the functional region corresponding to the marked state according to a second input signal from the knob module.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: April 11, 2023
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Mu-Chern Fong, Wei-Chuan Chen, Chi-Rong Hsu, Po-Nien Chen, Lan-Hua Huang, Wen Hui Huang, Chi-Ming Huang, Zhong Wei Hong, Siao-Yun Yang, Hsiao Fan Chen, Hsiu-Yu Kao
  • Patent number: 11584205
    Abstract: A silenced guide rail includes a guide rail body, a guide block, and a slideway. The guide rail body includes a beam piece, and the beam piece includes an abutting end. The guide block is connected to one end of the guide rail body, and the guide block includes a docking strip. The docking strip includes a corresponding abutting end corresponding to the abutting end. The abutting end includes a short side and a bevel. A shape of the corresponding abutting end corresponds to a shape formed by the short side and the bevel. The slideway is formed on the beam piece and the docking strip. Therefore, the present disclosure reduces an abnormal noise generated when a guide post passes through a connection between the guide rail body and the guide block, and an effect of eliminating all or most of the abnormal noise may be achieved.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: February 21, 2023
    Assignees: HSIN CHONG MACHINERY WORKS CO. LTD., FUZHOU MINGFANG AUTOMOBILE PARTS INDUSTRY CO., LTD.
    Inventors: Zhi-Wen Ling, Mei-Qing Zheng, Xi Chen, Yuan-Ming Liang, Chi-Ming Huang, Jeffrey Chung-Chiang Hsi
  • Publication number: 20230052178
    Abstract: A method of fabricating an inductor device includes preparing a conductive coil, connecting two terminals to one of two ends of the conductive coil, molding a pillar from a plurality of first composite material powders by a pressing process where each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin, placing the pillar in a surrounding space formed by the conductive coil, molding a cladding body from a plurality of second composite powders where the second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin, heating the cladding body, the conductive coil and the pillar cladded by the cladding body such that the plurality of first magnetic material powders are bonded by the cured first thermosetting resin and the plurality of second magnetic material powders are bonded by the cured second thermosetting resin.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 16, 2023
    Inventors: Ping-Hung LIN, Zuei-Chown JOU, Yung-Ping WU, Chi-Ming HUANG, Yao-Tsung CHEN, Bo-Yu HUANG
  • Publication number: 20230005701
    Abstract: The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for adjusting a ribbon beam angle of an ion implantation system. An exemplary ion implantation system includes an ion source configured to generate a ribbon beam, a wafer chuck configured to hold a wafer during implantation by the ribbon beam, a dipole magnet disposed between the ion source and the wafer chuck, and a controller. The dipole magnet includes at least two coils configured to adjust a ribbon beam angle of the ribbon beam at one or more locations along a path of the ribbon beam between the ion source and the wafer held in the wafer chuck. The controller is configured to control the ion source, the wafer chuck, and the dipole magnet.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 5, 2023
    Applicant: Advanced Ion Beam Technology, Inc.
    Inventors: Zhimin WAN, Chi-ming HUANG, Shao-Yu HU
  • Publication number: 20220293508
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.
    Type: Application
    Filed: May 30, 2022
    Publication date: September 15, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou
  • Publication number: 20220229500
    Abstract: A control method is provided, applied to an electronic device. The electronic device includes a screen and a knob module. The control method includes: receiving a trigger signal to enable the knob module, and displaying an operating interface corresponding to the knob module on the screen according to the trigger signal, where the operating interface includes a plurality of functional regions that is arranged annularly, and the functional regions are configured to display a plurality of function options, where one of the functional regions shows a marked state; switching the functional region corresponding to the marked state according to a first input signal from the knob module; and selecting the functional region corresponding to the marked state according to a second input signal from the knob module.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 21, 2022
    Inventors: Mu-Chern FONG, Wei-Chuan CHEN, Chi-Rong HSU, Po-Nien CHEN, Lan-Hua HUANG, Wen Hui HUANG, Chi-Ming HUANG, Zhong Wei HONG, Siao-Yun YANG, Hsiao Fan CHEN, Hsiu-Yu KAO
  • Patent number: 11373946
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: June 28, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou
  • Publication number: 20220111711
    Abstract: A silenced guide rail includes a guide rail body, a guide block, and a slideway. The guide rail body includes a beam piece, and the beam piece includes an abutting end. The guide block is connected to one end of the guide rail body, and the guide block includes a docking strip. The docking strip includes a corresponding abutting end corresponding to the abutting end. The abutting end includes a short side and a bevel. A shape of the corresponding abutting end corresponds to a shape formed by the short side and the bevel. The slideway is formed on the beam piece and the docking strip. Therefore, the present disclosure reduces an abnormal noise generated when a guide post passes through a connection between the guide rail body and the guide block, and an effect of eliminating all or most of the abnormal noise may be achieved.
    Type: Application
    Filed: August 23, 2021
    Publication date: April 14, 2022
    Inventors: Zhi-Wen LING, Mei-Qing ZHENG, Xi CHEN, Yuan-Ming LIANG, Chi-Ming HUANG, Jeffrey Chung-Chiang HSI
  • Publication number: 20210305145
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.
    Type: Application
    Filed: March 26, 2020
    Publication date: September 30, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou
  • Publication number: 20210090792
    Abstract: An inductor device and a method of fabricating the same. The inductor device according to the invention includes a conductive coil, a pillar and a cladding body. The pillar is molded from a plurality of first composite material powders by a pressing process. Each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin. The cladding body is molded from a plurality of second composite powders. Each second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin. The first weight ratio of the first thermosetting resin to the first composite material powders is less than the second weight ratio of the second thermosetting resin to the second composite material powders. The cladding body and the conductive coil and the pillar cladded by the cladding body are heated to a curing temperature.
    Type: Application
    Filed: September 4, 2020
    Publication date: March 25, 2021
    Inventors: Ping-Hung LIN, Zuei-Chown JOU, Yung-Ping WU, Chi-Ming HUANG, Yao-Tsung CHEN, Bo-Yu HUANG