Abstract: A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved shape is arranged around the through hole for guiding the airflow flowing to the heat pipe. A space formed and surrounded by the guiding member is a tapered space, which narrows gradually along the direction of the airflow so as to guide the airflow flowing to the heat pipe.

Abstract: A heat dissipation device includes a thermal attach block (10), a heat pipe (30) thermally attached to the block, and a fin unit (90) thermally attached to the heat pipe. The block includes a curve-shaped bottom surface (124) allowing it to be thermally attached to a heat generating component (80) to absorb heat therefrom, and a top surface (122) opposite to the bottom surface. The heat pipe includes an evaporating section (32) at one end and a condensing section (34) at the other. The evaporating section can be thermally attached to the top surface of the block. The condensing section can be thermally attached to the fin unit.

Abstract: A heat dissipation apparatus (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12) and a centrifugal blower (14). The fin assembly includes a plurality of fins (121) for thermally connecting with the heat-generating electronic component to absorb heat therefrom. The centrifugal blower provides an airflow flowing through the fin assembly to take heat away therefrom. The centrifugal blower includes a housing (141), a cover (142) mounted on the housing with an inner space formed therebetween, and a rotor including a plurality of blades (143) rotatably disposed in the inner space. The rotor has a rotation axis (A). The fins of the fin assembly are arranged at an air outlet (151) of the centrifugal blower and stacked together along a direction parallel to the rotation axis of the rotor of the centrifugal blower.

Abstract: A thermal module (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12), and a heat pipe (14) including an evaporator section (141) and a curve shaped condenser section (142). The evaporator section of the heat pipe thermally contacts with the heat-generating electronic component, and the condenser section of the heat pipe is disposed on the fin assembly along a longitudinal axis of the fin assembly. The condenser section has a serpentine configuration.

Abstract: A fastening device (10) for mounting a first member (12) to a second member, the fastening device includes base member (14) and a resilient spring member (15). The base member includes a contacting plate (141) contacting with the second member, and a receiving channel for (147) receiving a portion of the first member therein. The resilient spring member includes two ends for being attached to a board with the second member mounted thereon, and a middle portion contacted with the first member to sandwich the first member between the second member and the spring member.

Abstract: A heat dissipation apparatus (10) for dissipating heat from a heat generating electronic component includes a fin assembly (14) thermally connecting with the heat-generating electronic component to absorb heat therefrom, and a heat-dissipating fan (12) for providing an airflow to take heat away from the fin assembly. The heat-dissipating fan includes a bottom housing (124), a top cover (125) mounted on the bottom housing to form a space therebetween, and a rotor with a plurality of blades (122) accommodated in the space. The top cover extends a plurality of guiding plates (127) therefrom for guiding the airflow from the blades toward the fin assembly.

Abstract: A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved shape is arranged around the through hole for guiding the airflow flowing to the heat pipe. A space formed and surrounded by the guiding member is a tapered space, which narrows gradually along the direction of the airflow so as to guide the airflow flowing to the heat pipe.

Abstract: A heat sink (10) includes a plurality of fins (12). Each of the fins includes a main body (122) and at least one bulge (126) disposed on the main body. The main bodies of two adjacent fins cooperatively define an air passage (121) therebetween, for allowing an airflow to pass therethough. The bulge has a varying projection height so as to form a streamline guide surface (127) thereon.

Abstract: A thermal module (10) for dissipating heat from a heat-generating electronic component includes a base plate (11), and at least a fin assembly (14) disposed on the base plate. The fin assembly includes a plurality of fins (140) stacked together along a predetermined direction. At least a part of the fins each has a main body (141) forming an acute angle with the stack direction thereof.

Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.

Abstract: A thermal module (10) for dissipating heat from a heat-generating electronic component (20) includes a base plate (11), a heat-dissipating fan (16) mounted to one side of the base plate, at least a heat pipe (12) mounted to another side opposite to the one side of the base plate, and a fin assembly (14) mounted to an air outlet of the heat-dissipating fan. The heat pipe includes a bending portion (124). The fin assembly includes a portion (142) corresponding to the bending portion of the heat pipe. The fins of the portion of the fin assembly are arranged along an extension direction of the bending portion of the heat pipe.

Abstract: A heat spreader (10) and a method for manufacturing the heat spreader are disclosed. The heat spreader includes a metal casing (12) and a wick structure (16) lines an inner surface of the metal casing. The metal casing defines therein a chamber (14) and includes an evaporating section (126) and a condensing section (127). The wick structure is in the form of metal foam and occupies a portion of the chamber. In one embodiment, the wick structure has a pore size gradually increasing from the evaporating section towards the condensing section of the metal casing. The heat spreader is manufactured by electrodepositing a layer of metal coating (70) on an outer surface of a metal foam framework (20). The metal coating becomes the metal casing and the metal foam framework becomes the wick structure.

Abstract: A flat type heat pipe (10) is disclosed which includes a metal casing (12) and a wick structure (16) arranged inside the metal casing. The metal casing has an evaporating section (123) and a condensing section (124). The wick structure extends from the evaporating section towards the condensing section of the metal casing and has a first section in conformity with the condensing section of the metal casing and a second section in conformity with the evaporating section of the metal casing. The first section has a pore size larger than that of the second section of the wick structure. The wick structure includes a metal foam.

Abstract: A cooling fan includes a motor (30) for generating an airflow, and a housing (10) defining a space (40) for receiving the motor therein. The housing defines an air inlet (57) through which the airflow flows into the housing. The motor has a plurality of fan blades (31) extending radially outwards from a periphery thereof. The motor is mounted under the air inlet. The air inlet is so configured or positioned that the fan blades are unevenly exposed to an ambient air through the air inlet. The housing further has an air outlet (56) through which the airflow flows out of the fan. The air outlet is oriented perpendicular to the air inlet.

Abstract: A clip (10) includes a body (12) including spaced first and second end portions, a first locking part (20) extending from the first end portion for attaching to a heat sink (80), and a second locking part (30) extending from the second end portion for attaching to a circuit board (50). The first locking part includes a pin (21), a pair of C-shaped spring portions (22), and a compressible mounting portion (23). The spring portions and the mounting portion are for cooperatively sandwiching the heat sink therebetween. The second locking part includes a taper head (30) and a neck (31). The second locking part engages with the circuit board in the neck. The first locking part offsets from the second locking part in a vertical direction. The heat sink of which the mounting holes offset from the mounting holes of the circuit board is therefore fitable to the circuit board.

Abstract: A mounting device for mounting a first element onto a second element includes a plurality of fastening elements; each of the fastening elements includes a connecting member defining a clasping groove therein, and a guiding portion adjacent to the clasping groove; a ring-shaped clipping member snaps in the clasping groove of the connecting member after moving over the guiding portion to be expanded; a fixing member is coupled to the connecting member for sandwiching the first element and the second element therebetween; a resilient member adapts for sandwiching between the connecting member and the first element to providing resilient force to urge the first element toward the second element.

Abstract: A pulsating heat transfer apparatus includes a number of separate heat receiving portions (100, 200, 300), at least one heat dissipating portion (400), and a plurality of capillary pipes (500). Each heat receiving portion has a flat surface for contacting with a heat source, and defines therein at least one first capillary passage. Each heat dissipating portion defines therein at least one second capillary passage. The first capillary passages, the at least one second capillary passage, together with the capillary pipes form a close-looped, serpentine flow channel having capillary effect. Vapor slugs (600) and liquid slugs (700) are distributed in the flow channel. Heat is capable of being transferred from the heat receiving portions to the at least one heat dissipating portion by pulsation of the vapor slugs and liquid slugs.

Abstract: A method for manufacturing a vapor chamber-based heat spreader includes the following steps: (1) providing a mold, the mold having a surface; (2) electrodepositing a layer of metal coating on the surface of the mold; (3) removing the mold from the coating layer, wherein the coating layer defines therein a chamber; (4) filling a working fluid into the chamber of the coating layer and sealing the coating layer, to thereby form a vapor chamber-based heat spreader.

Abstract: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.

Abstract: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.