Abstract: The plastic composition includes PET and Nylon. The weight percentage of PET is between 20% and 90%. The weight percentage of Nylon is between 5% and 40%.

Abstract: A backlight module and a display device using the same are provided. The display device further includes a first panel and a second panel disposed on opposite sides of the backlight module. The backlight module has a light module and a back plate with a through hole formed on it. The light module includes a flexible circuit board having a first strip and a second strip. A plurality of first light sources and second light sources are respectively disposed on the first strip and the second strip. The flexible circuit board passes through the through hole, and the first strip and the second strip are on two opposite sides of the back plate. The first strip and the first light sources are distributed along a side of the first panel while a portion of the second strip is bent to extend along a side of the second strip.

Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.

Abstract: A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced.

Abstract: A light emitting assembly, a backlight module having the light emitting assembly, and a liquid crystal display (LCD) apparatus having the backlight module are provided. The light emitting assembly includes a rigid circuit board, a plurality of light emitting diode (LED) devices, and a flexible circuit board. The rigid circuit board has a plurality of external circuits isolated from one another. The LED devices are disposed on the rigid circuit board, and each of the external circuits is connected to a corresponding one of the LED devices. The flexible circuit board has a plurality of connecting lines, and each of the connecting lines is connected to at least two of the external circuits, so as to serially connect the LED devices that are connected to the external circuits.

Abstract: A backlight module includes a tray, a light guide plate, a lighting device, and an optical film set. The tray includes a bottom plate and a side wall connecting an edge of the bottom plate. The side wall includes a plurality of wall portions connected to one another. Some of the wall portions are perpendicular to the bottom plate, and the others are parallel to the bottom plate. The light guide plate is disposed on the bottom plate. The lighting device is disposed at a light incident side of the light guide plate. The optical film set disposed on the light guide plate leans against the side wall.

Abstract: A backlight module includes a back plate, an optical sheet, and a lateral frame. The back plate has a first surface, wherein the first surface includes a raised portion formed near the edge of the first surface. An insertion opening is formed between the raised portion and the first surface. The optical sheet is disposed on the first surface, wherein a protrusion is formed at one end of the optical sheet to be inserted into the insertion opening. The lateral frame is disposed on the back plate and corresponds to the edge of the first surface. The lateral frame includes at least a side wall having a sinking portion formed at the bottom of the side wall, wherein the bottom of the side wall is disposed on the optical sheet while the raised portion is received in the sinking portion.

Abstract: A backlight module and a display device using the same are provided. The display device further includes a first panel and a second panel disposed on opposite sides of the backlight module. The backlight module has a light module and a back plate with a through hole formed on it. The light module includes a flexible circuit board having a first strip and a second strip. A plurality of first light sources and second light sources are respectively disposed on the first strip and the second strip. The flexible circuit board passes through the through hole, and the first strip and the second strip are on two opposite sides of the back plate. The first strip and the first light sources are distributed along a side of the first panel while a portion of the second strip is bent to extend along a side of the second strip.

Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.

Abstract: An etching system (3) includes an etching chamber (31), an etchant solution tank (32) connected with the etching chamber, a heater (34) set in the tank, and a deionized water (DIW) adding device. The DIW adding device includes a DIW feeding pipe (36) having a first timer (361), and a clean dry air (CDA) feeding pipe (35) having a second timer (351). The DIW and CDA feeding pipes combine into a main pipe (37) that is connected with the etching chamber. A portion of the DIW feeding pipe is set in the tank and heated by the heater. The temperature of the DIW fed into the etching chamber and the temperature of the etchant solution pumped into the etching chamber are same. Thus when the DIW is fed into the etching chamber, the temperature of the etching chamber does not fluctuate, which can maintain the quality of the etching process.

Abstract: An electric heating structure is disclosed, which comprises: a heat conducting plate for conducting thermal energy; a heating plate, disposed at the bottom of the heat conducting plate; a metal electrode, for conducting electricity; and an electric conducting element. The heating plate is further comprised of a porous insulating layer and an electric heating film made of an oxide of electric conducting ability. By enabling the metal electrode to couple to the electric heating film, and an end of the electric conducting element to couple to the metal electrode while the other end thereof is coupled to a power connecting terminal, an electrical conduction is enabled between the metal electrode, the electric conducting element, and the power connecting terminal.

Abstract: An antenna system designed to enhance power efficiency of a patch antenna for wireless transmission is provided. The system includes a patch antenna, a reflective plate, a transmission line, and a printed circuit board assembly. The reflective plate is arranged at the position of ¼? away from the patch antenna, to reflect the electro-magnetic waves, radiated behind the patch antenna. Because the antenna and the reflective plate are away from ¼?, the reflective signals returned to the patch antenna constructively interfere with the signal radiated from the antenna. Therefore, the provided system may strengthen the gain of the antenna. Further, the electromagnetic interference is decreased at the position close to the printed circuit board assembly behind the reflective plate.

Abstract: An antenna system designed to enhance power efficiency of a patch antenna for wireless transmission is provided. The system includes a patch antenna, a reflective plate, a transmission line, and a printed circuit board assembly. The reflective plate is arranged at the position of ¼? away from the patch antenna, to reflect the electro-magnetic waves, radiated behind the patch antenna. Because the antenna and the reflective plate are away from ¼?, the reflective signals returned to the patch antenna constructively interfere with the signal radiated from the antenna. Therefore, the provided system may strengthen the gain of the antenna. Further, the electromagnetic interference is decreased at the position close to the printed circuit board assembly behind the reflective plate.

Abstract: A wet etching system includes a substrate holding chamber (211), a drying chamber (218), a cleaning chamber (217), a wet etching region, an elevator (213), a conveyor (212) arranged above the drying chamber. The cleaning chamber, and the wet etching region, the conveyor communicating with both the substrate holding chamber and the elevator. A substrate being transmitted along the conveyor can avoid shaking, vibration and other disturbances caused by high pressure cleaning. In addition, because the etching chambers are located relatively far away from the substrate holding chamber, there is reduced risk of substrates that are held in the substrate holding chamber being contaminated by chemical reagents used in the etching processes. Furthermore, when two wet etching systems are arranged substantially diagonally opposite each other, the interspace therebetween conveniently serves as a common access region for maintenance and cleaning of the wet etching systems.

Abstract: An etching system (3) includes an etching chamber (31), an etchant solution tank (32) connected with the etching chamber, a heater (34) set in the tank, and a deionized water (DIW) adding device. The DIW adding device includes a DIW feeding pipe (36) having a first timer (361), and a clean dry air (CDA) feeding pipe (35) having a second timer (351). The DIW and CDA feeding pipes combine into a main pipe (37) that is connected with the etching chamber. A portion of the DIW feeding pipe is set in the tank and heated by the heater. The temperature of the DIW fed into the etching chamber and the temperature of the etchant solution pumped into the etching chamber are same. Thus when the DIW is fed into the etching chamber, the temperature of the etching chamber does not fluctuate, which can maintain the quality of the etching process.