Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: An interactive projection system including a projector and a touch interactive light source device is provided. The projector includes a projection optical engine, a camera module, and a control module. The touch interactive light source device includes at least one infrared light source module and a wireless signal transmission module. The control module is electrically connected to the projection optical engine and the camera module, and controls the touch interactive light source device through the wireless signal transmission module, so that the touch interactive light source device is placed in a recommended installation position and the interactive projection system is in an interactive mode. An operation method of the interactive projection system is also provided.

Abstract: A method may include forming a mask layer on top of a first dielectric layer formed on a first source/drain and a second source/drain, and creating an opening in the mask layer and the first dielectric layer that exposes portions of the first source/drain and the second source/drain. The method may include filling the opening with a metal layer that covers the exposed portions of the first source/drain and the second source/drain, and forming a gap in the metal layer to create a first metal contact and a second metal contact. The first metal contact may electrically couple to the first source/drain and the second metal contact may electrically couple to the second source/drain. The gap may separate the first metal contact from the second metal contact by less than nineteen nanometers.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A connection detection device and a connection detection method for detecting a connection state between a first connector and a second connector are provided. The first connector includes detection pins. The second connector includes loop pins corresponding to the detection pins. The connection detection device includes a bias voltage generator, a detection circuit, and a processor. The bias voltage generator applies a reference bias voltage to the detection pins. The detection circuit detects bias values on the detection pins. When each bias value is shifted to a first bias value based on a connection loop formed between the detection pins and the loop pins, the detection circuit provides a first detection signal. When at least one of the bias values is not shifted to the first bias value, the detection circuit provides a second detection signal. The processor provides an alarm signal in response to the second detection signal.

Abstract: An interactive projection system including a projector and a touch interactive light source device is provided. The projector includes a projection optical engine, a camera module, and a control module. The touch interactive light source device includes at least one infrared light source module and a wireless signal transmission module. The control module is electrically connected to the projection optical engine and the camera module, and controls the touch interactive light source device through the wireless signal transmission module, so that the touch interactive light source device is placed in a recommended installation position and the interactive projection system is in an interactive mode. An operation method of the interactive projection system is also provided.

Abstract: An interactive rear projection system including a projection screen, a projection optical engine, an input device and a controller is provided. The projection optical engine emits a projection beam which is projected on the projection screen. The input device includes a sensor and a first light source both disposed on a first side of the projection screen. The controller is electrically connected to the projection optical engine, the sensor, and the first light source and controls the first light source to project a first beam toward the projection screen. When an object approaches a second side of the projection screen, the sensor senses a light spot generated by the first beam diffusely reflected by the object and recognizes a position of the object or a position where the object touches the projection screen according to the light spot.

Abstract: A projection device includes a light source, an optical engine and a controller. The light source provides a light beam according to a setting current. The optical engine includes a light combining module, an imaging module and a projection lens. The light combining module receives the light beam to generate an illumination beam. The imaging module includes a prism, a digital micromirror device and a light sensor. The prism transmits a portion of the illumination beam to the light sensor. The digital micromirror device converts the other portion of the illumination light beam into an image beam. The light sensor disposed between the prism and the digital micromirror device receives the portion of the illumination beam to generate a brightness data. The projection lens projects the image beam. The controller dynamically adjusts the setting current to calibrate a color point of the light beam according to the brightness data.

Abstract: A projection device includes a light source, an optical engine and a controller. The light source provides a light beam according to a setting current. The optical engine includes a light combining module, an imaging module and a projection lens. The light combining module receives the light beam to generate an illumination beam. The imaging module includes a prism, a digital micromirror device and a light sensor. The prism transmits a portion of the illumination beam to the light sensor. The digital micromirror device converts the other portion of the illumination light beam into an image beam. The light sensor disposed between the prism and the digital micromirror device receives the portion of the illumination beam to generate a brightness data. The projection lens projects the image beam. The controller dynamically adjusts the setting current to calibrate a color point of the light beam according to the brightness data.

Abstract: A lens structure includes a lens barrel, a frame, a first lens module, a second lens module, and an elastic sleeve. The frame leans against a rear end of the lens barrel. A first gap is provided between the lens barrel and the frame. The first lens module includes a first side exposed outside the lens barrel and a second side arranged in a front end of the lens barrel. A second gap is provided between the lens barrel and the first lens module. The second lens module includes a third side arranged in the rear end of the lens barrel and a fourth side exposed outside the frame. The elastic sleeve sleeved on the lens barrel includes a first end extending to the frame to completely cover the first gap and a second end extending to a portion of the first lens module to completely cover the second gap.

Abstract: A lens structure includes a lens barrel, a frame, a first lens module, a second lens module, and an elastic sleeve. The frame leans against a rear end of the lens barrel. A first gap is provided between the lens barrel and the frame. The first lens module includes a first side exposed outside the lens barrel and a second side arranged in a front end of the lens barrel. A second gap is provided between the lens barrel and the first lens module. The second lens module includes a third side arranged in the rear end of the lens barrel and a fourth side exposed outside the frame. The elastic sleeve sleeved on the lens barrel includes a first end extending to the frame to completely cover the first gap and a second end extending to a portion of the first lens module to completely cover the second gap.

Abstract: An input/output module comprises a module body, a circuit board, and an input/output port. The circuit board is coupled to the module body and has a first surface and a second surface. A second connection portion is disposed on the second surface and electrically connected to a mobile electronic device body. The input/output port is disposed on the first surface and electrically connected to the second connection portion. The input/output port has an insertion end corresponding in position to an opening of the module body and connected to an external transmission connector. Further provided is a mobile electronic device having an input/output module, wherein the input/output module is replaceable such that the mobile electronic device has a transmission interface function and is expandable in applicability.

Abstract: A backup battery charger charges a backup battery of a handheld electronic device. The handheld electronic device comprises a power supply unit and an electronic component. The power supply unit supplies a power to the electronic component. The backup battery charger is connected to the electronic component, such that the backup battery charger shares with the electronic component the power, uses the power as a charging power, and controllably determines via a control module whether to supply the charging power to the backup battery.

Abstract: A printed circuit board grounding structure for use with a communication apparatus is configured for use with a printed circuit board to contact a grounded casing and thereby form a grounded circuit capable of electromagnetic wave shielding. The printed circuit board ground structure includes a copper conductive layer and a plurality of solder contacts. The copper conductive layer is circumferentially disposed along the periphery of the printed circuit board. The solder contacts are disposed on the copper conductive layer and used for electrically contacting with the casing. The printed circuit board grounding structure prevents deterioration of electromagnetic wave shielding despite oxidation of the copper conductive layer. The circumferentially-disposed copper conductive layer blocks electromagnetic wave generated from inside the printed circuit board, prevents leakage of the electromagnetic wave, and ultimately prevents the electromagnetic wave from interfering with other electronic apparatuses.

Abstract: A charging method and a charging system are introduced for controlling a charging current by a PWM method. A charging IC is controlled to supply the charging current to a battery, and a control unit is used to generate a PWM signal with a duty cycle, and a filter unit is used to convert the PWM signal into a voltage signal to be supplied to the charging IC, and the control unit determines whether a current of a battery detected by the battery status detection unit reaches a regular current, so that a PWM signal with a duty cycle greater than the previous duty cycle by a default increased cycle is provided if the detected current has not reached the regular current. Thus, the feature of the PWM signal is used to set the charging current according to the capacity of the battery automatically.

Abstract: It is a snap-engagement structure whereby a mother body and a daughter body of a portable electronic device are snap-engaged with each other and thereby fixed to each other. The mother body includes two installation units. The snap-engagement structure includes a key unit, fastening units, and a first restoring unit. The key unit and the fastening units move relative to each other in different directions to effectuate enhanced snap-engagement, watertightness, and miniaturization.

Abstract: A system and a method for controlling access at a user end are disclosed. The correlation between a tag signal of a femtocell access point and a tag signal of a fixed internet device is established, such that when the femtocell access point would access internet via the fixed internet device, a tag signal of the femtocell access point and a tag signal of the fixed internet device are acquired, so as to determine whether the tag signal of the femtocell access point and the tag signal of the fixed internet device match the correlation in the data bank. When the tag signal of the femtocell access point and the tag signal of the fixed internet device match the correlation, the femtocell access point is allowed to provide access services. The present invention provides an effective mechanism for controlling access at a user end.

Abstract: A film pasting device and method for pasting a circuit board and a dome array together are disclosed. The device includes: a carrier having at least a suction hole, a support member connected to the carrier and having a plurality of air holes, a suction member connected to the carrier, and a first positioning member disposed on the carrier. The film pasting device includes: positioning the dome array, providing a suction force for sucking the dome array so as to evenly dispose the dome array, disposing the circuit board on the dome array, and providing a pressing force to press the circuit board to the dome array. Therefore, the present invention overcomes the conventional difficulty of aligning the dome array with the circuit board, thereby improving the product yield.