Abstract: A clip (10) includes a body (12) including spaced first and second end portions, a first locking part (20) extending from the first end portion for attaching to a heat sink (80), and a second locking part (30) extending from the second end portion for attaching to a circuit board (50). The first locking part includes a pin (21), a pair of C-shaped spring portions (22), and a compressible mounting portion (23). The spring portions and the mounting portion are for cooperatively sandwiching the heat sink therebetween. The second locking part includes a taper head (30) and a neck (31). The second locking part engages with the circuit board in the neck. The first locking part offsets from the second locking part in a vertical direction. The heat sink of which the mounting holes offset from the mounting holes of the circuit board is therefore fitable to the circuit board.

Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.

Abstract: An integrated circuit package has a printed circuit board, a die mounted on the printed circuit board, and a heat spreader attached to the printed circuit board to cover the die and contact with the backside of the die. The heat spreader is formed by a piece body and a plurality of supporting leads extended downward from the periphery of the piece body. The supporting leads of the heat spreader are attached to the printed circuit board by surface mounting technology. The piece body of the heat spreader abuts on the backside of the die so that heat from the die can be conducted both upward to the outer environment and downward to the printed circuit board through the heat spreader, thereby enhancing the heat dissipation efficiency.