Patents by Inventor Chin-Yi Lin

Chin-Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240118316
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Applicant: MPI Corporation
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Publication number: 20240096731
    Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
  • Patent number: 11921474
    Abstract: A virtual metrology method using a convolutional neural network (CNN) is provided. In this method, a dynamic time warping (DTW) algorithm is used to delete unsimilar sets of process data, and adjust the sets of process data to be of the same length, thereby enabling the CNN to be used for virtual metrology. A virtual metrology model of the embodiments of the present invention includes several CNN models and a conjecture model, in which plural inputs of the CNN model are sets of time sequence data of respective parameters, and plural outputs of the CNN models are inputs to the conjecture model.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: March 5, 2024
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Fan-Tien Cheng, Yu-Ming Hsieh, Tan-Ju Wang, Li-Hsuan Peng, Chin-Yi Lin
  • Publication number: 20240065386
    Abstract: A method for locating critical control points on a part or combination of parts during a manufacturing process involves mating, directly or indirectly, a jig extension to the part or parts. A pattern on the jig extension defines an origin point that is used to track the position of the part or parts during manufacturing, such as during location-sensitive operations. The jig extension may be a shoe last extension which connects to a shoe or shoe component via a shoe last.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: Dragan Jurkovic, Ming-Feng Jean, Chin-Yi Lin, Chun-Chi Lin
  • Publication number: 20240070416
    Abstract: A reading method and a reading device for a two-dimensional code. The method includes: capturing a two-dimensional code image through an image capturing device; detecting an outer frame and a position mark of a two-dimensional code in a skewed state in the two-dimensional code image; restoring the two-dimensional code in the skewed state to a default state; and performing a default operation according to the two-dimensional code in the default state.
    Type: Application
    Filed: November 15, 2022
    Publication date: February 29, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chin-Hao Yeh, Chin-Wen Lin, Hung-Yi Lin
  • Patent number: 11874313
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: January 16, 2024
    Assignee: MPI CORPORATION
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Publication number: 20230419107
    Abstract: A virtual metrology method based on convolutional autoencoder and transfer learning includes performing a data alignment operation, a modeling operation and a calculating operation. The data alignment operation includes performing a data-length adjusting operation onto a plurality of sets of process data. The modeling operation includes classifying paired data and unpaired process data; creating a pre-trained model by using the unpaired process data, and then inputting the paired data to the pre-trained model to create a virtual metrology model based on convolutional autoencoder. The virtual metrology model based on convolutional autoencoder includes at least one convolutional neural network model. In addition, the calculating operation includes executing one of a predicting step and a transfer learning step according to whether the actual metrology data is obtained, thereby calculating one of a phase-one virtual metrology value and a phase-two virtual metrology value.
    Type: Application
    Filed: December 8, 2022
    Publication date: December 28, 2023
    Inventors: Fan-Tien CHENG, Yu-Ming HSIEH, Yueh-Feng TSAI, Chin-Yi LIN
  • Patent number: 11844403
    Abstract: A method for locating critical control points on a part or combination of parts during a manufacturing process involves mating, directly or indirectly, a jig extension to the part or parts. A pattern on the jig extension defines an origin point that is used to track the position of the part or parts during manufacturing, such as during location-sensitive operations. The jig extension may be a shoe last extension which connects to a shoe or shoe component via a shoe last.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: December 19, 2023
    Assignee: NIKE, Inc.
    Inventors: Dragan Jurkovic, Ming-Feng Jean, Chin-Yi Lin, Chun-Chi Lin
  • Publication number: 20230361027
    Abstract: A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.
    Type: Application
    Filed: August 12, 2022
    Publication date: November 9, 2023
    Inventors: Chin-Yi Lin, Jie Chen, Sheng-Han Tsai, Yuan Sheng Chiu, Chou-Jui Hsu, Yu Kuei Yeh, Tsung-Shu Lin
  • Publication number: 20230292009
    Abstract: A display device includes a display module and a camera module. The camera module includes a first housing, a second housing and a camera unit. The first housing is movably disposed on the display module. The second housing is separably connected to the first housing. The camera unit is disposed on the second housing. The second housing is able to move with the first housing in relative to the display module, such that the camera unit is exposed from the display module or hidden in the display module. When the second housing is separated from the first housing, the second housing is able to rotate in relative to the first housing, so as to adjust an orientation of the camera unit.
    Type: Application
    Filed: June 15, 2022
    Publication date: September 14, 2023
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Chien-Chang Chen, Chin-Yi Lin, Chia-Chen Chen, Chi-Zen Peng
  • Patent number: 11733267
    Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: August 22, 2023
    Assignee: MPI CORPORATION
    Inventors: Che-Wei Lin, Ting-Ju Wu, Keng-Min Su, Chin-Yi Lin
  • Patent number: 11668694
    Abstract: A leather inspection apparatus is provided for detecting inconsistencies on both upper and lower surfaces of a hide. It includes a first camera assembly movably coupled to a support frame and capable of movement along the upper surface of the hide and a second camera assembly movably coupled to the support frame and capable of movement along the lower surface of the hide. A computing device is coupled to the first camera assembly and the second camera assembly, such that the first camera assembly detects the locations of inconsistencies in the upper surface of the hide and the second camera assembly detects the locations of inconsistencies in the lower surface of the hide. The computing device digitally stores the locations of the inconsistencies of the upper surface of the hide and the locations of the inconsistencies of the lower surface of the hide.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: June 6, 2023
    Assignee: NIKE, Inc.
    Inventors: Ming-Ji Lee, Chin-Yi Lin, Chun-Yen Tseng
  • Publication number: 20230153846
    Abstract: A golden path search method for manufacturing process provides a two-phase process to search for a golden path. A first phase step of the two-phase process includes preparing a search model based on a search algorithm, and selecting a plurality of key process stages of a plurality of process stages by feeding sets of final inspection values and the production paths of the workpieces into the searching model, and then generating a plurality of key paths according to the key process stages. A second phase step of the two-phase process includes building a plurality of prediction models of the key paths according to the production paths and the sets of final inspection values, and predicting a plurality of yield rates corresponding to the key paths according to the prediction models, and then searching for the golden path of the key paths according to the yield rates.
    Type: Application
    Filed: October 23, 2022
    Publication date: May 18, 2023
    Inventors: Chin-Yi LIN, Fan-Tien CHENG, Ching-Kang ING, Yu-Ming HSIEH, Po-Hsiang PENG
  • Patent number: 11619656
    Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: April 4, 2023
    Assignee: MPI CORPORATION
    Inventors: Chin-Yi Lin, Keng-Min Su, Che-Wei Lin, Hsin-Cheng Hung
  • Patent number: 11522643
    Abstract: A wireless communication device is disclosed. The wireless communication device includes a processor, a transceiver coupled to the processor, and a memory coupled to the processor. The memory is configured to store a plurality of instructions and the plurality of instructions are executed by the processor to perform operations of storing, in the memory, a duplication of each of the plurality of packets transmitted by a streaming provider; and in response to a request of retransmission transmitted by a terminal device for a lost packet, determining whether the duplication of the lost packet is stored in the memory.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: December 6, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Ping-Ke Shih, Chin-Yi Lin, Yi-Shou Hsu
  • Patent number: 11509278
    Abstract: A common-mode noise filter is provided, and comprises a first transmission structure and a second transmission structure. At least one first transmission unit is connected between a first signal input end and a first signal output end of the first transmission structure in series. At least one second transmission unit is connected between a second signal input end and a second signal output end of the second transmission structure in series. Two first capacitors are connected between the first signal input end and the second signal input end in series, and connected at a first node together. A first common-mode noise suppression unit is connected between the first node and a reference potential, and comprises a second capacitor and a first lossy element connected to the second capacitor in series or parallel. The first common-mode noise suppression unit can absorb a common-mode noise via the first lossy element.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: November 22, 2022
    Assignee: Empass Technology Inc.
    Inventors: Yang-Chih Huang, Ying-Cheng Tseng, Chin-Yi Lin
  • Patent number: 11493536
    Abstract: A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: November 8, 2022
    Assignee: MPI CORPORATION
    Inventors: Tzu-Yang Chen, Chin-Yi Lin, Chen-Rui Wu, Sheng-Yu Lin, Ming-Ta Hsu, Chia-Ju Wei
  • Publication number: 20220287415
    Abstract: A method for locating critical control points on a part or combination of parts during a manufacturing process involves mating, directly or indirectly, a jig extension to the part or parts. A pattern on the jig extension defines an origin point that is used to track the position of the part or parts during manufacturing, such as during location-sensitive operations. The jig extension may be a shoe last extension which connects to a shoe or shoe component via a shoe last.
    Type: Application
    Filed: June 3, 2022
    Publication date: September 15, 2022
    Inventors: Dragan Jurkovic, Ming-Feng Jean, Chin-Yi Lin, Chun-Chi Lin
  • Publication number: 20220291675
    Abstract: Embodiments of the present invention provide a multiple-variable predictive maintenance method for a component of a production tool and a computer program product thereof, in which a multiple-variable time series prediction (TSPMVA) and an information criterion algorithm are adapted to build a best vector autoregression model (VAR), thereby forecasting the complicated future trend of accidental shutdown of the component of the production tool. Therefore, the multiple-variable prediction of the present invention can improve the accuracy of prediction compared with the single-variable prediction.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 15, 2022
    Inventors: Chin-Yi LIN, Yu-Ming HSIEH, Fan-Tien CHENG, Hsien-Cheng HUANG
  • Patent number: 11402407
    Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: August 2, 2022
    Assignee: MPI Corporation
    Inventors: Zhi-Wei Su, Tzung-Je Tzeng, Wen-Chi Chen, Huo-Kang Hsu, Hsueh-Chih Wu, Sheng-Wei Lin, Chin-Yi Lin, Che-Wei Lin, Jian-Kai Hong, Shu-Jui Chang