Abstract: An electronic device is provided. The electronic device includes at least one electronic circuit, a scan line, and a scan signal conversion circuit. The scan line transmits a first scan signal. The scan signal conversion circuit is electrically connected to the at least one electronic circuit and the scan line. The scan signal conversion circuit receives the first scan signal, converts the first scan signal into a second scan signal, and provides the second scan signal to the at least one electronic circuit.

Abstract: An electronic device including a circuit layer, an electronic element, a first flow-path structure and a fluid material is disclosed. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The first flow-path structure includes a first flow path, and the electronic element is disposed in the first flow-path structure. The fluid material is disposed in the first flow path. The fluid material is used for performing heat exchange with the electronic element. The circuit layer includes an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole.

Abstract: An electronic device is provided. The electronic device includes a base and a conductive layer that is disposed on the base and patterned by a plurality of processes. The plurality of processes include providing a mask substrate. The mask substrate includes a first substrate and a patterned substrate. In the cross-sectional view, the width of the first substrate is greater than or equal to the width of the patterned substrate. The plurality of processes include arranging the mask substrate and the base correspondingly. The plurality of processes also include performing exposure and development processes on the conductive layer for patterning the conductive layer, and removing the mask substrate.

Abstract: An electronic device is provided and includes a substrate, a first bump, a second bump, and an electronic element. The substrate includes a first through hole and a second through hole disposed adjacent to the first through hole along a direction. The first bump and the second bump are overlapped with the substrate, wherein the first bump is adjacent to the second bump along the direction. The electronic element is overlapped with the substrate and electrically connected to the first bump, wherein the substrate is disposed between the first bump and the electronic element. A distance between the first through hole and the second through hole of the substrate along the direction is different from a distance between the first bump and the second bump along the direction.

Abstract: An electronic device includes a substrate, a sidewall, a plurality of light emitting elements and an optical element. The sidewall is connected to the substrate. The plurality of light emitting elements are disposed on the substrate. The optical element covers at least two of the plurality of light emitting elements, wherein, in a cross-sectional view of the electronic device, a portion of the optical element is disposed between two adjacent ones of the plurality of light emitting elements, and a height of the sidewall is greater than a thickness of the optical element.

Abstract: A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

Abstract: Disclosed are an electronic device and a manufacturing method thereof. The electronic device includes a circuit structure and at least one contacting part. The at least one contacting part is disposed on the circuit structure, and includes an insulating part and a conductive layer. The conductive layer surrounds the insulating part, and the conductive layer is electrically connected to the circuit structure. The electronic device disclosed herein may have a buffering effect or reduce damage to an object to be detected.

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

Abstract: A display device is provided, and includes a substrate and a first light shielding layer disposed on the substrate and defining a plurality of first openings. The display device includes a first light filter layer disposed in one of the first openings and a plurality of light-emitting diodes disposed on the substrate. The display device includes a second light shielding layer disposed between the substrate and the first light shielding layer, and having a plurality of second openings. The at least part of the light-emitting diodes are disposed in the second openings respectively. The display device also includes a spacer element disposed between the first light shielding layer and the second light shielding layer, wherein from a cross-section view, a shape of the spacer element is arc-shaped, and a shape of the second light shielding layer is arc-shaped.

Abstract: The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the bumps and at least a portion of the first through holes.

Abstract: An electronic device is provided. The electronic device includes a first substrate and a plurality of light-emitting elements disposed on the first substrate. The plurality of light-emitting elements include a contact pad; an intermediate substrate disposed on the contact pad; and a light-emitting unit disposed on the intermediate substrate. The electronic device further includes a second substrate and a first thin-film transistor array disposed on the second substrate for driving at least a portion of the plurality of light-emitting elements. The light-emitting unit is electrically connected to the contact pad through a via hole that penetrates the intermediate substrate.

Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

Abstract: An electronic device is provided. The electronic device includes a substrate, a material layer, a first metal layer, and a second metal layer. The material layer is disposed on the substrate, wherein a material of the material layer includes polysilicon, amorphous silicon, or indium gallium zinc oxide. The first metal layer is disposed on the material layer, wherein a first edge of the first metal layer includes a first curved portion. The second metal layer is disposed on the material layer, wherein a second edge of the second metal layer includes a second curved portion, and the second edge surrounds the first edge.

Abstract: An antenna device with an active area and a buffer element connected with the active area is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. A plurality of electrodes are disposed on the first substrate and in the active area. A modulation material is filled in the active area. A conductive layer is disposed on the second substrate and in the active area and the buffer element, and comprises a plurality of slits in the active area. A plurality of spacers are disposed between the first substrate and the second substrate, wherein at least one of the plurality of spacers is located in the buffer element, and wherein the buffer element is configured to provide a space for adjusting the amount of the modulation material in the active area.

Abstract: A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding an electronic component to the substrate, wherein the electronic component is mainly driven by a reverse bias in an operating mode, and the electronic component is electrically connected in series with another electronic component; applying a forward bias to the electronic component, and determining whether the electronic component is normal or failed based on a light emitted by the another electronic component or thermal characteristics of the electronic component; and transporting the substrate configured with the electronic component determined to be normal to a next production site or repairing the electronic component determined to be failed.

Abstract: An electronic device is provided. The electronic device includes a tunable circuit. The tunable circuit includes a first substrate, a tunable component, a first signal terminal, a second signal terminal, a first control terminal, and a second control terminal. The tunable component includes a first terminal and a second terminal. The first signal terminal is coupled to the first terminal of the tunable component. The second signal terminal is coupled to the second terminal of the tunable component. The first control terminal is coupled to the first terminal of the tunable component. The second control terminal is coupled to the second terminal of the tunable component. At least a portion of the tunable circuit is formed on the first substrate.

Abstract: An electronic device is provided. The electronic device includes a tunable circuit and a driver circuit. The tunable circuit includes a first control terminal and a second control terminal. The driver circuit includes a first driver and a second driver. The first driver is coupled to the first control terminal of the tunable circuit. The second driver is coupled to the second control terminal of the tunable circuit.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

Abstract: A head-up display system for a vehicle is provided. The vehicle has a windshield, a vehicle front and a vehicle rear. The head-up display system includes a first image generation device and an optical element. The first image generation device is configured to provide a first light. The optical element is configured to adjust a transmission direction of the first light. The vehicle front and the vehicle rear are connected along a first direction. Along a second direction perpendicular to the first direction, a first headlight and a second headlight are configured along the second direction and at the vehicle front. A minimum distance between the first headlight and a driver seat is less than a minimum distance between the second headlight and the driver seat. A distance between the first image generation device and the second headlight is different from a distance between the first image generation device and the first headlight.