Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: A signal connector positioning structure comprises a connector, a connecting component, a conductive connecting component, and a insulating component; the connector has a first opening, a second opening, and a first fixing structure; the connecting component has a first connection port and a first fixing component; the conductive connecting component has an opening; the insulating component has an opening; the conductive connecting component penetrates through the insulating component; wherein, the first fixing structure and the first fixing component are removably fastened in a screwed manner.

Abstract: A signal connector positioning structure comprises a connector, a connecting component, a conductive connecting component, and a insulating component; the connector has a first opening, a second opening, and a first fixing structure; the connecting component has a first connection port and a first fixing component; the conductive connecting component has an opening; the insulating component has an opening; the conductive connecting component penetrates through the insulating component; wherein, the first fixing structure and the first fixing component are removably fastened in a screwed manner.

Abstract: An improved hidden positioning fastener is provided for use with wood or simulated-wood (plastic) structural components. The hidden positioning fastener includes a separation plate and a plurality of positioning sections which extend in opposite directions from the front and rear sides of the separation plate and are alternately arranged along the periphery of the separation plate. The positioning sections are configured to be driven into predetermined portions of two adjacent structural components to be connected by the hidden positioning fastener. The lengths of the positioning sections can be designed according to the internal stress and allowable tension of the structural components. Moreover, guide holes can be formed in the structural components so that the structural components can be fixed in position rapidly.

Abstract: A filtration separation method for waste resin containing highly radioactive uranium powder and device thereof is mainly used for the waste resin after water treatment process in a nuclear facility. The uranium powder contained in the waste resin is highly radioactive. Thus, prior to the treatment of the waste resin, it is necessary to filter and separate the highly radioactive uranium powder to reduce the radioactivity. It is to put the uranium powder containing waste resin into an underwater holding tank and withdraw the waste resin by an underwater pump into a uranium powder filtration box. Then the uranium powder filtration box is lifted by a hoist to move to an underwater ultrasonic cleaner. High-pressure water flushing is applied and followed by underwater ultrasonic cleaning. Then the cleaning water (containing precipitated uranium powder) from the ultrasonic cleaner is drained to uranium powder collection device.

Abstract: A shock- and moisture-resistant connector assembly includes a first component, a second component, and an antenna. The first component has an end fitted with an adapter. A non-annular fastener is mounted around a connecting section of the adapter for tightly fastening the second component inserted in the first component. The second component is provided therein with at least one watertight O-ring which, after the first and second components are assembled, furnishes moisture and shock resistance to a coaxial cable passing through the second component. The antenna includes a dielectric spacer externally mounted with a coupling element and having an end formed as a shaft. A plastic washer, a wave washer, and a positioning washer are sequentially mounted around the shaft such that the entire assembled antenna has sufficient frictional resistance to maintain restrained displacement during a fine-tuning operation.

Abstract: A shock- and moisture-resistant connector assembly includes a first component, a second component, and an antenna. The first component has an end fitted with an adapter. A non-annular fastener is mounted around a connecting section of the adapter for tightly fastening the second component inserted in the first component. The second component is provided therein with at least one watertight O-ring which, after the first and second components are assembled, furnishes moisture and shock resistance to a coaxial cable passing through the second component. The antenna includes a dielectric spacer externally mounted with a coupling element and having an end formed as a shaft. A plastic washer, a wave washer, and a positioning washer are sequentially mounted around the shaft such that the entire assembled antenna has sufficient frictional resistance to maintain restrained displacement during a fine-tuning operation.

Abstract: A filtration separation method for waste resin containing highly radioactive uranium powder and device thereof is mainly used for the waste resin after water treatment process in a nuclear facility. The uranium powder contained in the waste resin is highly radioactive. Thus, prior to the treatment of the waste resin, it is necessary to filter and separate the highly radioactive uranium powder to reduce the radioactivity. It is to put the uranium powder containing waste resin into an underwater holding tank and withdraw the waste resin by an underwater pump into a uranium powder filtration box. Then the uranium powder filtration box is lifted by a hoist to move to an underwater ultrasonic cleaner. High-pressure water flushing is applied and followed by underwater ultrasonic cleaning. Then the cleaning water (containing precipitated uranium powder) from the ultrasonic cleaner is drained to uranium powder collection device.

Abstract: A high-frequency connector assembly includes a first connector having a conductive pin and formed with at least one slit at a receiving periphery thereof for allowing a second connector inlaid with an O-ring to be inserted therein. The pin in the first connecter can be received by a pin holder in the second connector. An expanded section at a rear portion of the second connector is received by an expanded section of the first connector. An annular groove formed adjacent to the expanded section on the second connector pressingly abuts against a contracted edge slope at an end of the receiving periphery of the first connector. The connector assembly facilitates mitigating attrition caused by frequent vibration and provides a damp-proof effect, thereby ensuring a desired transmission efficiency.

Abstract: A high frequency connector includes a first module and a second module for signal transmission. The two modules are easily manufactured and assembled. The disclosed high frequency connector can maneuverably connect with the connector thereof according to the required direction of signal transmission so that competent transmissive connection is achieved when the two modules are assembled and thus preventing generation of noise. The volume of each of the two modules is precisely designed so that the high frequency connector facilitates reduction in power loss when being implemented for the purpose of signal transmission.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: An adapter for high frequency signal transmission includes in one embodiment a cylinder having a staged bore; a central transmission rod including an intermediate toothed ring, first and second ports at both ends, and a tapered portion formed around the first port. A first block is fitted in one portion of the bore. A second block is fitted in another portion of the bore and includes a metal ring having a toothed member secured onto the second block. A vacuum is created by the block, the second block, the toothed ring, and the bore. In alternate embodiments, both the first and second ports are male ports, both the first and second ports are female ports, the first port is a female port and the second port is a male port, or the first port is a male port and the second port is a female port.

Abstract: A wire-bonding method and a semiconductor package using the same are provided. The semiconductor package includes a carrier; a chip mounted on the carrier; a plurality of first wires and second wires alternatively arranged in a stagger manner, with a wire loop of each second wire being downwardly bent to form a deformed portion so as to provide a height different between the wire loops of each first wire and each second wire, wherein the first and second wires electrically connect the chip to the carrier; and an encapsulant for encapsulating the chip, the first wires, the second wires and a portion of the carrier. The height difference between the wire loops of each first wire and each second wire increases a pitch between adjacent first and second wires thereby preventing the wires from contact and short circuit with each other due to wire sweep during an encapsulation process.

Abstract: An adapter for high frequency signal transmission includes in one embodiment a cylinder having a staged bore; a central transmission rod including an intermediate toothed ring, first and second ports at both ends, and a tapered portion formed around the first port; a first Teflon block fitted in one portion of the bore; and a second Teflon block fitted in another portion of the bore and including a metal ring having a toothed member secured onto the second Teflon block. A vacuum is created by the first Teflon block, the second Teflon block, the toothed ring, and the bore. Both the first and second ports are male ports, both the first and second ports are female ports, the first port is a female port and the second port is a male port, or the first port is a male port and the second port is a female port.

Abstract: A wire-bonding method and a semiconductor package using the same are provided. The semiconductor package includes a carrier; a chip mounted on the carrier; a plurality of first wires and second wires alternatively arranged in a stagger manner, with a wire loop of each second wire being downwardly bent to form a deformed portion so as to provide a height different between the wire loops of each first wire and each second wire, wherein the first and second wires electrically connect the chip to the carrier; and an encapsulant for encapsulating the chip, the first wires, the second wires and a portion of the carrier. The height difference between the wire loops of each first wire and each second wire increases a pitch between adjacent first and second wires thereby preventing the wires from contact and short circuit with each other due to wire sweep during an encapsulation process.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: A lead-frame-based semiconductor package and a fabrication method thereof are proposed. The semiconductor package includes: a lead frame having a plurality of first and second leads, wherein each first lead is formed with an extending portion smaller in thickness than the first lead in a manner that, an upper surface of the extending portion is flush with an upper surface of the first lead, and a lower surface of the extending portion forms a height difference with respect to a lower surface of the first lead; a chip mounted over the upper surfaces of the extending portions, and electrically connected to the leads by bonding wires; an encapsulant for encapsulating the upper surfaces of leads, upper surfaces of extending portions, chip and bonding wires; and a non-conductive material applied over the lower surfaces of extending portions, wherein the lower surfaces of leads are exposed to outside of the non-conductive material.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: A wire-bonding method and a semiconductor package using the same are provided. The semiconductor package includes a carrier; a chip mounted on the carrier; a plurality of first wires and second wires alternatively arranged in a stagger manner, with a wire loop of each second wire being downwardly bent to form a deformed portion so as to provide a height different between the wire loops of each first wire and each second wire, wherein the first and second wires electrically connect the chip to the carrier; and an encapsulant for encapsulating the chip, the first wires, the second wires and a portion of the carrier. The height difference between the wire loops of each first wire and each second wire increases a pitch between adjacent first and second wires thereby preventing the wires from contact and short circuit with each other due to wire sweep during an encapsulation process.

Abstract: A semiconductor package having a high quantity of input/output (I/O) connections and a fabrication method thereof are proposed. A lead frame having a plurality of leads, a die pad and at least one conductive member electrically isolated from the die pad and disposed between the die pad and leads, is provided for at least one semiconductor chip to be mounted on the die pad. The semiconductor chip is electrically connected to the leads and the at least one conductive member. An encapsulant is formed to encapsulate the semiconductor chip and a portion of the lead frame with bottom surfaces of the die pad and the at least one conductive member and a portion of the leads being exposed from the encapsulant. The at least one conductive member electrically separated from the die pad is used as an I/O connection for external connection between the semiconductor chip and external devices.