Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A method may include forming a mask layer on top of a first dielectric layer formed on a first source/drain and a second source/drain, and creating an opening in the mask layer and the first dielectric layer that exposes portions of the first source/drain and the second source/drain. The method may include filling the opening with a metal layer that covers the exposed portions of the first source/drain and the second source/drain, and forming a gap in the metal layer to create a first metal contact and a second metal contact. The first metal contact may electrically couple to the first source/drain and the second metal contact may electrically couple to the second source/drain. The gap may separate the first metal contact from the second metal contact by less than nineteen nanometers.

Abstract: The device includes a projecting device, an image sensor and a computing circuit. The projecting device provides a light beam having a predetermined pattern that is projected onto an object. The image sensor receives the light beam reflected from the object to generate an image. The computing circuit compares the image with a first ground-truth image and a ground-truth image to generate a first depth value and a second depth value respectively. The first and second depth values are combined to generate a depth result.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A semiconductor device including a first die and a second die bonded to one another. The first die includes a first passivation layer over a substrate, and first bond pads in the first passivation layer. The second die includes a second passivation layer, which may be bonded to the first passivation layer, and second bond pads in the second passivation layer, which may be bonded to the first bond pads. The second bond pads include inner bond pads and outer bond pads. The outer bond pads may have a greater diameter than the inner bond pads as well as the first bond pads.

Abstract: A liquid crystal display has position-adjustable light sources. The light sources may be lamps, LEDs, or other emissive components. The light sources, however, are movable to adjust the locations or positions of their light outputs. The light sources ride upon electromagnet carriers. When currents are applied to the electromagnet carriers, each electromagnet carrier creates a corresponding magnetic field. The magnetic fields cause neighboring electromagnet carriers to attract or to repel, depending on the magnitude/polarity of the currents. The lateral and vertical positions of the electromagnet carriers may thus be adjusted by varying their respective currents and magnetic fields. Because the light sources ride on the electromagnet carriers, the light sources may be moved to refine an image generated by the liquid crystal display. The light sources, for example, may be moved to improve white/black contracts to reduce halo-effects.

Abstract: Embodiments of the present application are applied in the field of semiconductor inspection, and provide an acquisition apparatus, an acquisition system and an acquisition method. The acquisition apparatus includes: a base and a core plate, the core plate being configurated to carry a chip tray; a first support portion, being disposed on the base and connected with a first camera assembly, and the first camera assembly being disposed above the core plate; and a second support portion, being disposed on the base and connected with a second camera assembly, and the second camera assembly being disposed above the core plate; wherein the first camera assembly is configurated to capture an image of a first region of the chip tray, the second camera assembly is configurated to capture an image of a second region of the chip tray.

Abstract: A rotating device configured to rotate and position a product at multiple precision angles includes a base and an angle defining disk. The angle defining disk defines a circular through hole. A rotating mechanism is received in the through hole and a positioning mechanism is connected to the rotating mechanism. The periphery of an inner wall of the through hole includes a plurality of locating slots. The rotating mechanism is capable of rotating in the through hole by an external force and driving the positioning mechanism to rotate relative to the angle defining disk. The rotation causes the rotating mechanism to move and take a precise position from one locating slot to another locating slot.

Abstract: The present disclosure relates to a semiconductor structure and a method of manufacturing the semiconductor structure. The semiconductor structure includes a substrate including a first surface and a conductive trace extending over the substrate; a die disposed over the first surface of the substrate; a molding disposed over the first surface of the substrate and covering the die; and a metallic layer surrounding the molding and the substrate, wherein the metallic layer is electrically connected to at least a portion of the conductive trace exposed through the substrate.

Abstract: A system comprising a display, a display cover, a plurality of sensors disposed between the display and the display cover and a lighting control system coupled to the display and the plurality of sensors, the lighting control system configured to receive one or more signals from the plurality of sensors and to reduce a backlight level of a subgroup of lighting elements associated with the one or more sensors associated with the one or more signals, wherein the subgroup of lighting elements is one of a plurality of subgroups of lighting elements of the display.

Abstract: A rotating device configured to rotate and position a product at multiple precision angles includes a base and an angle defining disk. The angle defining disk defines a circular through hole. A rotating mechanism is received in the through hole and a positioning mechanism is connected to the rotating mechanism. The periphery of an inner wall of the through hole includes a plurality of locating slots. The rotating mechanism is capable of rotating in the through hole by an external force and driving the positioning mechanism to rotate relative to the angle defining disk. The rotation causes the rotating mechanism to move and take a precise position from one locating slot to another locating slot.

Abstract: An information handling system may comprise a liquid crystal display having a plurality of pixels, an electrochromic material layer having a plurality of electrodes disposed between an interior surface of a chassis and a transistor-array layer, and a high reflection layer reflecting light emitted from an LED disposed between the electrochromic material layer and the transistor-array layer away from the interior surface of the chassis. A processor may execute code instructions of an electrochromic material regional backlight unit dimming control system to identify a low-intensity pixel region including a subset of the plurality of pixels associated within high dynamic ratio image data with a low intensity value, identify an electrode of the electrochromic material layer associated with the low-intensity pixel region; and pass a current through the electrode such that a portion of the electrochromic material becomes opaque to the light reflected from the high reflection layer.

Abstract: The present disclosure relates to a semiconductor structure and a method of manufacturing the semiconductor structure. The semiconductor structure includes a substrate including a first surface and a conductive trace extending over the substrate; a die disposed over the first surface of the substrate; a molding disposed over the first surface of the substrate and covering the die; and a metallic layer surrounding the molding and the substrate, wherein the metallic layer is electrically connected to at least a portion of the conductive trace exposed through the substrate.

Abstract: An information handling system may comprise a liquid crystal display having a plurality of pixels, an electrochromic material layer having a plurality of electrodes disposed between an interior surface of a chassis and a transistor-array layer, and a high reflection layer reflecting light emitted from an LED disposed between the electrochromic material layer and the transistor-array layer away from the interior surface of the chassis. A processor may execute code instructions of an electrochromic material regional backlight unit dimming control system to identify a low-intensity pixel region including a subset of the plurality of pixels associated within high dynamic ratio image data with a low intensity value, identify an electrode of the electrochromic material layer associated with the low-intensity pixel region; and pass a current through the electrode such that a portion of the electrochromic material becomes opaque to the light reflected from the high reflection layer.

Abstract: A system comprising a display, a display cover, a plurality of sensors disposed between the display and the display cover and a lighting control system coupled to the display and the plurality of sensors, the lighting control system configured to receive one or more signals from the plurality of sensors and to reduce a backlight level of a subgroup of lighting elements associated with the one or more sensors associated with the one or more signals, wherein the subgroup of lighting elements is one of a plurality of subgroups of lighting elements of the display.

Abstract: A support for video playback devices includes a headwear device, a support mechanism, and a holding mechanism. The support mechanism is connected to the headwear device. The holding mechanism is connected to the support mechanism, and is used to hold a video playback device. Viewing distance and angle of the video playback device is adjusted by varying relative positions of the headwear device and the support mechanism and by varying relative positions of the support mechanism and the holding mechanism. The structure of the support for video playback devices is simple. The support for video playback devices is useful when a user lies down, thus improving the user's sense of experience.

Abstract: An electronic device includes a casing defining a receiving space in a back surface thereof. A receiving space is defined in an edge portion of the back surface. The receiving space is configured for receiving a battery therein. A cover is rotationally secured in the receiving space. The cover in a closed state is fully received in the receiving space. The cover in an open state is not fully received in the receiving space. The cover is rotatable between the closed state and the open state.