Abstract: An electronic includes an electronic element, an encapsulation layer surrounding the electronic element, a first circuit structure, a second circuit structure and a connecting structure. The encapsulation layer has a top surface, a bottom surface and an opening, wherein a sidewall of the opening connects the top surface and the bottom surface. The first circuit structure is disposed at the top surface of the encapsulation layer. The second circuit structure is disposed at the bottom surface of the encapsulation layer. The connecting structure is disposed in the opening, wherein the electronic element is electrically connected to the second circuit structure through the first circuit structure and the connecting structure. The connecting structure includes a first sub layer and a second sub layer, the first sub layer is located between the encapsulation layer and the second sub layer, and the first sub layer covers the sidewall of the opening.

Abstract: A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support disk is annular and surrounds the wafer spin chuck, can act relative to the wafer spin chuck to a wafer support position or a wafer disengagement position, and includes a soaking trough. The wafer support disk at the wafer support position can support a wafer such that the wafer is soaked in processing liquid injected in the soaking trough for implementing a high efficient cleaning or etching process.

Abstract: A gardening sprayer has a main body, an adjusting valve and an output unit. Both ends of the main body are respectively provided with an input portion and an output portion, a flow channel is provided between the input portion and the output portion, and a flow channel is connected between the input portion and the output portion through the periphery of the main body and is connected with the flow channel with a flow control aperture, so that the flow control aperture provides the adjusting valve for installation. The adjusting valve has a shaft bolt and a positioning sleeve which are put into the flow control aperture from two directions and then docked. Both of the shaft bolt and the positioning sleeve are provided with at least a sealing washer, and a blocking portion and the passing portion with a smaller diameter are formed on the shaft bolt.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: In a method of forming a pattern, a first pattern is formed over an underlying layer, the first pattern including main patterns and a lateral protrusion having a thickness of less than 25% of a thickness of the main patterns, a hard mask layer is formed over the first pattern, a planarization operation is performed to expose the first pattern without exposing the lateral protrusion, a hard mask pattern is formed by removing the first pattern while the lateral protrusion being covered by the hard mask layer, and the underlying layer is patterned using the hard mask pattern as an etching mask.

Abstract: A method for identifying video signal source is provided. The method includes the following steps. A first identification code is assigned to a first transmitter device by a receiver control unit of a receiver device. A first video data is transmitted by the first transmitter device. The first video data and a first identification image corresponding to the first identification code are combined as a first combined video data by the receiver control unit. The first combined video data is outputted to a display device by the receiver control unit.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: A method includes, at a controller, sensing a magnitude of a first force applied to the thumbstick in a substantially downward direction relative to a top portion of the housing while the thumbstick is in the stationary default position, and a magnitude of a second force applied to the thumbstick in the substantially downward direction relative to the top portion of the housing while the thumbstick is in a position other than the stationary default position. The method includes receiving the magnitude of the first and the second force, and determining whether the magnitude of the first force or the second force satisfies a predefined force value. The method further includes providing haptic feedback to the user in response to a determination that the magnitude of the first force or the second force satisfies the predefined force value.

Abstract: A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.

Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.

Abstract: A method of forming an electrorheological fluid structure with attached conductor and method of fabrication. A polymeric housing may have a channel defined therein. A first conductive trace may at least partially coincide with the channel. A first wire may have a first conductor surrounded by a first insulating jacket. The first conductor may be in electrical communication with the first conductive trace. A jacket bonding region of the first jacket may be welded to a housing bonding region of the housing. The jacket bonding region and the housing bonding region may be formed from a common type of polymer.

Abstract: An infrared lamp tube heat dissipation automatic control system, wherein, according to the temperature of the coolant in lamp tube and the value provided by the flow rate sensor, the controller calculates the optimal flow rate of the coolant in a proportional mode that the higher the temperature, the faster the flow rate, and then control the flow rate by the flow control valve, so as to achieve predetermined coolant temperature and perform contact heat dissipation to the halogen bulb, thus solving the problem of the non-contact heat dissipation of halogen bulb of the prior art that cannot achieve the predetermined heat dissipation effect and resulting in the easy damage of halogen bulb; and further improves the product reliability and the service life. Furthermore, the leakproof structure of the lamp holder achieves a completely leakproof function, thereby enhancing product safety.

Abstract: A leakproof structure of the lamp holder, combined with an installation hole, which can ensure that the coolant in the accommodation space does not leak out; moreover, the lower part of the halogen bulb is covered by the waterproof plug in a tight state, so as to achieve a complete leakproof structure. Therefore, according to the temperature of the coolant, the automatic control system calculate the optimal flow rate of the coolant in a proportional mode that the higher the temperature, the faster the flow rate, so as to achieve the most effective mode of heat dissipation, then perform contact heat dissipation to the halogen bulb to solve the problem of the non-contact heat dissipation of halogen bulb of the prior art that cannot achieve the predetermined heat dissipation effect and resulting in the easy damage of halogen bulb; and further improves the product reliability and the service life.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: A three dimensional Integrated Circuit (IC) Power Grid (PG) may be provided. The three dimensional IC PG may comprise a first IC die, a second IC die, an interface, and a power distribution structure. The interface may be disposed between the first IC die and the second IC die. The power distribution structure may be connected to the interface. The power distribution structure may comprise at least one Through-Silicon Vias (TSV) and a ladder structure connected to at least one TSV.

Abstract: An oscillating signal adjusting circuit is provided. The oscillating signal adjusting circuit is adapted to generate an internal clock signal of a touch and display driver integrated circuit and includes a frequency shift circuit and a spread spectrum control circuit. The frequency shift circuit acquires a first setting data indicated by a mode control signal, and determines whether to shift a frequency of the input clock signal according to the first setting data to generate a first output clock signal. The spread spectrum control circuit to acquires a second setting data indicated by the mode control signal, and determines whether to perform a spreading spectrum operation on the first output clock signal according to the second setting data to generate the internal clock signal. The mode control signal has a first voltage level in a display period and has a second voltage level in a touch sensing period.

Abstract: An image positioning device is provided in the invention. The image positioning device includes a calculation circuit and a positioning circuit. The calculation circuit obtains a plurality of images from an image capturing device and classifies the images into a plurality of main groups based on a first algorithm, wherein each main group corresponds to a different area and the calculation circuit classifies the images of each main group into a plurality of sub-groups based on a feature of each image of each main group and a clustering algorithm. The positioning circuit is coupled to the calculation circuit. The positioning circuit positions each sub-group in the area corresponding to each main group based on the relative position relationship between each sub-group of each main group.