Patents by Inventor Chin-Yi Lin

Chin-Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11402407
    Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: August 2, 2022
    Assignee: MPI Corporation
    Inventors: Zhi-Wei Su, Tzung-Je Tzeng, Wen-Chi Chen, Huo-Kang Hsu, Hsueh-Chih Wu, Sheng-Wei Lin, Chin-Yi Lin, Che-Wei Lin, Jian-Kai Hong, Shu-Jui Chang
  • Patent number: 11382391
    Abstract: A method for locating critical control points on a part or combination of parts during a manufacturing process involves mating, directly or indirectly, a jig extension to the part or parts. A pattern on the jig extension defines an origin point that is used to track the position of the part or parts during manufacturing, such as during location-sensitive operations. The jig extension may be a shoe last extension which connects to a shoe or shoe component via a shoe last.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: July 12, 2022
    Assignee: NIKE, Inc.
    Inventors: Dragan Jurkovic, Ming-Feng Jean, Chin-Yi Lin, Chun-Chi Lin
  • Publication number: 20220214379
    Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
    Type: Application
    Filed: December 29, 2021
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, HSIN-CHENG HUNG
  • Publication number: 20220214380
    Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, KO-CHUN WU
  • Patent number: 11378946
    Abstract: Embodiments of the present invention provide a predictive maintenance method for a component of a production tool, in which a time series prediction (TSP) algorithm and an information criterion algorithm are adapted to build a TSP model, thereby forecasting the complicated future trend of accidental shutdown of the component of the production tool. In addition, an alarm scheme is provided for performing maintenance immediately when the component is very likely to enter a dead state, and a death related indicator (DCI) is provided for quantitatively showing the possibility of the component entering the dead state.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: July 5, 2022
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Chin-Yi Lin, Yu-Ming Hsieh, Fan-Tien Cheng, Hsien-Cheng Huang
  • Publication number: 20220170961
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
    Type: Application
    Filed: November 3, 2021
    Publication date: June 2, 2022
    Applicant: MPI Corporation
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Publication number: 20220123706
    Abstract: A common-mode noise filter is provided, and comprises a first transmission structure and a second transmission structure. At least one first transmission unit is connected between a first signal input end and a first signal output end of the first transmission structure in series. At least one second transmission unit is connected between a second signal input end and a second signal output end of the second transmission structure in series. Two first capacitors are connected between the first signal input end and the second signal input end in series, and connected at a first node together. A first common-mode noise suppression unit is connected between the first node and a reference potential, and comprises a second capacitor and a first lossy element connected to the second capacitor in series or parallel. The first common-mode noise suppression unit can absorb a common-mode noise via the first lossy element.
    Type: Application
    Filed: June 21, 2021
    Publication date: April 21, 2022
    Inventors: YANG-CHIH HUANG, YING-CHENG TSENG, CHIN-YI LIN
  • Publication number: 20220026861
    Abstract: A virtual metrology method using a convolutional neural network (CNN) is provided. In this method, a dynamic time warping (DTW) algorithm is used to delete unsimilar sets of process data, and adjust the sets of process data to be of the same length, thereby enabling the CNN to be used for virtual metrology. A virtual metrology model of the embodiments of the present invention includes several CNN models and a conjecture model, in which plural inputs of the CNN model are sets of time sequence data of respective parameters, and plural outputs of the CNN models are inputs to the conjecture model.
    Type: Application
    Filed: May 25, 2021
    Publication date: January 27, 2022
    Inventors: Fan-Tien CHENG, Yu-Ming HSIEH, Tan-Ju WANG, Li-Hsuan PENG, Chin-Yi LIN
  • Publication number: 20210373048
    Abstract: A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 2, 2021
    Applicant: MPI Corporation
    Inventors: TZU-YANG CHEN, CHIN-YI LIN, CHEN-RUI WU, SHENG-YU LIN, MING-TA HSU, CHIA-JU WEI
  • Publication number: 20210208126
    Abstract: A leather inspection apparatus is provided for detecting inconsistencies on both upper and lower surfaces of a hide. It includes a first camera assembly movably coupled to a support frame and capable of movement along the upper surface of the hide and a second camera assembly movably coupled to the support frame and capable of movement along the lower surface of the hide. A computing device is coupled to the first camera assembly and the second camera assembly, such that the first camera assembly detects the locations of inconsistencies in the upper surface of the hide and the second camera assembly detects the locations of inconsistencies in the lower surface of the hide. The computing device digitally stores the locations of the inconsistencies of the upper surface of the hide and the locations of the inconsistencies of the lower surface of the hide.
    Type: Application
    Filed: March 18, 2021
    Publication date: July 8, 2021
    Inventors: Ming-Ji Lee, Chin-Yi Lin, Chun-Yen Tseng
  • Publication number: 20210181237
    Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 17, 2021
    Inventors: Zhi-Wei SU, Tzung-Je TZENG, Wen-Chi CHEN, Huo-Kang HSU, Hsueh-Chih WU, Sheng-Wei LIN, Chin-Yi LIN, Che-Wei LIN, Jian-Kai HONG, Shu-Jui CHANG
  • Publication number: 20210136624
    Abstract: A wireless communication device is disclosed. The wireless communication device includes a processor, a transceiver coupled to the processor, and a memory coupled to the processor. The memory is configured to store a plurality of instructions and the plurality of instructions are executed by the processor to perform operations of storing, in the memory, a duplication of each of the plurality of packets transmitted by a streaming provider; and in response to a request of retransmission transmitted by a terminal device for a lost packet, determining whether the duplication of the lost packet is stored in the memory.
    Type: Application
    Filed: June 23, 2020
    Publication date: May 6, 2021
    Inventors: Ping-Ke Shih, Chin-Yi Lin, Yi-Shou Hsu
  • Patent number: 10998874
    Abstract: A noise suppressor includes a first differential-mode transmission module, a second differential-mode transmission module and a common-mode absorption module. The first and second differential-mode transmission modules are configured to receive a differential signal at one of the first and second differential-mode transmission modules, and output the differential signal at the other of the same. The common-mode absorption module is electrically connected to a reference node, and is configured to absorb common-mode noise of the differential signal from at least one of the first differential-mode transmission module or the second differential-mode transmission module.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: May 4, 2021
    Assignee: National Taiwan University
    Inventors: Tzong-Lin Wu, Chin-Yi Lin, Yang-Chih Huang
  • Patent number: 10955403
    Abstract: A leather inspection apparatus is provided for detecting inconsistencies on both upper and lower surfaces of a hide. It includes a first camera assembly movably coupled to a support frame and capable of movement along the upper surface of the hide and a second camera assembly movably coupled to the support frame and capable of movement along the lower surface of the hide. A computing device is coupled to the first camera assembly and the second camera assembly, such that the first camera assembly detects the locations of inconsistencies in the upper surface of the hide and the second camera assembly detects the locations of inconsistencies in the lower surface of the hide. The computing device digitally stores the locations of the inconsistencies of the upper surface of the hide and the locations of the inconsistencies of the lower surface of the hide.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: March 23, 2021
    Assignee: NIKE, INC.
    Inventors: Ming-Ji Lee, Chin-Yi Lin, Chun-Yen Tseng
  • Patent number: 10948903
    Abstract: Embodiments of the present disclosure provide a two-phase process for searching root causes of a yield loss in a production line. In a first phase, an interaction between two process tools, that between two parameters, or that between one process tool and one parameter that is likely to cause the yield loss is identified. In a second phase, a threshold of the parameter that is likely to cause the yield loss and is obtained from the first phase is identified. In each phase, two different algorithms can be used to generate a reliance index (RII) for gauging the reliance levels of their search results.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: March 16, 2021
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Chin-Yi Lin, Yu-Ming Hsieh, Fan-Tien Cheng
  • Publication number: 20200341459
    Abstract: Embodiments of the present invention provide a predictive maintenance method for a component of a production tool, in which a time series prediction (TSP) algorithm and an information criterion algorithm are adapted to build a TSP model, thereby forecasting the complicated future trend of accidental shutdown of the component of the production tool. In addition, an alarm scheme is provided for performing maintenance immediately when the component is very likely to enter a dead state, and a death related indicator (DCI) is provided for quantitatively showing the possibility of the component entering the dead state.
    Type: Application
    Filed: April 24, 2020
    Publication date: October 29, 2020
    Inventors: Chin-Yi LIN, Yu-Ming HSIEH, Fan-Tien CHENG, Hsien-Cheng HUANG
  • Publication number: 20200309819
    Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
    Type: Application
    Filed: March 18, 2020
    Publication date: October 1, 2020
    Applicant: MPI Corporation
    Inventors: Che-Wei Lin, Ting-Ju Wu, Keng-Min Su, Chin-Yi Lin
  • Patent number: 10524544
    Abstract: Systems and methods are provided for collecting three-dimensional surface data of a lasted shoe upper that is mated with a sole that is configured for the lasted upper. The mated three-dimensional data is used with three-dimensional data of the lasted shoe upper in an unmated configuration with the sole to determine a location of an edge defined by the intersection of the lasted upper and the sole when mated. The bite line identifies an edge where the upper and a sole assembly will intersect on a finished shoe, which may represent a bounding line for application of adhesive to the lasted upper for boding the sole thereto.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: January 7, 2020
    Assignee: Nike, Inc.
    Inventors: Dragan Jurkovic, Ming-Feng Jean, Chih-Chi Chang, Chin-Yi Lin
  • Publication number: 20190360992
    Abstract: A leather inspection apparatus is provided for detecting inconsistencies on both upper and lower surfaces of a hide. It includes a first camera assembly movably coupled to a support frame and capable of movement along the upper surface of the hide and a second camera assembly movably coupled to the support frame and capable of movement along the lower surface of the hide. A computing device is coupled to the first camera assembly and the second camera assembly, such that the first camera assembly detects the locations of inconsistencies in the upper surface of the hide and the second camera assembly detects the locations of inconsistencies in the lower surface of the hide. The computing device digitally stores the locations of the inconsistencies of the upper surface of the hide and the locations of the inconsistencies of the lower surface of the hide.
    Type: Application
    Filed: May 21, 2019
    Publication date: November 28, 2019
    Inventors: Ming-Ji Lee, Chin-Yi Lin, Chun-Yen Tseng
  • Publication number: 20190354094
    Abstract: Embodiments of the present disclosure provide a two-phase process for searching root causes of a yield loss in a production line. In a first phase, an interaction between two process tools, that between two parameters, or that between one process tool and one parameter that is likely to cause the yield loss is identified. In a second phase, a threshold of the parameter that is likely to cause the yield loss and is obtained from the first phase is identified. In each phase, two different algorithms can be used to generate a reliance index (RII) for gauging the reliance levels of their search results.
    Type: Application
    Filed: December 14, 2018
    Publication date: November 21, 2019
    Inventors: Chin-Yi LIN, Yu-Ming HSIEH, Fan-Tien CHENG