Abstract: A method (of manufacturing fins for a semiconductor device) includes: forming semiconductor fins including ones thereof having a first cap with a first etch sensitivity (first capped fins) and second ones thereof having a second cap with a second etch sensitivity (second capped fins), the first and second etch sensitivities being different; and eliminating selected ones of the first capped fins and selected ones of the second capped fins.

Abstract: A water valve has a main body and at least two control valve sets. The main body has an upper cover and a base, the upper cover and the base correspondingly form an enclosed space and are locked with screws. The main body further has an input portion, two controlling portions and a containing chamber. The input portion connects to a water source, each controlling portion has a controlling chamber located in the main body and an outputting space. Each controlling chamber has a through aperture on a side connected to the containing chamber. Each of the control valve sets has a control valve with a knob, the knob has an extending valve tube configured to sleeve onto the controlling chamber of the controlling portion, and the knob is exposed from the main body; each valve tube further has a through hole capable of being aligned with the through aperture.

Abstract: A method of verifying an integrated circuit stack includes adding a dummy layer to a contact pad of a functional circuit, wherein a location of the dummy layer is determined based on a location of a contact pad of a connecting substrate. The method further includes converting the dummy layer location to the connecting substrate. The method further includes performing a layout versus schematic (LVS) check of the connecting substrate including the dummy layer in response to a determination that the dummy layer is aligned with the contact pad of the connecting substrate.

Abstract: An article may include a first polymeric material layer having a surface. A first conductive trace may form at least a portion of the first layer surface. The article may further include a second polymeric material layer. The second layer may have a first surface, a portion of the second layer first surface being bonded to a portion of the first layer surface. The second layer may have a portion of a channel defined therein, the channel at least partially coinciding with a portion of the first conductive trace. The article may also include a first patch interposed between the first layer surface and the second layer first surface. The first patch may span the channel and cover a portion of the first conductive trace.

Abstract: A water sprayer comprising: a main body, a guiding lid, at least one first output nozzle, at least one second nozzle and an output head. The types and rotation sequence of the first nozzle and the second nozzle can be replaced or changed by consumers, so that the water sprayer can be used more easily. Also, when the first nozzle and the second nozzle are damaged or blocked, only the first nozzle or the second nozzle needs to be replaced separately, which is more economical and environmentally friendly.

Abstract: The invention provides an input device including a holder, a first wheel, a slider, and a first pressure part. The first wheel is disposed on the holder, and includes a side surface, a circle center, and a segment adjusting structure. The segment adjusting structure is disposed on the side surface in a manner of surrounding the circle center. The slider is disposed on the holder, and is movable relative to the holder to move toward or away from the circle center. The first pressure part includes two first ends. One of the first ends is connected to the slider, and as the slider moves toward or away from the circle center, interference between the other first end and the segment adjusting structure is increased or reduced.

Abstract: The present invention relates to a temperature control system, a temperature control method and an image sensor-testing apparatus having the system. The temperature control method mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

Abstract: In an embodiment, a method (of manufacturing fins for a semiconductor device) includes: forming a first layer (on a semiconductor substrate) that has first spacers and etch stop layer (ESL) portions which are interspersed; forming second spacers on central regions of the first spacers and the ESL portions; removing exposed regions of the first spacers and the ESL portions and corresponding underlying portions of the semiconductor substrate; removing the second spacers resulting in corresponding first capped semiconductor fins and second capped semiconductor fins that are organized into first and second sets; each member of the first set having a first cap with a first etch sensitivity; and each member of the second set having a second cap with a different second etch sensitivity; and eliminating selected ones of the first capped semiconductor fins and selected ones of the second capped semiconductor fins.

Abstract: An article may include a first polymeric material layer having a surface. A first conductive trace may form at least a portion of the first layer surface. The article may further include a second polymeric material layer. The second layer may have a first surface, a portion of the second layer first surface being bonded to a portion of the first layer surface. The second layer may have a portion of a channel defined therein, the channel at least partially coinciding with a portion of the first conductive trace. The article may also include a first patch interposed between the first layer surface and the second layer first surface. The first patch may span the channel and cover a portion of the first conductive trace.

Abstract: The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

Abstract: A switchable water-saving valve including a water inlet substrate formed as an annular body which has a housing and a water inlet portion. The water inlet portion is fixedly arranged within the housing and has a water inlet and a water outlet extending therethrough. A flow channel substrate is fixedly arranged within the housing below the water inlet portion. Guide holes are formed circumferentially at intervals on the flow channel substrate and extend therethrough and are in fluid communication with the water outlet. A switch holder is rotatably positioned below the flow channel substrate. First and second pluralities of water flow holes are arranged circumferentially in the top surface of the switch holder and penetrate the top surface. Water outlet holes are formed on the bottom surface of an aerator holder and are in fluid communication with the first water flow holes.

Abstract: Herein disclosed are a method and a test probe for testing an electrical component. The electrical component comprises at least a first electrode and a second electrode. The method comprises the following steps: covering the first electrode with a first conducting flexible layer; driving a first electrode contact to electrically connect a first end of the first electrode contact with the first electrode via the first conducting flexible layer; covering the second electrode with a second conducting flexible layer; and driving a second electrode contact to electrically connect a second end of the second electrode contact with the second electrode via the second conducting flexible layer. The first conducting flexible layer is an anisotropic conductive film.

Abstract: An interconnect structure and methods of forming the same are described. In some embodiments, the structure includes a first intermetal dielectric (IMD) layer disposed over a plurality of conductive features and a first passive component disposed on the first IMD layer in a first region of the substrate. The structure further includes a second passive component disposed on the first IMD layer in a second region of the substrate. The second passive component includes a first conductive layer, and the first conductive layer has a first thickness. The structure further includes a second IMD layer disposed on the first passive component in the first region and on the second passive component and a portion of the first IMD layer in the second region. The second IMD layer has a second thickness ranging from about five times to about 20 times the first thickness.

Abstract: A light-emitting device, including a circuit substrate, a first light-emitting diode, and a first fixing structure, is provided. The circuit substrate includes a substrate, a first pad, a flat layer, and a first electrical connection material. The first pad and the flat layer are located on the substrate. The flat layer has a first opening overlapping the first pad. The first electrical connection material is located in the first opening and is electrically connected to the first pad. The first light-emitting diode is located on the flat layer and in contact with the first electrical connection material. The first fixing structure is located between the first light-emitting diode and the flat layer. The vertical projection of the first fixing structure on the substrate is located in the vertical projection of the first light-emitting diode on the substrate.

Abstract: A circuit board and an electronic apparatus using the same are provided. The circuit board includes an integrated-circuit (IC) device arrangement region and an electronic device arrangement region. The circuit board includes a first external wiring layer and an inner wiring layer. The first external wiring layer includes a plurality of first signal traces and a ground extending portion that extend from the IC device arrangement region to the electronic device arrangement region. The inner wiring layer includes a ground portion and an inner signal trace. The ground portion defines an opening region, and the inner signal trace is located in the opening region and extends from a position under the IC device arrangement region to another position under the electronic device region. The ground extending portion and the opening region overlap with each other in a thickness direction of the circuit board.

Abstract: A shoe accessory of a shoe adaptive for activating a bottom of a foot wearing the shoe is provided. The bottom of the foot has a forefoot, a heel, and an arch between the forefoot and the heel. The shoe accessory includes a main body and a plurality of stimulating elements mounted to the main body. Each of the stimulating elements is movable universally on the main body and is adapted to exert a pressing force on a non-fixed point of the bottom of the foot to stimulate the arch.

Abstract: A method includes providing a substrate of a first conductivity type, the substrate including a first circuit region and a second circuit region; forming a first well region of a second conductivity type in the first circuit region of the substrate; forming a first doped region of the second conductivity type in the first well region; forming a diode in the second circuit region of the substrate; forming a first transistor and a second transistor over the substrate in the first circuit region and the second circuit region, respectively; forming a discharge structure over the substrate to electrically couple the first doped region to the diode; and forming a metallization layer over the discharge structure to electrically couple the first transistor to the second transistor subsequent to the forming of the diode, wherein charges accumulated in the first well region are drained to the substrate through the discharge structure.