Abstract: A semiconductor structure includes a substrate; an isolation structure over the substrate; a first fin extending from the substrate and through the isolation structure; a first source/drain structure over the first fin; a contact etch stop layer over the isolation structure and contacting a first side face of the first source/drain structure; and a first dielectric structure contacting a second side face of the first source/drain structure. The first side face and the second side face are on opposite sides of the first fin in a cross-sectional view cut along a widthwise direction of the first fin. The first dielectric structure extends higher than the first source/drain structure.

Abstract: There is provided a moving robot including a first light source module and a second light source module respectively project a first light section and a second light section, which are vertical light sections, in front of a moving direction, wherein the first light section and the second light section cross with each other at a predetermined distance in front of the moving robot so as to eliminate a detection dead zone between the first light source module and the second light source module in front of the moving robot to avoid collision with an object during operation.

Abstract: A method and device for displacing fluid from a reagent cartridge (310) into a microfluidic device (320) and for loading the fluid into the reagent cartridge (310). The reagent cartridge (310) may include a cartridge body and a pipette array with pipette tips (315) to engage inlets of a microfluidics or other cartridge, wherein the pipette tips (315) correspond in position to the plurality of inlets (325) of the microfluidic device (320). Fluid may be loaded into or displaced from the microfluidic device (320) by a system of plungers (615). The reagent cartridge may alternatively include blisters (925) having fluid reservoirs and dispensing tips (930), each dispensing tip (930) including a pathway (927) that is fluidly coupled to a blister (925). The fluid may be displaced from or loaded into the blister (925) via the dispensing tip (930). A deformable seal (910) may be overlaid on the blisters (925) to seal the volumes of fluid within the blisters (925), and may be deformed to displace the fluid.

Abstract: A stylus control circuit used to control a stylus includes a positioning signal generator. The positioning signal generator is used to generate a first positioning signal having a first frequency and transmit the first positioning signal to the stylus through a first positioning transmission electrode. Wherein, the first frequency corresponds to a position of the first positioning transmission electrode, and the first positioning signal is a frequency signal without carrying any digital data.

Abstract: A method of forming a semiconductor structure includes forming a dielectric stack over a substrate, in which forming the dielectric stack includes forming a first support layer, a first sacrificial layer, a second support layer, a second sacrificial layer and a third support layer in sequence. A first hard mask layer is formed over the dielectric stack. A second hard mask layer is formed over the first hard mask layer. A patterned mask is formed over the second hard mask layer. The first and second hard mask layers are etched using the patterned mask as an etch mask to form first and second hard masks, in which the first hard mask layer is etched faster than the second hard mask layer. An opening is formed in the dielectric stack to expose the substrate. A bottom electrode layer is formed in the opening of the dielectric stack.

Abstract: An optimization method for a vacuum plating process includes following steps. A property of a thin film to be optimized is determined. According to the property of the thin film to be optimized, process parameters and a level of each of the process parameters are determined. M sets of experiments are designed, where M is a positive integer, M is positively related to a number of the process parameters, but M is not related to a number of the level of the process parameters. The M sets of experiments are performed to obtain M sets of test films and the property of each of the test films are measured or calculated. Process parameters used in the M sets of experiments and the property of the M sets of test films are fitted with a multi-dimensional quadratic transformation function to obtain a first fitting function. The first fitting function is dynamically modified using an iteration method to obtain a best fitting function.

Abstract: A spiral guiding dual-axis hinge has a fixing base, two mounting brackets, a slider, and a cover. The fixing base includes two installation recesses and a guiding track. The guiding track is located between the two installation recesses; each of the two mounting brackets has an installing part and a mounting part, a top surface of the installing part forms a spiral groove extending obliquely, the two mounting brackets are movably mounted in the two installation recesses. The slider has two wing parts and a guiding part, a guiding pole is formed on the guiding part, and the slider is mounted in the two spiral grooves via the two wing parts; the guiding pole is disposed through the guiding track. The cover covers the fixing base. The two mounting brackets are linked by the slider, thereby flipping movements of the two mounting brackets being synchronized.

Abstract: A spiral guiding dual-axis hinge has a fixing base, two mounting brackets, a slider, and a cover. The fixing base includes two installation recesses and a guiding track. The guiding track is located between the two installation recesses; each of the two mounting brackets has an installing part and a mounting part, a top surface of the installing part forms a spiral groove extending obliquely, the two mounting brackets are movably mounted in the two installation recesses. The slider has two wing parts and a guiding part, a guiding pole is formed on the guiding part, and the slider is mounted in the two spiral grooves via the two wing parts; the guiding pole is disposed through the guiding track. The cover covers the fixing base. The two mounting brackets are linked by the slider, thereby flipping movements of the two mounting brackets being synchronized.

Abstract: The present disclosure generally relates to miniaturized chambers for automatically conducting cell culture under controlled environment conditions. In some implementation examples, a system includes a first chamber, a second chamber, and a control subsystem. The control subsystem detects a first environment condition associated with the first chamber and a second environment condition associated with the second chamber. Based at least on the first environment condition and a first airflow mode, the control subsystem supplies a first airflow to the first chamber to adjust the first environment condition toward a first target environment condition. Based at least on the second environment condition and a second airflow mode, the control subsystem supplies a second airflow to the second chamber to adjust the second environment condition toward a second target environment condition.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: A handheld burning device includes a diversion mechanism, a nozzle connected to the diversion mechanism, a mixing inner tube arranged adjacent to an outlet of the nozzle, an ignition mechanism, and a metal outer tube that is sleeved around the mixing inner tube. The outlet of the nozzle has an aperture being within a range from 0.17 mm to 0.19 mm, an inner diameter of the mixing inner tube is within a range from 28 times to 33 times of the aperture, a length of the mixing inner tube is within a range from 60 mm to 100 mm, and a length of the metal outer tube is greater than the length of the mixing inner tube and is within a range from 90 mm to 140 mm.

Abstract: A microscopic operating device includes a microscopically image capturing mechanism and a processing mechanism mounted on the seat mechanism. The microscopically image capturing mechanism includes a microscopically image capturing unit moved and adjusted in an up-down direction and having two microscope lenses. The processing mechanism is actuated to move downwardly to reach a field of view of the microscope lenses and to process to biosamples in a sample container. With the two microscope lenses and a processing unit of the processing mechanism, the position of the processing unit relative to the biosamples can be observed from different angles so as to conduct a precise processing procedure.

Abstract: A method for manufacturing a high electron mobility transistor (HEMT), which comprises the following steps: providing a substrate, wherein a semiconductor layer is formed on the substrate, and a source electrode and a drain electrode are formed on the semiconductor layer; forming a passivation layer on the source electrode and the drain electrode; etching the passivation layer to form a through hole between the source electrode and the drain electrode, wherein a region of the semiconductor layer is exposed through the through hole; forming a photoresist layer on the passivation layer, wherein a first sub-region of the region of the semiconductor layer is covered by the photoresist layer, and a second sub-region of the region of the semiconductor layer is not covered by the photoresist layer; forming a metal layer on the second sub-region to form a gate electrode; and removing the passivation layer.

Abstract: A packaging substrate that includes a first conductive layer to an Nth conductive layer stacked in sequence, N being a positive integer greater than 3; an insulating layer arranged between two adjacent conductive layers; a plurality of pads disposed on the first conductive layer, the plurality of pads being used to connect a plurality of conductive bumps at the bottom of a chip; and a plurality of conductive holes arranged one-to-one corresponding to the plurality of pads between the first conductive layer and an ath conductive layer, one end of the conductive hole is connected to the corresponding pad, and the other end extending to the ath conductive layer at most and being electrically connected to a corresponding core conductive hole.

Abstract: An optical member driving mechanism for connecting an optical member is provided, including a fixed portion and a first adhesive member. The fixed portion includes a first member and a second member, wherein the first member is fixedly connected to the second member via the first adhesive member.

Abstract: Provided is a window cleaning machine including a body, air extracting module, first cleaning device, second cleaning device, walking module disposed near the body, and driving device connected to the first and second cleaning devices to cause a reciprocating motion thereof. The body defines a primary suction space. The air extracting module is disposed on the body and is in communication with the primary suction space. The first and second cleaning devices are each in contact with a pane surface while performing a cleaning operation. The first cleaning device defines a first subsidiary space in communication with the primary suction space. The second cleaning device defines a second subsidiary space in communication with the primary suction space. The walking module is disposed outside the first and second subsidiary spaces. The window cleaning machine undergoes the reciprocating motion across a non-horizontal pane surface while clinging firmly thereto by suction.

Abstract: A window cleaning machine includes a body, walking module, air extracting module, first cleaning device and driving device. The body defines a primary suction space. The walking module is disposed near the body. The air extracting module is disposed on the body and is in communication with the primary suction space, allowing the body to cling to the pane surface by suction. The first cleaning device is in contact with the pane surface while performing a cleaning operation. The driving device is connected to the first cleaning device to cause the first cleaning device to undergo a reciprocating motion so as to wipe the pane surface back and forth. The body further comprises a bottom board and a carrying board. The bottom board comprises a bottom board wall portion enclosing a first bottom board through hole. The carrying board is disposed between the first cleaning device and the bottom board.

Abstract: A window cleaning machine provided according to an embodiment of the disclosure comprises a resilient member disposed between a body and a first cleaning device to prevent external air from passing between the body and the first cleaning device and entering a primary suction space of the body.

Abstract: A dual axis slider hinge has a fixing base, two sliders, two holders, and a link unit. The fixing base has two sockets and a positioning hole, and each of the two sockets has two straight tracks. Each of the sliders has two lateral sliding grooves, a holder connecting portion, and an inner sliding slot. The sliders are respectively mounted in the sockets, and the lateral sliding grooves engage with the straight tracks. Each of the holders has a connecting plug and a combining portion, and the connecting plug is pivotably connected to the holder connecting portion. The link unit has two connecting portions and a rotating portion. Each of the connecting portions has a connecting pin. The connecting pins are movably mounted in the inner sliding slots respectively, thereby synchronizing the two holders via the link unit to flip simultaneously.

Abstract: An example non-transitory machine-readable storage medium includes instructions executable by a processing resource of an electronic device. The instructions cause the electronic device to receive a communication associated with a first mode of communication via the communication device and determine an intent to change from the first mode of communication to a second mode of communication. In response to determining the intent, the instructions cause the electronic device to determine that a communication device associated with the second mode of communication is not in a ready state and assist the communication device associated with the second mode of communication to be in the ready state.