Abstract: A transceiver module is provided. The transceiver module includes a housing, a latch and a torsion spring. The housing includes a positioning post and a block. The latch includes a wedging protrusion. The torsion spring includes a coil portion, a first extending portion and a second extending portion, wherein the first extending portion and the second extending portion are connected to the coil portion, the first extending portion includes a first free end, the second extending portion includes a second free end, and the first extending portion intersects the second extending portion at an intersection point on a projection plane. A first area, a second area, a third area and a fourth area are defined by the torsion spring clockwise around the intersection point, the coil portion surrounds the positioning post in the first area, and the first free end is adapted to connect the latch.

Abstract: A plug unlocking structure of an optical transceiver module includes a main body, a linkage assembly, and a pull handle. The linkage assembly is pivotally coupled to the main body. The linkage assembly includes a locking arm and at least one linking arm extended from the locking arm. The extending directions of the locking arm and the linking arm are different, and an elastic element is installed between the linking arm and the main body. The pull handle is linked to the linking arm. The linkage assembly is pivotally coupled to the main body through the pivoting point of the locking arm, and the locking arm has a latching pin. The position of the pivoting point of the locking arm is between the latching pin and the linking arm.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: A catalyst for a catalytic ink includes a support particle and a metallic material supported on the support particle. The metallic material is diamminesilver hydroxide, a silver salt, a palladium salt, a gold salt, chloroauric acid, or combinations thereof. A catalytic ink obtained from the catalyst and use of the same to fabricate a conductive circuit are also disclosed.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: A plug unlocking structure of an optical transceiver module includes a main body, a linkage assembly, and a pull handle. The linkage assembly is pivotally coupled to the main body. The linkage assembly includes a locking arm and at least one linking arm extended from the locking arm. The extending directions of the locking arm and the linking arm are different, and an elastic element is installed between the linking arm and the main body. The pull handle is linked to the linking arm. The linkage assembly is pivotally coupled to the main body through the pivoting point of the locking arm, and the locking arm has a latching pin. The position of the pivoting point of the locking arm is between the latching pin and the linking arm.

Abstract: A catalyst for a catalytic ink includes a support particle and a metallic material supported on the support particle. The metallic material is diamminesilver hydroxide, a silver salt, a palladium salt, a gold salt, chloroauric acid, or combinations thereof. A catalytic ink obtained from the catalyst and use of the same to fabricate a conductive circuit are also disclosed.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: A method of forming a patterned metal unit on an article. The method includes the steps of: providing an article that has an insulating surface; transferring a catalyst layer onto the insulating surface of the article, the catalyst layer including a catalytic material; removing a part of the catalyst layer to form a patterned catalyst layer; and forming a patterned metal layer on the patterned catalyst layer by an electroless plating technique to obtain a patterned metal unit that is constituted by the patterned catalyst layer and the patterned metal layer.

Abstract: A method of making an electronic device includes: providing a base unit including a metal substrate, an insulating layer disposed on the metal substrate, and a first circuit unit disposed on the insulating layer; and laser ablating the first circuit unit, the insulating layer and the metal substrate in such a manner that a hole defined by a hole-defining wall is formed to expose the metal substrate, and that an interconnecting layer is formed on the hole-defining wall during laser ablation of the metal substrate.

Abstract: A method of forming a patterned metal unit on an article. The method includes the steps of: providing an article that has an insulating surface; transferring a catalyst layer onto the insulating surface of the article, the catalyst layer including a catalytic material; removing a part of the catalyst layer to form a patterned catalyst layer; and forming a patterned metal layer on the patterned catalyst layer by an electroless plating technique to obtain a patterned metal unit that is constituted by the patterned catalyst layer and the patterned metal layer.

Abstract: Disclosed herein is a circuit-and-heat-dissipation assembly which includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer and having an electroless plating layer which has a patterned catalyst seed layer comprising an active metal and formed on the insulator layer, and a reduced metal layer formed on the catalyst seed layer. Also disclosed herein is a method of making the circuit-and-heat-dissipation assembly.

Abstract: A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer.

Abstract: A method of making an electronic device includes: providing a base unit including a metal substrate, an insulating layer disposed on the metal substrate, and a first circuit unit disposed on the insulating layer; and laser ablating the first circuit unit, the insulating layer and the metal substrate in such a manner that a hole defined by a hole-defining wall is formed to expose the metal substrate, and that an interconnecting layer is formed on the hole-defining wall during laser ablation of the metal substrate.

Abstract: Disclosed is a method for preparing a granulated inorganic adsorbent for radionuclides including slurry forming, solidification, drying and hardening, granulation, and washing steps: blending a dihydrogen phosphate, a powdered inorganic adsorbent raw material and a setting time regulator in water to form a slurry; adding sintered magnesia into the slurry, and blending the mixture to form a solidified slurry; setting the solidified slurry on a disk member, and naturally drying to hardening in a specific temperature range to form a hardened solid material; smashing the hardened solid material and performing vibration sieving by using a screen to obtain a granulated inorganic adsorbent for radionuclides containing residual reagents; washing the granulated inorganic adsorbent for radionuclides containing residual reagents with water, to remove the residual reagents to complete preparation, where the adsorption capacity of the granulated inorganic adsorbent for radionuclides thus prepared is in the range of 0.

Abstract: A catalyst for a catalytic ink includes a support particle and a metallic material supported on the support particle. The metallic material is diamminesilver hydroxide, a silver salt, a palladium salt, a gold salt, chloroauric acid, or combinations thereof. A catalytic ink obtained from the catalyst and use of the same to fabricate a conductive circuit are also disclosed.

Abstract: Embodiments include systems, methods, and apparatuses for reading a data signal from a memory, such as a dynamic random access memory (DRAM). In one embodiment, a memory receiver may include a differential amplifier to receive a data signal from the memory and pass a differential output signal based on a voltage difference between the data signal and a reference voltage. The data signal may have a first direct current (DC) average voltage level, and the differential amplifier may shift the differential output signal to a second DC average voltage level that is substantially constant over a range of values of the first DC average voltage level. In another embodiment, a voltage offset compensation (VOC) circuit may apply a compensation voltage to the output signal that is based on an activated rank or an identity of the memory module. Other embodiments may be described and claimed.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.