Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.

Abstract: An optical inspection device includes a circuit board having at least one first opening, a mounting plate disposed on a top or bottom surface of the circuit board and having at least one second opening corresponding to the at least one first opening respectively, at least one lens holder received in the at least one second opening, and at least one probe module disposed on a bottom surface of the mounting plate or the bottom surface of the circuit board, corresponding to the at least one lens holder respectively, and having probes electrically connected with the circuit board. Each lens holder has an accommodation for accommodating a lens, and is operatable to do a position adjusting motion in the corresponding second opening.

Abstract: A massager having a massaging head and a handle, the handle being arch-shaped having two ends connected to the massaging head with massaging function, characterized in that the massaging face at the bottom section of the massaging head is provided with a vibration beating section, rollers, radiation section and low frequency conducting head, the interior of the massaging head has a motor via a reciprocation device which is connected to an impaction base seat having protrusions so as to form the vibration beating section.

Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.

Abstract: A massager having a massaging head and a camshaft, the camshaft being arch-shaped having two ends connected to the massaging head with massaging function, characterized in that the massaging face at the bottom section of the massaging head is provided with a heating section, rollers, radiation section and low frequency conducting head, the interior of the massaging head has a motor via a reciprocation device which is connected to an impaction base seat having protrusions so as to form a vibration beating section.

Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.