Abstract: The present invention provides a non-planar FET and a method of manufacturing the same. The non-planar FET includes a substrate, a fin structure, a gate and a gate dielectric layer. The fin structure is disposed on the substrate. The fin structure includes a first portion adjacent to the substrate wherein the first portion shrinks towards a side of the substrate. The gate is disposed on the fin structure. The gate dielectric layer is disposed between the fin structure and the gate. The present invention further provides a method of manufacturing the non-planar FET.

Abstract: A structure improvement of a pump casing with a Polyfluoroalkoxy (PFA) liner which improves manufacturing efficiency, reduces manufacturing cost and improves yield strength, more particular to keep the stiffness of the shaft support and improve yield of the pump casing. The metal pump casing with the PFA liner used for handling corrosive liquids includes a suction casing with PFA liner, and a volute casing with PFA liner for accommodating an impeller. The volute casing also collects and then ejects the liquid through a discharge. The suction casing with the PFA liner and the volute casing with the PFA liner are separately formed as two workpieces by injection molding process and then assembled to form the pump casing so as to reduce the residual stress applied in the PFA liner.

Abstract: A method is provided for managing over-the-top delivery of content through a plurality of content delivery networks (CDN). The method provided works transparently with standard HTTP servers supporting an initial request for content from a client to a first preferred CDN. If the first CDN does not have the content, the method includes provisions for the first CDN to acquire the content from a second CDN, or for the client to request the content from a second CDN directly. A system is also specified for implementing a client and server infrastructure in accordance with the provisions of the method.

Abstract: A text-to-speech method and a multi-lingual speech synthesizer using the method are disclosed. The multi-lingual speech synthesizer and the method executed by a processor are applied for processing a multi-lingual text message in a mixture of a first language and a second language into a multi-lingual voice message. The multi-lingual speech synthesizer comprises a storage device configured to store a first language model database, a second language model database, a broadcasting device configured to broadcast the multi-lingual voice message, and a processor, connected to the storage device and the broadcasting device, configured to execute the method disclosed herein.

Abstract: Disclosed herein are semiconductor devices and methods for fabricating a semiconductor device. In an embodiment, a method of fabricating a semiconductor device comprises providing a substrate. The method further comprises forming, on the substrate, an array region having a first height, a peripheral region having a second height greater than the first height, and a border region, the border region separating the array region from the peripheral region. The method further comprises forming a plurality of alternating insulative and conductive layers over at least a portion of the array region and the border region. The method further comprises forming a trench through the plurality of alternating insulative and conductive layers in at least a portion of the border region, the trench having sloping sidewalls.

Abstract: The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. The semiconductor substrate has a space extending from the second surface to the first surface and an insulation body is disposed in the space. The semiconductor package structure includes conductive posts in the insulation body.

Abstract: A mobile device includes a diversity antenna, a radio-frequency antenna, a first wireless communication circuit, a second wireless communication circuit and a first switching circuit. The second wireless communication circuit is electrically connected to the radio-frequency antenna. The first switching circuit is electrically connected to the diversity antenna, the first wireless communication circuit and the second wireless communication circuit. In a first mode, the diversity antenna is conducted to the first wireless communication circuit through the first switching circuit, and the first wireless communication circuit receives a wireless signal through the diversity antenna. In a second mode, the diversity antenna is conducted to the second wireless communication circuit through the first switching circuit, and the second wireless communication circuit executes a multi-input multi-output transmission through the diversity antenna and the radio-frequency antenna.

Abstract: The present invention provides a low-toxic and high-recovery industrial process for synthesizing an optically active diamine derivative represented by formula (D), the process comprising the steps of: (a) mixing a compound represented by formula (A) and a compound represented by formula (C) in organic solvents and secondary amine; (b) reaction under heating; (c) cooling and adding water to the mixed solution, allowing it to crystallize to obtain the compound represented by formula (D).

Abstract: A method of purifying yttrium involves purifying element yttrium by high-temperature saturated dissolution, low-temperature recrystallization, high-temperature reduction and vaporization-based removal of impurities, in a simple manner, and at a low cost, such that yttrium element is unlikely to be contaminated by any raw material used in a manufacturing process.

Abstract: A semiconductor die includes a semiconductor body, an insulating layer, a conductive circuit layer and at least one conductive bump. The semiconductor body has a first surface, a second surface and a side surface extending between the first surface and the second surface. The insulating layer is disposed on the first surface and the side surface of the semiconductor body. The insulating layer includes a first insulating layer over the semiconductor body and a second insulating layer over the first insulating later. The insulating layer includes a step structure. The conductive circuit layer is electrically connected to the first surface of the semiconductor body, the conductive circuit layer includes at least one pad, and the conductive bump is electrically connected to the pad.

Abstract: A method is provided for managing over-the-top delivery of content through a plurality of content delivery networks (CDN). The method provided works transparently with standard HTTP servers supporting an initial request for content from a client to a first preferred CDN. If the first CDN does not have the content, the method includes provisions for the first CDN to acquire the content from a second CDN, or for the client to request the content from a second CDN directly. A system is also specified for implementing a client and server infrastructure in accordance with the provisions of the method.

Abstract: The present invention provides a low-toxic and high-recovery industrial process for synthesizing an optically active diamine derivative represented by formula (D), the process comprising the steps of: (a) mixing a compound represented by formula (A) and a compound represented by formula (C) in organic solvents and secondary amine; (b) reaction under heating; (c) cooling and adding water to the mixed solution, allowing it to crystallize to obtain the compound represented by formula (D).

Abstract: A method and a corresponding system for process variation analysis of an integrated circuit are provided. A netlist is generated describing electronic devices of an integrated circuit in terms of device parameters and process parameters. The process parameters include local process parameters individual to the electronic devices and global process parameters common to the electronic devices. Critical electronic devices are identified having device parameters with greatest contributions to a performance parameter of a design specification of the integrated circuit. Sensitivity values are determined for the global process parameters and local process parameters of the critical electronic devices. The sensitivity values represent how sensitive the one or more performance parameters are to variations in the global and local process parameters of the critical electronic devices. Monte Carlo (MC) samples are sorted based on the sensitivity values.

Abstract: An eardrum incision device includes a main body, a replaceable inserting portion and a display device. The replaceable inserting portion is detachably connected to the main body. The replaceable inserting portion has an insertion end located on a side far away from the main body and adapted to be inserted into an ear canal of a user. The replaceable inserting portion includes an image-capturing device, a mounting hole and a replaceable incision component. The image-capturing device is disposed at the insertion end. The mounting hole extends in a direction from the insertion end toward the main body. The replaceable incision component is removably disposed in the mounting hole and adapted to pierce out of the mounting hole in a direction toward the insertion end, so as to incise the eardrum of the user. The display device is disposed on the main body and electrically connected to the image-capturing device.

Abstract: A sealless magnetic drive pump features in improving the stiffness of a stationary shaft. More particularly, the metal magnetic drive pump has an anti-corrosion casing liner. The magnetic drive pump is used in manufacture processes related to corrosive fluid. The pump is especially used in a highly corrosive and high-temperature (up to 200° C.) condition to improve the stiffness of a front support. The stationary shaft includes a metal front support integrated with the pump casing at a pump inlet and encapsulated with a resin enclosure made of a fluoropolymer; a rear shaft seat positioned on a sealed bottom side of a containment shell for offering auxiliary support for the stationary shaft; an impeller including a channel for reducing an inlet flow velocity to offer a low NPSHr.

Abstract: A sealless magnetic drive pump features in improving the stiffness of a stationary shaft. More particularly, the metal magnetic drive pump has an anti-corrosion casing liner. The magnetic drive pump is used in manufacture processes related to corrosive fluid. The pump is especially used in a highly corrosive and high-temperature (up to 200° C.) condition to improve the stiffness of a front support. The stationary shaft includes a metal front support integrated with the pump casing at a pump inlet and encapsulated with a resin enclosure made of a fluoropolymer; a rear shaft seat positioned on a sealed bottom side of a containment shell for offering auxiliary support for the stationary shaft; an impeller including a channel for reducing an inlet flow velocity to offer a low NPSHr.

Abstract: A multi-function writing implement comprises a pen shaft, a colored pen assembly, and an erasing pen assembly. The colored pen assembly is arranged at one end of the pen shaft. The colored pen assembly includes a cartridge seat, a nib seat, a plurality of colored cartridges, a plurality of relay cartridges, and a plurality of colored ink cotton tubes. The cartridge seat is connected to the pen shaft. One end of the nib seat has a plurality of cartridge slots. The colored cartridges are respectively arranged at the cartridge slots. The relay cartridges are respectively connected to the colored cartridges and arranged in the cartridge seat. The colored ink cotton tubes are respectively connected to the relay cartridges and arranged in the pen shaft and the cartridge in parallel. The erasing pen assembly is arranged at the other end of the pen shaft opposite to the colored pen assembly.

Abstract: A semiconductor die includes a semiconductor body, an insulating layer, a conductive circuit layer and at least one conductive bump. The semiconductor body has a first surface, a second surface and a side surface extending between the first surface and the second surface. The insulating layer is disposed on the first surface and the side surface of the semiconductor body. The insulating layer includes a first insulating layer over the semiconductor body and a second insulating layer over the first insulating later. The insulating layer includes a step structure. The conductive circuit layer is electrically connected to the first surface of the semiconductor body, the conductive circuit layer includes at least one pad, and the conductive bump is electrically connected to the pad.

Abstract: A structural improvement of the canned pump is to improve the stiffness of a stationary shaft and, according to requirement, to dispose a monitor device. The method for improving the stiffness of the stationary shaft includes axially inserting a shaft metal rear support of the metal structural of a motor rear casing of a canned motor into the inner side of a rotor yoke of an inner rotor of the canned motor, tightly attaching the shaft metal rear support to a rear shaft seat for improving the stiffness of the stationary shaft by longer hold length, and for shortening an arm length of the composite force. The monitor device, used for detecting the wear of a bearing for enhancing the reliability and satisfying the driving requirement, is installed in the ring slot to be protected by the rear shaft seat.

Abstract: A method is disclosed that includes performing a first simulation by applying first variations to identify at least one sample of an integrated circuit (IC), wherein the IC comprises at least one device; translating individual variables of split devices implementing the at least one device, to an equivalent variable for the split devices; and performing a second simulation, by applying at least a portion of second variations, with the equivalent variable for the split devices, to obtain a simulation result serving as a basis of modifying the layout for fabrication of the IC.