Abstract: A circuit and a circuit design method are provided. The circuit operates between a first power source voltage and a ground voltage. The circuit comprises at least one low speed circuit path and at least one high speed circuit path. The low speed circuit path adjusts voltage level at the first power source voltage or the ground voltage. The low speed circuit path provides a first return path and isolates unwanted noise signals for a signal on the high speed circuit path.

Abstract: Memory controllers and methods of optimizing pad sequences thereof are provided. At least two different preferred trace sequences on printed circuit boards for at least one memory device are first provided. One memory controller is then provided to have a core logic circuit, a plurality of input/output (I/O) devices, and a reorderer. The core logic has I/O terminals. Each I/O device on the single chip has a pad. The reorderer is coupled between the core logic circuit and the input/output devices, programmable to selectively connect the input/output devices to the input/output terminals. The reorderer is later programmed to select and connect a portion of the input/output devices to the input/output terminals such that one of the different preferred trace sequences is substantially supported.

Abstract: A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal interconnection, wherein at least two potential equivalent metal traces are formed in a level of the metal interconnection; a passivation layer disposed over the two metal traces, wherein two openings are formed in the passivation layer to expose portions of the two metal traces; a conductive member externally mounted on the passivation layer between the two openings; and a redistribution layer formed over the conductive member.

Abstract: A memory system includes a first memory unit, a transmission bus having an impedance, and a memory controller having a first on-die termination circuit, coupled to the first memory unit through the transmission bus. The first on-die termination circuit matches the impedance of the transmission bus in response to the memory controller writing data to the first memory unit.

Abstract: An electronic package is provided. The electronic package comprises a die pad having a die attached thereon. A plurality of leads surrounds the die pad and spaced therefrom to define a ring gap therebetween. At least one first common electrode bar is in the ring gap and substantially coplanar to the die pad, in which at least one of the plurality of leads extends to the first common electrode bar. A molding compound partially encapsulates the die pad and the first common electrode bar, such that the bottom surfaces of the die pad and the first common electrode bar are exposed. An electronic device with the electronic package is also disclosed.

Abstract: Memory controllers and methods of optimizing pad sequences thereof are provided. At least two different preferred trace sequences on printed circuit boards for at least one memory device are first provided. One memory controller is then provided to have a core logic circuit, a plurality of input/output (I/O) devices, and a reorderer. The core logic has I/O terminals. Each I/O device on the single chip has a pad. The reorderer is coupled between the core logic circuit and the input/output devices, programmable to selectively connect the input/output devices to the input/output terminals. The reorderer is later programmed to select and connect a portion of the input/output devices to the input/output terminals such that one of the different preferred trace sequences is substantially supported.

Abstract: The layout circuit comprises a first 3×2 grid array and a second 3×2 grid array. The first 3×2 grid array comprises first, second and third signal contact points and the first and second fixed potential contact points are coupled to a first fixed potential. The first and second fixed potential contact points are arranged diagonally into the first 2×2 array and the first and second signal contact points are also arranged diagonally into the first 2×2 array. The second 3×2 grid array comprises fourth, fifth and sixth signal contact points and the third and fourth fixed potential contact points are coupled to the first fixed potential. The third and fourth fixed potential contact points are arranged diagonally into the second 2×2 array and the fourth and fifth signal contact points are also arranged diagonally into the second 2×2 array.

Abstract: A memory system includes a first memory unit, a transmission bus having an impedance, and a memory controller having a first on-die termination circuit, coupled to the first memory unit through the transmission bus. The first on-die termination circuit matches the impedance of the transmission bus in response to the memory controller writing data to the first memory unit.

Abstract: A novel structure for reducing cross-talk effect is disclosed. The structure includes an electric board containing a ground layer and a plurality of adapting modules. Only one of the adapting modules can operates at any one time and each adapting module includes a plurality of slots and a plurality of buses. The plurality of the slots can detachably accommodate a plurality of corresponding adapting devices. The buses are electrically connected to the plurality of slots for transmitting signals and data. When the adapting module does not operate, the corresponding the buses are connected to the ground layer of the electric board. The plurality of the buses of the modules are alternately co-laid out on the electric board.