Patents by Inventor Chin Feng Wang

Chin Feng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240114619
    Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.
    Type: Application
    Filed: December 2, 2022
    Publication date: April 4, 2024
    Applicant: InnoLux Corporation
    Inventors: Cheng-Chi WANG, Chin-Ming HUANG, Chien-Feng LI, Chia-Lin YANG
  • Patent number: 11913132
    Abstract: A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: February 27, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia Chun Hsu, Chin-Feng Wang
  • Publication number: 20230374689
    Abstract: A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia Chun HSU, Chin-Feng WANG
  • Publication number: 20210327731
    Abstract: A mass transfer method, a mass transfer device and a buffer carrier are provided. The mass transfer method includes: (a) providing a plurality of electronic components disposed on a source carrier; (b) providing a buffer carrier including a plurality of adjusting cavities; and (c) transferring the electronic components from the source carrier to the buffer carrier, wherein the electronic components are placed in the adjusting cavities of the buffer carrier to adjust positions of the electronic components from shifted positions to correct positions.
    Type: Application
    Filed: April 15, 2020
    Publication date: October 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Wen CHANG, Yu-Ho HSU, Tai-Yuan HUANG, Ping-Feng YANG, Fu-Ting CHANG, Chin-Feng WANG
  • Patent number: 10344383
    Abstract: In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: July 9, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chuan-Yung Shih, Tai-Yuan Huang, Yu-Chi Wang, Chin-Feng Wang, Sing-Syuan Shiau, Chun-Wei Shih, Shao-Ci Huang, Huang-Hsien Chang, Yuan-Feng Chiang
  • Publication number: 20190040527
    Abstract: In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.
    Type: Application
    Filed: August 3, 2017
    Publication date: February 7, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chuan-Yung SHIH, Tai-Yuan HUANG, Yu-Chi WANG, Chin-Feng WANG, Sing-Syuan SHIAU, Chun-Wei SHIH, Shao-Ci HUANG, Huang-Hsien CHANG, Yuan-Feng CHIANG
  • Publication number: 20120052759
    Abstract: An industrial fabric (3) includes a plurality of yarns (31, 32) extending in warp and weft directions and woven into a twill weave structure, which includes 200˜2000 monofilament fibers (311) per inch in either one of the warp and weft directions. A degree of fineness of each monofilament fiber ranges from 50 deniers to 500 deniers. The industrial fabric (3) not only has good strength but also provides excellent water permeability.
    Type: Application
    Filed: August 29, 2011
    Publication date: March 1, 2012
    Applicant: GOLD-JOINT INDUSTRY CO., LTD.
    Inventor: Chin-Feng Wang
  • Publication number: 20120051673
    Abstract: A sandbag is made of synthetic fibers, is an integral, woven, hollow and elongated element and has an upper cloth, a lower cloth, two lateral strengthened strips, a stuffing space and an inlet. The lower cloth is woven with the upper cloth. The lateral strengthened strips are respectively formed on two opposite sides of the sandbag and are integrally woven with where long sides of the upper cloth and the lower cloth are connected. The sandbag is produced as an integral element and has the lateral strengthened strips, so the structural strength of the sandbag is greatly enhanced and a lifespan of the sandbag is prolonged.
    Type: Application
    Filed: August 17, 2011
    Publication date: March 1, 2012
    Inventor: Chin-Feng Wang
  • Publication number: 20040113030
    Abstract: A supporting device includes a base with a tube connected thereto and a rod having a threaded outer periphery is freely and movably received in the tube. A support platform is connected to the rod. A biasing device includes a box, a spring received in the box and a pushing member which is movably inserted through one end of the box and contacts the spring. The pushing member has a through hole with threads defined in an inner periphery of the through hole. The rod movably extends through two alignment holes of the box and the threads are engaged with the threaded outer periphery. The rod is quickly moved relative to the tube by pushing the pushing member to disengage the threads of the through hole from the rod.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 17, 2004
    Inventor: Chin-Feng Wang
  • Patent number: 6712106
    Abstract: A dust bag for wood working machine includes a first open end with which a mounting piece is engaged so as to be mounted to a blow outlet of the wood working machine, and a second open end which is cooperated with a securing device such that the second open end is secured to a bucket. The dust bag is made of air-permeable material and the wood shreds are blown into the dust bag.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: March 30, 2004
    Inventor: Chin-Feng Wang
  • Publication number: 20040055665
    Abstract: A dust bag for wood working machine includes a first open end with which a mounting piece is engaged so as to be mounted to a blow outlet of the wood working machine, and a second open end which is cooperated with a securing device such that the second open end is secured to a bucket. The dust bag is made of air-permeable material and the wood shreds are blown into the dust bag.
    Type: Application
    Filed: September 24, 2002
    Publication date: March 25, 2004
    Inventor: Chin-Feng Wang
  • Patent number: D471215
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: March 4, 2003
    Inventor: Chin-Feng Wang
  • Patent number: D471569
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: March 11, 2003
    Inventor: Chin-Feng Wang
  • Patent number: D471570
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: March 11, 2003
    Inventor: Chin-Feng Wang
  • Patent number: D471924
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: March 18, 2003
    Inventor: Chin-Feng Wang
  • Patent number: D477002
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: July 8, 2003
    Inventor: Chin-Feng Wang
  • Patent number: D479724
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: September 16, 2003
    Inventor: Chin-Feng Wang
  • Patent number: D488173
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: April 6, 2004
    Inventor: Chin Feng Wang
  • Patent number: D488490
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: April 13, 2004
    Inventor: Chin Feng Wang
  • Patent number: D488821
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: April 20, 2004
    Inventor: Chin Feng Wang