Abstract: A display device is provided. The display device includes a substrate and a light shielding layer disposed on the substrate and defining a plurality of openings. The display device includes a first light filter layer disposed in one of the plurality of openings. The display device includes a plurality of light-emitting diodes disposed on the substrate. The display device also includes a material layer disposed between the plurality of openings and the plurality of light-emitting diodes. The material layer overlaps with at least two of the plurality of light-emitting diodes, and the material layer includes silicon oxide material or oxygen-containing material.

Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units, and a protective layer. The light-emitting units are electrically connected to the driving substrate. The protective layer covers the light-emitting units, and the protective layer has a Young's modulus less than or equal to 20 MPa.

Abstract: An electronic device is provided. The electronic device includes a substrate; a plurality of inorganic light-emitting diodes disposed on the substrate; a connecting line disposed on the substrate; and a printed circuit board. The plurality of inorganic light-emitting diodes are electrically connected to the printed circuit board through the connecting line. The connecting line includes a first part extending in a first direction and a second part extending in a second direction, and the first direction is different from the second direction. The first part has a first width along the second direction, the second part has a second width along the first direction, and the first width and the second width are different.

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

Abstract: An operation method of an electronic device for sensing an optical signal is provided. The electronic device includes a plurality of optical sensors and a plurality of light-emitting elements disposed adjacent to the plurality of optical sensors. The operation method of the electronic device for sensing the optical signal includes the following steps. The optical signal is provided to a first optical sensor of the plurality of optical sensors. The first optical sensor outputs a driving signal when dimming the plurality of light-emitting elements adjacent to the first optical sensor. Therefore, the accuracy of sensing the optical signal may be effectively increased.

Abstract: A backlight module includes a substrate, light-emitting elements, circuit elements and a reflective sheet. The light-emitting elements are bonded onto the substrate. The circuit elements are bonded onto the substrate and electrically connected to the light-emitting elements. At least four of the light-emitting elements are disposed around one of the circuit elements. The reflective sheet is disposed on the substrate and has first openings exposing the light-emitting elements and protrusions. The protrusions corresponds to the circuit elements and cover the circuit elements. One of the protrusions has an opening formed of two crossing slits. Extending directions of the two crossing slits do not cross the at least four of the light-emitting elements. The one of the protrusions corresponds to the one of the circuit elements. The at least four of the light-emitting elements are closer to the one of the circuit elements than other of the light-emitting elements.

Abstract: An electronic device is disclosed. The electronic device includes a panel, a defect in and/or on the panel and an optical film above the panel. The panel includes a first substrate, a second substrate disposed opposite to the first substrate, and a plurality of display units disposed on the first substrate. There is a defect between the first substrate and the second substrate, or on the second substrate. In a top view of the electronic device, an optical film has a first processed area corresponding to the defect, and the first processed area at least partially overlaps at least two display units.

Abstract: A display device is provided. The display device includes a substrate and a plurality of pixels disposed on the substrate. One of the pixels includes a first light filter layer. The display device also includes a first light shielding layer, a second light shielding layer, and a plurality of light emitting diodes. The first light shielding layer defines a plurality of openings, wherein the first light filter layer is disposed in one of the openings. The second light shielding layer is disposed on the substrate and at least partially overlapped with the first light shielding layer. The second light shielding layer defines another plurality of openings, and the light emitting diodes are disposed in the another plurality of openings. In a direction parallel to an upper surface of the substrate, the second light shielding layer overlaps the plurality of light emitting diodes.

Abstract: A control method applied in a display device is provided. The display device includes an image generator and a screen. The image generator is directed to output an output image. The screen is directed to operate in a first operation mode or a second operation mode. The screen has a first light-transmittance in the first operation mode and has a second light-transmittance in the second operation mode. The first light-transmittance is different from the second light-transmittance. In response to the screen operating in the first operation mode or the second operation mode, the image generator outputs the output image onto the screen in a light-emitting period and stops outputting the output image onto the screen in a non-light-emitting period after the light-emitting period.

Abstract: An electronic device including a substrate, a thin film transistor, a micro pump, and a micro fluid platform is provided. The thin film transistor is disposed on the substrate. The micro pump is disposed on the substrate and electrically connected to the thin film transistor. The micro fluid platform is disposed on the substrate and coupled to the micro pump. The micro pump is configured to travel a to-be-test sample to the micro fluid platform.

Abstract: An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a connector, an electronic component, and a heat sink. The connector has at least one conductive structure and at least one first heat dissipation structure. The at least one conductive structure and the at least one first heat dissipation structure are physically separated and electrically insulated from each other. The electronic component is electrically connected to the at least one conductive structure. The heat sink is connected to the at least one first heat dissipation structure. The heat sink and the electronic component are disposed on opposite sides of the connector.

Abstract: An electronic device is provided. The electronic device includes a substrate; a plurality of first light-emitting elements disposed in a first area of the substrate; a plurality of second light-emitting elements disposed in a second area of the substrate; a first power line disposed on the substrate and electrically connected to the plurality of first light-emitting elements; a second power line disposed on the substrate and electrically connected to the plurality of second light-emitting elements; a first circuit connecting element electrically connected to the first power line; and a first power supply element electrically connected to the first circuit connecting element. A projection of the first area on the substrate does not overlap a projection of the second area on the substrate, and the first area is closer to the first circuit connecting element than the second area.

Abstract: A method for manufacturing a liquid-crystal antenna device is provided. The method includes step (a) providing a first mother substrate. The first mother substrate includes a first region and a second region. The first region has a plurality of first sides. An extension line of at least one of the first sides divides the second region into a first part and a second part. The method also includes the following steps: (b) forming a first electrode layer on the first region and the second region, and (c) cutting the first mother substrate along the first sides of the first region.

Abstract: An electronic device includes an electronic module, a protective substrate on the electronic module, and a functional layer on the protective substrate. The functional layer has a hardness in a range of 4H to 9H. A manufacturing method of the electronic device comprises providing a protective substrate having a first surface and a second surface opposite to the first surface; forming a preparatory layer on the first surface; performing a heat treatment to convert the preparatory layer to a functional layer; and disposing an electronic module on the second surface, wherein the heat treatment is performed in a range of 200° C. to 1200° C.

Abstract: An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.

Abstract: An electronic device including a connection element is provided. The connection element includes a first metal layer, a first insulation layer, and a second insulation layer. The first insulation layer is disposed on the first metal layer and has a first hole and a second hole. The second insulation layer is disposed on the first insulation layer. The first hole exposes a portion of the first metal layer, and the second insulation layer extends into the second hole. A method of fabricating an electronic device is also provided.

Abstract: A display device for displaying image information including an image generator circuit and a photo-switchable screen is provided. The image generator circuit outputs an output image. The photo-switchable screen operates in a first operation mode or a second operation mode. In response to the photo-switchable screen operating in the first operation mode, the photo-switchable screen has a first light-transmittance, and the photo-switchable screen generates the image information according to the output image. In response to the photo-switchable screen operating in the second operation mode, the photo-switchable screen has a second light-transmittance. The first light-transmittance is less than the second light-transmittance.